Senior SAP CO Consultant

Senior IT Engineer

Product Integration Lead, HIG High Bandwidth Memory

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health)

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

HIG HBM PE Principal Component Validation Engineer

BI & Data Manager

Planning and Control Planner

Responsibilities: <ul><li>Strategic Execution: Orchestrate end-to-end SAP CO solution design to meet global finance requirements, while fostering strategic alignment with upstream and downstream IT workstreams to ensure holistic aligned solution.</li><li>Analytical Expertise: Apply deep analytical skills to evaluate complex business requirements, modeling gaps and data into sound architecture E2E solutions across a multi-workstream and multi-region transformation programme.</li><li>Clear communication: Translates complex SAP CO technical concepts into business-friendly language, ensuring stakeholders share a clear and common understanding.</li><li>Collaborative Teamwork: Partner with Finance, Accounting Shared Service, Supply chain functions, manufacturing, and IT teams across Europe, India, APAC to ensure seamless integration of SAP solutions and business processes</li><li>Coaching &amp; Development: Actively pursues personal growth by seeking feedback and embracing learning opportunities, while providing leadership and coaching to team members on complex SAP/Non-SAP topics. Aligns team technical and professional development with broader organizational goals to build sustainable internal capability.</li></ul> Requirements: <ul><li>3+ years of IT-related work experience with a Bachelors degree or 5+ years of IT-related work experience without a Bachelor’s degree.</li></ul> Functional Knowledge: Apply proficient SAP CO knowledge with a strong emphasis on: <ul><li>SAP S/4 HANA Universal Journal (ACDOCA), Fiori apps</li><li>Product costing in cost estimates, cost variants both in legal and group valuation</li><li>Material Ledger actual costing</li><li>Revenue accounting in context of intercompany sales</li></ul>

Responsibilities:&nbsp; <ul><li>Support the implementation and enhancement of Enterprise Datahub using Databricks, ensuring seamless integration with existing BI and ERP systems.</li><li>Support complex BI and data platform initiatives while maintaining quality, delivery timelines, and alignment with organizational goals.</li><li>Collaborate with business stakeholders, architects, developers, and analysts to translate requirements into solutions.</li><li>Design, implement, test, and optimize moderately complex data pipelines, ETL/ELT flows, semantic layers, and report solutions with the development team.</li><li>Apply technical knowledge and AI-driven optimization opportunities to improve data quality, validation, reliability, and operational efficiency across supported solutions.</li><li>Develop new and impactful ideas, approaches, and automation opportunities that improve the platform, processes, and user experience.</li><li>Communicates moderately complex information clearly, accurately, and in a timely manner, adapting the message to the audience.</li></ul> Requirements: <ul><li>Degree in Business Informatics, Information Technology, Data Engineering/Analytics, Engineering, or a related field.</li><li>Proven experience in data engineering, application support, BI analytics, or related technical roles.</li><li>Strong expertise in Databricks, GitHub, dbt, ETL, Tableau, Power BI, and SQL.</li><li>Familiarity with Generative AI tools (e.g., Copilot, LLM-based assistants) to enhance productivity, development, and documentation.</li><li>Ability to analyze moderately complex problems independently and drive resolution with minimal supervision.</li><li>Strong stakeholder management, teamwork, and clear written and verbal communication skills.</li><li>Experience contributing to technical improvements, process optimization, and operational quality.Proficiency in English, both written and spoken.</li></ul>

Responsibilities: <ul><li>Manage technical inputs and drive silicon-to-system alignment using the Success Criteria Document (SCD).</li><li>Collaborate with HBM Architecture, Product Engineering, Systems Engineering, Business Units, Technology Development, Packaging, and Global Quality teams.</li><li>Identify and resolve gaps between HBM product capabilities and system requirements.</li><li>Manage HBM sample planning and delivery aligned with customer and system development timelines.</li><li>Lead technical triage for System and Chip Feature Interaction issues, driving ownership and mitigation plans.</li><li>Manage qualification definitions and late/post-qualification changes through the Change Control Board.</li><li>Drive technical issue resolution while balancing development schedules, risks, and costs.</li><li>Communicate development priorities across HBM teams to ensure system specification compliance.</li></ul> Requirements: <ul><li>Bachelors or Masters Degree in Electrical Engineering or Computer Engineering.</li><li>10+ years of experience in Product Engineering, Design Engineering, Yield Enhancement, or related semiconductor engineering disciplines.</li><li>Experience leading product development projects is highly desirable.</li><li>Strong ability to lead complex technical issues to closure through cross-functional collaboration.</li><li>Knowledge of HBM, DRAM devices, semiconductor product development, and system architecture is preferred.</li><li>Excellent communication, stakeholder management, presentation, and technical leadership skills.</li></ul>

