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Skills

stakeholder management
product development
python
advanced packaging
advanced semiconductor packaging
application engineering
quality control
six sigma
technical skills
visual basic

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Location

singapore, singapore
perai, malaysia
chennai, india
dubai, united arab emirates
shanghai, china
suzhou, china
aachen, germany
bangkok, thailand
bengaluru, india
greensboro, united states

Jobtitle

account executive
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
125112 vision system engineer
127217 senior quality & reliability engineer
amea gbs operational excellence lead
associate director ra & qa
business strategy analyst
ceo / managing director, bulk & corridors

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54 8d discipline Jobs found

1-10 of 54
I

Dubai, United Arab Emirates

I

Corporate FinanceFinanceInvestment BankingInfrastructureFinancial Modeling
M

Aachen, Germany

M

Leadership & Cross Functional SkillsMarket & Business StrategyCommercial & Sales SkillsSpecialty ApplicationsSustainability & EnergyFood Service & Refrigeration Expertise
M

Aachen, Germany

M

Leadership & Cross-Functional SkillsCommercial & Sales SkillsMarket & Business StrategyRefrigeration & Cold Chain KnowledgeFood Retail ExpertiseSustainability & Energy
D

Dubai, United Arab Emirates

D

Change ManagementStakeholder ManagementComplex Project ManagementProject DeliveryBudgetingCompliance & Regulatory ManagementPMO & Governance
C

Bac Ninh Province, Vietnam

C

Six Sigma8DQualityFailure AnalysisReliability EngineeringCustomer Interface
T

London, United Kingdom

T

Business DevelopmentChannel SalesRefrigerationTechnical SalesTechnical QualificationsHvacApplication Engineering

Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer

Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
V

Hyderabad, India

V

DevOpsDistributed SystemsNextJSReal People ManagementTypeScriptTechnical DepthMicro Frotends