Product Engineer/Senior - FDC/R2R

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health

Hybrid Bonding Technology Development Engineer - Wet Clean

Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Staff/Principal Engineer, NAND TD, RDA

Principal/Staff Engineer - Process Development, CVD/Diffusion

Responsibilities: <ul><li>Develop, maintain, and deploy FDC models to monitor equipment health, detect process faults, and identify abnormal tool or process behavior.&nbsp;</li><li>Design and implement R2R control solutions using feed-forward and feedback strategies to improve recipe control, metrology target achievement, and process stability.</li><li>Deploy, validate, standardize, and scale APC/FDC/R2R models and methodologies across production tools, processes. Collaborate with global teams to standardize APC methodologies across manufacturing sites.</li><li>Design and deploy predictive maintenance models to detect early signs of degradation, anomalies, and potential failures of tools.</li></ul> Requirements: <ul><li>Bachelor’s Degree in Computer Science or&nbsp;Electronic/Electrical Engineering, with preferably min. 2 years’ experience in semiconductor field</li><li>Experience deploying production FDC and/or R2R solutions is an added advantage</li><li>Excellent knowledge of applying manufacturing statistics, preferably in Semiconductor industry.</li><li>Foundational knowledge of machine learning models, algorithms, mathematics, and statistics is preferred.</li><li>Excellent knowledge of applying manufacturing statistics, preferably in Semiconductor industry.</li><li>Dynamic, initiative, resourceful, team player and highly self-motivated individual.</li><li>Strong organizational, leadership and interpersonal skills. (Senior/Staff)</li><li>Strong analytical mind. (Senior/Staff)</li></ul>

Responsibilities: <ul><li>Lead Media Health Manufacturing activities for DRAM, Interface Die, and stacked HBM products.</li><li>Optimize manufacturing test coverage for current and future HBM architectures and process nodes.</li><li>Develop, validate, characterize, and qualify next-generation HBM products.</li><li>Support design verification and circuit debug using CAD tools and Verilog simulations.</li><li>Improve manufacturing yield, reduce test time, and optimize device reliability.</li><li>Drive root-cause analysis and resolution of manufacturing test flow, qualification, and RMA issues.</li><li>Promote innovation in Design-for-Test (DFT), manufacturing strategy, and test optimization.</li><li>Mentor engineers and develop technical and project management capabilities within the team.</li><li>Lead technical decision-making, risk analysis, and project prioritization.</li><li>Collaborate with Fab, HBM Technology Development, Design, System Development, Test Solution Engineering, and Quality/Reliability teams.</li></ul> Requirements: <ul><li>Bachelors or Masters Degree in Electrical &amp; Electronics Engineering.</li><li>8+ years of semiconductor industry experience with Product Engineering experience preferred.</li><li>Strong leadership, circuit analysis, and root-cause problem-solving skills.</li><li>Knowledge of statistics, scripting, and data analysis tools.</li><li>Ability to adapt to technical leadership and people leadership responsibilities.</li><li>Proven collaboration across cross-functional engineering organizations.</li><li>Strong accountability, communication, and presentation skills.</li><li>Passion for mentoring and developing engineering talent.</li><li>Willingness to work onsite in Singapore and travel internationally (US, Taiwan, Japan).</li></ul>

Responsibilities: <ul><li>Design, collect data, analyze, and compile reports on difficult process engineering experiments. Measure film and surface properties, and interpret data.&nbsp;</li><li>Optimize process to push product performance to HW limit.</li><li>Generate innovative ideas to tackle challenges in hybrid bonding enablement. Guide engineering on prototyping. Perform hardware characterization on a variety of difficult systems.</li><li>Implement new technology, products, and analytical instrumentation.</li><li>Troubleshoot complex problems, perform root cause analysis, and resolve a variety of difficult process engineering issues.</li><li>Generate internal documentation for products, presentations, and technical reports.</li><li>Communicate and engage with customers to resolve complex process engineering issues or concerns, under limited supervision.</li><li>Identify, select, and partner with vendors and suppliers.</li><li>Serve as a resource for junior colleagues; lead project teams, as needed</li></ul> Requirements: <ul><li>Bachelor’s degree in a related field. Higher education is a bonus.</li><li>3-7 years of related experience .</li><li>Demonstrates conceptual and practical expertise in complex problem solving.</li><li>Innovative &amp; can think out of the box. Passionate on going through iterative process/hardware development testing &amp; learning cycles.</li></ul>

