Principal/Staff Engineer - Process Development, CVD/Diffusion

Our client is a global technology leader specializing in advanced memory and storage solutions that power next-generation computing and data-driven applications. With strong expertise in semiconductor innovation, the organization develops high-performance memory technologies across DRAM, NAND, and storage platforms for applications spanning data centers, artificial intelligence, mobile devices, client computing, and intelligent edge ecosystems.

Driven by a commitment to technology advancement, operational excellence, and customer-centric innovation, the company plays a significant role in enabling modern digital infrastructure and compute-intensive workloads worldwide.

Responsibilities:

• Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices
• Evaluate innovative process and equipment solutions for early experimentation and process margin improvement
• Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges
• Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement
• Partner with Boise TD Films teams to align future device requirements with process capabilities
• Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams
• Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation
• Design and execute experiments to expand process margins and validate manufacturability of next-node solutions
• Lead cross-functional initiatives to simplify processes and implement improvements
• Embed best-known manufacturing practices into early-stage development of new nodes
• Develop and apply advanced process monitoring and control methodologies.
• Serve as a technical expert, contributing to process, equipment, and procedural improvements
• Lead multidisciplinary projects across teams, sites, and suppliers focused on quality, yield, cost, and productivity
• Advise management on significant technical issues and drive innovation through patents and technical publications
• Maintain strict adherence to our client Intellectual Property protection policies
• Engage continuously with global TD partners and suppliers to push for breakthrough solutions
• Own and manage module-level business processes

Requirements:

• Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 5 years of relevant experience or PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics

Strong understanding of:

• Flow dynamics, thermodynamics, and physical phenomena in deposition
• Precursor depletion effects in 3D structures and mitigation strategies
• Interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)
• Integration and structural constraints in film deposition processes
• Memory process flows, especially for planar and vertical NAND
• Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)
• Excellent communication skills for both in-person and remote interactions
• Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment