Principal R&D/Product DVL Engineer

Responsibilities:

• Subject matter expert in signal integrity design, simulation and validation activities through product development cycles
• Establishing signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers 
• Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
• Driving product development for business success
• Engaging in innovative simulation and test tool improvement and process enhancement
• Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint.
• Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences.
• Being an expert in analyzing competitive products and driving internal & competing IP positions

Requirements:

• Bachelor’s degree in Electrical Engineering; Master's Degree preferred
• Minimum of 10 years of relevant work experience in electrical Design, RF design or PCB design
• A solid understanding of electromagnetic theory and electrical circuit behavior
• Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
• Expert with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
• Expert with high-speed test equipment (VNA, TDR, BERT)
• Expert with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.
• Expert with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces
• Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
• Experience with physical layer communications systems and architectures.
• Fluent in English (both verbal and written)
• Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
• Expert in analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
• Learning Capability: Open minded, coachable, willing to learn new skills, and motivated to grow
• Pro-active in identifying complex situations, providing solutions, and driving improvements to evolving procedures
• Experience writing technical papers and presenting to BU-level organizations, external conferences, and critical customer contacts
• Proficient at owning project SI responsibilities and driving team actions across multi-discipline engineering & manufacturing teams

Nice to Have Skills/Experience:

•  Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system
• Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems)
• Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English
• Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction.
• Six Sigma methodologies or other strong data analytics background.
• Printed circuit board design, fabrication and assembly (Altium, AutoCAD)
• Experience in project leadership, especially as it applies across design, development & manufacturing teams
• Test equipment (oscilloscope, vector network analyzer, BERT)
• Signal conditioning techniques (equalization, amplification)
• Direct customer design and support experience
• Application and test knowledge of high-speed devices and equalization techniques