Filters

Skills

python
sql
data analysis
quality control
product development
six sigma
troubleshooting
accounting
aws
cable assembly

Industry

wireless
financial services

Location

singapore, singapore
bengaluru, india
raleigh, united states
perai, malaysia
mexico city, mexico
batangas, philippines
chennai, india
chestnut ridge, united states
kuala lumpur, malaysia
bangkok, thailand

Jobtitle

director, data science
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
talent acquisition specialist
tax lead - ssea
125112 vision system engineer
accounts receivable (6 months contract)
associate data engineer
associate, quality assurance (qms)
ceo / managing director, bulk & corridors

Filter

85 machine learning statistical modeling Jobs found

1-10 of 85
I

Dubai, United Arab Emirates

I

Corporate FinanceFinanceInvestment BankingInfrastructureFinancial Modeling
E

Kuala Lumpur, Malaysia

E

Stakeholder ManagementAI GovernanceEnterprise AnalyticsMachine Learning OperationsPythonSQLDocker and KubernetesPredictive Analytics
S

Bengaluru, India

S

Documentation SkillsProject & Change ManagementSignavio SkillsProcess Improvement MethodologiesSAP KnowledgeBusiness Process ManagementData & Analytics
C

Bac Ninh Province, Vietnam

C

Six Sigma8DQualityFailure AnalysisReliability EngineeringCustomer Interface
S

Singapore, Singapore

S

Wafer ProcessEquipment MaintenanceHigh Volume ProductionStatistical SoftwareStrong Technical CompetencyPlasma AshingWafer Process Engineering
P

Singapore, Singapore

P

SQLData & IntegrationDevOps & Cloud SkillsUnit TestingTest AutomationFinance & Record-to-ReportERP & Financial SystemsProduct EngineeringJava
F

Kuala Lumpur, Malaysia

F

Account Payable And ReceivableData MappingRequirement AnalysisBudgetingAgile MethodologiesFinancial ReportingFund Transfer PricingForecasting
S

Perai, Malaysia

S

FMEADOEApqp MethodQuality ControlCable AssemblyNpi Management

Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer