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Skills
python
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javascript
advanced packaging
advanced semiconductor packaging
aws
azure
data analysis
data modeling
Industry
logistics and supply chain
Location
bengaluru, india
chennai, india
singapore, singapore
kuala lumpur, malaysia
mexico city, mexico
raleigh, united states
hyderabad, india
batu kawan, malaysia
bridgewater, united states
fairview, united states
Jobtitle
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
software engineer
application development and maintenance manager (payment), core banking (vp 2)
applications developer
associate data engineer
avp, digital analytics
bi & data manager
consultant, data analytics & reporting-food
Filter
58 azure sql Jobs found
1-10 of 58
S
Software Engineer – Ag & Trade
16 days ago
S
REST APIDockerSoftware DevelopmentFull Stack DevelopmentJava Spring BootJavascriptProduction Developing
Stakeholder ManagementAI GovernanceEnterprise AnalyticsMachine Learning OperationsPythonSQLDocker and KubernetesPredictive Analytics
Q
Quality Assurance (QA) Associate
20 days ago
Q
Documentation SkillsRequirements AnalysisDefect Tracking & Bug ReportingQuality AssuranceManual TestingJIRATime ManagementAzure DevOps
T
Test Infrastructure Platform Lead (MTest)
23 days ago
T
Linux ServerApache WebServerPeople ManagementService ManagementTest InfrastructureWindows ServerSQL Server
P
Product Engineer/Senior - FDC/R2R
a month ago
P
SQLData & IntegrationDevOps & Cloud SkillsUnit TestingTest AutomationFinance & Record-to-ReportERP & Financial SystemsProduct EngineeringJava
Problem ManagementSecure SDLCProduction SupportTesting & Quality AssuranceDevOps & CI/CDApplication DevelopmentCloud TechnologiesDatabase TechnologiesCore Banking & Payments Skills
P
Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology
Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer
Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
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