Responsibilities: <ul><li>Technical Expertise: Capable to provide manual cuts along with building skills for future automated FIB cuts&nbsp;</li><li>Analytical Skills: Strong data analysis and problem-solving abilities.</li><li>Equipment Management: Set up equipment, monitor stability, improve capability, and interact with vendor representatives for advanced functionality and application work.</li><li>Recipe Management: Write or modify equipment recipes to support the needs of the RDA area.</li><li>Tool Recovery: Perform basic and advanced recoveries of down tools for assigned workstations.</li><li>Software Upgrades: Drive software upgrades and improvements, working with internal and external vendors for implementation.</li><li>Tool Monitoring: Monitor tool qualification SPC charts for deviations, initiate tool repairs, and adjust limits as necessary.</li><li>Data Science skills: Apply scripting, coding, or programming for monitoring performance and capabilities of the inspection data</li><li>Data Analysis: Collect and analyze tool/process data to suggest ways to improve performance and efficiency.</li><li>Collaboration: Collaborate with vendors for escalation results on application issues and with Equipment Owners to identify long-term solutions to tool issues.</li><li>Communication: Excellent verbal and written communication skills for effective vendor and team interactions.</li><li>Project Management: Ability to manage multiple projects and priorities effectively.</li></ul> Requirements: Application Expertise:&nbsp;<ul><li>Deep technical expertise in Focused Ion Beam (FIB) operations, including advanced cross sectioning, milling optimization, and defect characterization</li><li>Strong proficiency in SEM imaging and interpretation for systematic/random defect identification</li></ul> Training and Mentoring:&nbsp;<ul><li>Proven experience in training and mentoring engineers and technicians</li></ul> Vendor Relations: <ul><li>Experience working with vendors for FIB/SEM equipment setup, troubleshooting, and upgrades &gt;3years</li></ul> Education:&nbsp;<ul><li>Bachelor’s or Masters Degree in Electrical Engineering, Chemical Engineering, Materials Science &amp; Engineering, or related field accepted</li></ul> Experience: <ul><li>More than 5 years semiconductor manufacturing experience in RDA/inspection recipe setup for defect analysis&nbsp;</li></ul>

Responsibilities: <ul><li>Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes.</li><li>Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects.</li><li>Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR).</li><li>Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions.</li><li>Architect inspection recipes and sampling strategies; optimize sensitivity, throughput, and cost of ownership.</li><li>Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield.</li><li>Influence supplier roadmaps; evaluate, qualify, and release next gen optical/e-beam inspection capabilities.</li><li>Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites.</li><li>Mentor, coach, and upskill engineers; develop succession plans and technical ladders within the RDA domain.</li><li>Champion safety and continuous improvement (CIP); drive kaizen/lean initiatives that improve cycle time and learning velocity.</li></ul> Requirements: <ul><li>Bachelor’s degree with 7+ years relevant semiconductor experience, or Master’s/PhD with 5+ years.</li><li>Minimum 3+ years hands-on RDA experience in semiconductor manufacturing or equipment engineering.</li><li>Demonstrated expertise in defect inspection, process monitoring, and yield learning.</li></ul> Technical Competencies <ul><li>Realtime Defect Analysis (RDA) systems and workflows.</li><li>Optical and e-beam inspection technologies.</li><li>Statistical data analysis, correlation development, and large dataset interpretation.</li><li>Semiconductor process integration and technology development.</li><li>Root cause analysis and systematic problem solving (e.g., 8D, DMAIC).</li><li>Leadership &amp; Behavioral Competencies</li><li>Recognized technical authority with the ability to influence without direct authority.</li><li>Strong mentoring and coaching mindset with proven talent development outcomes.</li><li>Clear, concise communication skills across technical and executive audiences.</li><li>Ownership-driven, execution-focused; comfortable operating in ambiguity.</li><li>Impact &amp; Success Measures</li><li>Reduced defect-related yield loss and faster learning cycles.</li><li>On-time qualification and adoption of next-generation inspection capabilities.</li><li>Uplift in organizational RDA skill depth and succession pipeline.</li><li>Alignment of inspection strategy and capability to future NAND nodes.</li></ul>

Responsibilities: <ul><li>Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices</li><li>Evaluate innovative process and equipment solutions for early experimentation and process margin improvement</li><li>Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges</li><li>Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement</li><li>Partner with Boise TD Films teams to align future device requirements with process capabilities</li><li>Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams</li><li>Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation</li><li>Design and execute experiments to expand process margins and validate manufacturability of next-node solutions</li><li>Lead cross-functional initiatives to simplify processes and implement improvements</li><li>Embed best-known manufacturing practices into early-stage development of new nodes</li><li>Develop and apply advanced process monitoring and control methodologies.</li><li>Serve as a technical expert, contributing to process, equipment, and procedural improvements</li><li>Lead multidisciplinary projects across teams, sites, and suppliers focused on quality, yield, cost, and productivity</li><li>Advise management on significant technical issues and drive innovation through patents and technical publications</li><li>Maintain strict adherence to our client Intellectual Property protection policies</li><li>Engage continuously with global TD partners and suppliers to push for breakthrough solutions</li><li>Own and manage module-level business processes</li></ul> Requirements: <ul><li>Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 5 years of relevant experience or PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics</li></ul> Strong understanding of: <ul><li>Flow dynamics, thermodynamics, and physical phenomena in deposition</li><li>Precursor depletion effects in 3D structures and mitigation strategies</li><li>Interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)</li><li>Integration and structural constraints in film deposition processes</li><li>Memory process flows, especially for planar and vertical NAND</li><li>Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)</li><li>Excellent communication skills for both in-person and remote interactions</li><li>Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment</li></ul>

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6 metrology characterization Jobs found

Product Engineer/Senior - FDC/R2R

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health

Hybrid Bonding Technology Development Engineer - Wet Clean

Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Staff/Principal Engineer, NAND TD, RDA

Principal/Staff Engineer - Process Development, CVD/Diffusion

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Product Engineer/Senior - FDC/R2R

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health

Hybrid Bonding Technology Development Engineer - Wet Clean

Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Staff/Principal Engineer, NAND TD, RDA

Principal/Staff Engineer - Process Development, CVD/Diffusion

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