Responsibilities: <ul><li>Lead Media Health Manufacturing activities for DRAM, Interface Die, and stacked HBM products.</li><li>Optimize manufacturing test coverage for current and future HBM architectures and process nodes.</li><li>Develop, validate, characterize, and qualify next-generation HBM products.</li><li>Support design verification and circuit debug using CAD tools and Verilog simulations.</li><li>Improve manufacturing yield, reduce test time, and optimize device reliability.</li><li>Drive root-cause analysis and resolution of manufacturing test flow, qualification, and RMA issues.</li><li>Promote innovation in Design-for-Test (DFT), manufacturing strategy, and test optimization.</li><li>Mentor engineers and develop technical and project management capabilities within the team.</li><li>Lead technical decision-making, risk analysis, and project prioritization.</li><li>Collaborate with Fab, HBM Technology Development, Design, System Development, Test Solution Engineering, and Quality/Reliability teams.</li></ul> Requirements: <ul><li>Bachelors or Masters Degree in Electrical &amp; Electronics Engineering.</li><li>8+ years of semiconductor industry experience with Product Engineering experience preferred.</li><li>Strong leadership, circuit analysis, and root-cause problem-solving skills.</li><li>Knowledge of statistics, scripting, and data analysis tools.</li><li>Ability to adapt to technical leadership and people leadership responsibilities.</li><li>Proven collaboration across cross-functional engineering organizations.</li><li>Strong accountability, communication, and presentation skills.</li><li>Passion for mentoring and developing engineering talent.</li><li>Willingness to work onsite in Singapore and travel internationally (US, Taiwan, Japan).</li></ul>

Responsibilities: <ul><li>Develop and enable advanced package technologies for post-fab wafer finish and assembly processes.</li><li>Improve product quality, yield, productivity, and manufacturing cost.</li><li>Partner with process and product engineering teams to integrate semiconductor technologies.</li><li>Drive yield improvements through package integration innovation, layout optimization, design improvements, and process margin enhancement.</li><li>Collect and analyze data to support design, layout, and integration flow decisions.</li><li>Collaborate with Probe, Yield Analysis, Test, Product Engineering, PWF Engineering, Assembly Engineering, Front-End Wafer Fab, Assembly/Test Engineering, and Global Quality teams.</li><li>Ensure robust quality through process monitoring, inspection, testing, SPC, DOE, and defect analysis.</li><li>Support product transition from development through qualification into High Volume Manufacturing (HVM).</li><li>Provide Process of Record (POR) and Model of Record (MOR) documentation.</li></ul> Requirements: <ul><li>B.S./M.S./Ph.D. (or equivalent) in Electrical, Mechanical, Chemical Engineering, Physics, Materials Science, or related discipline.</li><li>2+ years of semiconductor process integration experience, preferably in advanced packaging, post-fab wafer finishing, or assembly processes.</li><li>Proficiency in Python, R, and SQL.</li><li>Experience with Visual Basic.</li><li>Knowledge of E3, FDC, and RMS (Recipe Management System).</li><li>Strong statistical analysis, process modeling, SPC, DOE, defect analysis, and dashboarding skills.</li><li>Strong understanding of semiconductor process flows and integration.</li><li>Strong root-cause analysis and complex problem-solving capability.</li><li>Ability to work under tight timelines and limited resources.</li></ul>

Responsibilities: <ul><li>Develop wafer-level process technologies including wafer thinning and backside metal interconnect.</li><li>Improve process capability, yield, and manufacturing cost.</li><li>Establish process management projects supporting future technology nodes.</li><li>Evaluate, qualify, and implement new equipment and materials.</li><li>Set process parameters for semiconductor manufacturing equipment.</li><li>Drive process quality through inspection, testing, measurement, SPC, DOE, and defect analysis.</li><li>Develop advanced process controls using data analytics.</li><li>Collaborate with Package Integration, Assembly Engineering, Front-End Wafer Fab, Product Engineering, Assembly/Test Engineering, and Global Quality teams.</li><li>Support product transfer from development through qualification to High Volume Manufacturing (HVM).</li><li>Provide Process of Record (POR) and Model of Record (MOR) documentation.</li></ul> Requirements: <ul><li>B.S./M.S./Ph.D. (or equivalent) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical discipline.</li><li>2+ years of semiconductor process development experience, preferably in wafer bonding, plating, warpage control, or advanced packaging.</li><li>Proficiency in Python, R, and SQL.</li><li>Experience with Visual Basic.</li><li>Knowledge of E3, FDC (Fault Detection &amp; Classification), and RMS (Recipe Management System).</li><li>Strong statistical analysis, process modeling, SPC, DOE, and dashboard development skills.</li><li>Strong understanding of semiconductor process interactions, yield, performance, and reliability.</li><li>Excellent problem-solving and root-cause analysis capability.</li><li>Ability to deliver results under aggressive timelines and limited resources.</li></ul>

