Engineer, Staff/Manager (Wet Etch / Electroplating)

Our client operates in the Telecoms Equipment Semiconductors Industry, with its headquarters rooted strongly in the United States. It has branches spread to more than 30 countries, providing employment to more than 45,000 people all over the world. They fall in the Fortune 500 Companies. Their core business is designing and manufacturing semiconductors. They believe in driving digital transformation.

Responsibilities:

• Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes
• Manage and develop a team of engineers and technicians in a high volume manufacturing environment
• Drive excellence in output, quality, cost, equipment uptime, and safety
• Ensure robust process control, stability, and integration across wet etch and plating operations
• Lead root cause investigations for process, quality, and equipment issues and drive permanent corrective actions
• Drive yield improvement, scrap reduction, and defect reduction through data driven analysis
• Ensure high equipment availability and reliability, particularly for wet benches and plating tools
• Apply and sustain SPC and statistical analysis tools to monitor and improve process performance
• Actively contribute to continuous improvement programs to resolve chronic manufacturing or quality issues
• Work closely with cross functional teams including Process Integration, Equipment, Quality, and Manufacturing
• Provide technical and operational leadership during crisis situations impacting fab operations
• Ensure strict compliance with EHS requirements, quality systems, cleanroom discipline, and wafer fab protocols

Requirements:

• Bachelor’s degree in Engineering, Chemistry, Materials Science, Physics, or related discipline
• Minimum 10 years of relevant experience in semiconductor wafer fabrication
• Strong hands on technical expertise in Wet Etch, Electroplating, and related wet processes
• Prior experience in high volume semiconductor manufacturing within an MNC environment
• Strong understanding of:
• Process integration
• Statistical Process Control (SPC)
• Yield improvement and scrap reduction methodologies
• Equipment maintenance strategies for wet benches and plating tools
• Proven people management experience, including coaching, talent development, succession planning, and manpower deployment
• Demonstrated ability to lead root cause analysis and corrective action implementation
• Strong sense of ownership with the ability to work effectively under pressure
• Hands on leadership style with strong problem solving and decision making capabilities
• Excellent communication and cross functional collaboration skills
• Familiarity with statistical analysis tools, Excel, PowerPoint, and Word
• Strong commitment to Environmental Health & Safety (EHS), quality systems, and fab compliance