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Skills
advanced semiconductor packaging
micro-bump & fine-pitch interconnects
advanced packaging integration
hybrid bonding
redistribution layer
underfill & encapsulation technologies
wafer bonding & hybrid bonding
wafer dicing & die singulation
Industry
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Location
singapore, singapore
Jobtitle
principal/senior engineer, aptd cem - advanced packaging integration engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
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2 microbump finepitch interconnects Jobs found
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Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer
Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
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