Responsibilities: <ul><li>Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging, Chip-on-Wafer (CoW), and Chip-to-Wafer (C2W) die stacking.</li><li>Improve product quality, yield, productivity, and manufacturing cost.</li><li>Drive process management projects supporting future technology nodes.</li><li>Evaluate, qualify, and implement new equipment and materials.</li><li>Establish process parameters for semiconductor manufacturing equipment.</li><li>Ensure robust quality through process monitoring, inspection, testing, SPC, DOE, and defect analysis.</li><li>Use data analytics to establish advanced process controls and identify improvement opportunities.</li><li>Collaborate with Package Integration, Assembly Engineering, Front-End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality teams.</li><li>Support seamless transition from product development through qualification into High Volume Manufacturing (HVM).</li><li>Provide Process of Record (POR) and Model of Record (MOR) documentation.</li></ul> Requirements: <ul><li>B.S./M.S./Ph.D. (or equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical discipline.</li><li>2+ years of semiconductor process development or equipment evaluation experience, preferably in wafer bonding, die stacking, or advanced packaging.</li><li>Proficiency in Python, R, and SQL.</li><li>Experience with Visual Basic for automation and tool integration.</li><li>Knowledge of E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System).</li><li>Strong data analytics capability supporting SPC, DOE, defect analysis, and dashboards.</li><li>Strong understanding of semiconductor process flows, yield, performance, and reliability.</li><li>Strong problem-solving and root-cause analysis skills.</li><li>Ability to work effectively under aggressive timelines and limited resources.</li></ul>

Responsibilities: <ul><li>Coordinate with internal and external teams to prepare silicon validation activities.</li><li>Partner with manufacturing teams to ensure required resources are available.</li><li>Identify, evaluate, and validate HBM Component Validation equipment and testing flows.</li><li>Ensure silicon performance meets product expectations.</li><li>Debug failures, identify root causes, and implement design or process fixes.</li><li>Collaborate with Design Validation (DV), Quality Assurance (QA), and Global Quality (GQ) teams on customer returns and reliability improvements.</li><li>Partner with Engineering, Manufacturing, and Marketing organizations.</li><li>Develop, troubleshoot, and validate HBM component validation test programs.</li><li>Review datasheets and provide feedback to Application Engineers.</li><li>Prioritize activities across multiple cross-functional teams.</li><li>Provide technical leadership, mentoring, and On-the-Job Training (OJT) for engineers.</li><li>Support technical presentations, seminars, and product-specific expertise</li></ul> Requirements: <ul><li>Bachelors or Masters Degree with a minimum of 10 years of experience, preferably within the memory semiconductor industry.</li><li>Strong programming experience with Linux, Python, C/C++, Verilog, UVM, and version control systems (Git, SVN).</li><li>Excellent analytical, debugging, and problem-solving skills.</li><li>Strong communication, presentation, and data analytics capabilities.</li><li>Basic understanding of HBM and/or DRAM operation and computer networking.</li><li>Self-motivated with the ability to work effectively in collaborative team environments</li></ul>

Responsibilities: Data Engineering &amp; Platform Development: <ul><li>Design, build and optimise enterprise data platforms using Microsoft Fabric (Lakehouse, Data Factory, Warehouse and Real-Time Analytics).</li><li>Develop scalable ETL/ELT pipelines supporting both batch and real-time data processing.</li><li>Optimise data storage, transformation and query performance across enterprise platforms.</li><li>Build reusable semantic models and scalable data products supporting enterprise analytics.</li></ul> Business Intelligence &amp; Analytics: <ul><li>Develop enterprise reporting and dashboard solutions using Power BI, Power Query, SQL and DAX.</li><li>Translate complex business requirements into scalable technical data solutions.</li><li>Enable self-service analytics while maintaining strong governance and platform performance.</li><li>Leverage Python where required for advanced analytics and data manipulation.</li></ul> Data Architecture &amp; Governance: <ul><li>Design scalable enterprise data models using modern architecture principles.</li><li>Drive enterprise-wide data governance, master data management, and data quality initiatives.</li><li>Implement data lineage, cataloguing, security, and regulatory compliance standards.</li><li>Establish best practices around data standards, access control, and governance.</li></ul> Technical Leadership: <ul><li>Lead and mentor a team of BI Developers and Data Engineers while remaining hands-on.</li><li>Own end-to-end delivery of enterprise data solutions from design through deployment and optimisation.</li><li>Conduct technical reviews and establish engineering best practices.</li><li>Collaborate closely with IT, Manufacturing, Operations, and business stakeholders to deliver scalable enterprise solutions.</li></ul> Requiremnents: <ul><li>8+ years of experience in Data Engineering, Enterprise Data Platforms or Business Intelligence.</li><li>Strong hands-on expertise with Microsoft Fabric (mandatory).</li><li>Proven experience working with SAP CDS Views, ideally within SAP S/4HANA environments (mandatory).</li><li>Experience integrating SAP with Manufacturing Execution Systems (MES) and other enterprise applications.</li><li>Strong manufacturing industry experience.</li><li>Advanced SQL, data modelling, and Power BI expertise.</li><li>Experience with Azure-based data platforms and modern Data Engineering practices.</li><li>Experience leading technical teams while remaining actively involved in solution design and development.</li><li>Excellent stakeholder management, communication, and problem-solving skills.</li></ul>

Responsibilities: <ul><li>Employees must specialize in planning activities involving production control, inventory control, process control, shop floor control, and Material Resources Planning (MRP) integrity.</li><li>Maintain SAP Production Order release schedules to ensure material is available on time for manufacturing and engineering.</li><li>Reschedule and/or TECO work orders as required to support production priorities.</li><li>Improve component availability at the time of release by performing pre-shortage analysis.</li><li>Perform work order variance analysis and recommend corrective actions.</li><li>Review MRP execution to ensure data accuracy, reconcile supply and demand, and validate master scheduling and PDS requirements.</li><li>Review and ensure proper disposition of Engineering Change Orders (ECOs) and Engineering Change Requests (ECRs); prepare status reports for all active ECOs/ECRs.</li><li>Participate in floor audits with Finance and resolve Work-in-Progress (WIP) issues.</li><li>Attend production meetings and provide updates on material shortages and committed delivery dates.</li><li>Collaborate with engineering teams to manage materials for special engineering projects.</li><li>Support work centers with shop floor control activities as needed.</li><li>Analyze inventory usage and stock levels to maintain target inventory and meet service level requirements.</li><li>Expedite material shortages and forecast spare parts requirements where applicable.</li><li>Investigate material variances, resolve operational issues, and escalate complex problems to management.</li><li>Support the implementation or enhancement of inventory management systems and assign expediting activities where required.</li><li>Manage obsolete inventory and recommend disposition strategies.</li><li>Participate in process improvement initiatives by identifying root causes through PCI reporting and driving corrective actions.</li><li>Support cycle counting activities to maintain inventory accuracy.</li><li>Perform data analysis, forecasting, and ad hoc statistical analysis using structured and unstructured data sources.</li><li>Develop dashboards and visualizations using Tableau to support business decision-making.</li><li>Work closely with business stakeholders to gather requirements and translate data into actionable insights using Python, SQL, or equivalent analytical tools.</li><li>Serve as a subject matter expert on project teams for data consolidation, reporting, and process improvement initiatives.</li></ul> Requirements: <ul><li>Experience: 3–7 years.</li><li>Role Level: B2/B3 Individual Contributor (IC).</li><li>Strong English communication is essential. </li><li>Candidates must demonstrate ability to communicate effectively with multiple stakeholders.&nbsp;</li></ul>

Skills

Industry

Location

Jobtitle

56 singapore Jobs found

Senior SAP CO Consultant

Senior IT Engineer

Product Integration Lead, HIG High Bandwidth Memory

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health)

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

HIG HBM PE Principal Component Validation Engineer

BI & Data Manager

Planning and Control Planner

WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.

EMPLOYER

TALENT

COMPANY

Contact Us

JOBS BY SKILLS

JOBS BY FUNCTION

JOBS BY INDUSTRY

JOBS BY LOCATIONS

MODEL JOBS

JOBS BY CITY

Skills

Industry

Location

Jobtitle

56 singapore Jobs found

Senior SAP CO Consultant

Senior IT Engineer

Product Integration Lead, HIG High Bandwidth Memory

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health)

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

HIG HBM PE Principal Component Validation Engineer

BI & Data Manager

Planning and Control Planner

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

EMPLOYER

TALENT

COMPANY

Contact Us

JOBS BY SKILLS

JOBS BY FUNCTION

JOBS BY INDUSTRY

JOBS BY LOCATIONS

MODEL JOBS

JOBS BY CITY

WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.