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Skills

python
sql
data & analytics
data analysis
java
power bi
stakeholder management
advanced packaging
advanced semiconductor packaging
c++

Industry

financial services
tobacco

Location

singapore, singapore
bengaluru, india
perai, malaysia
dubai, united arab emirates
gurgaon, india
alabang, philippines
batu kawan, malaysia
hyderabad, india
kuala lumpur, malaysia
accra, ghana

Jobtitle

principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
accounts receivable (6 months contract)
amea gbs operational excellence lead
associate data engineer
avp, digital analytics
bi & data manager
brand manager / senior brand manager dtc
business intelligence analyst
business unit head - pharma / pharma & medical device

Filter

59 predictive analytics Jobs found

1-10 of 59
S

Bengaluru, India

S

Business TransformationProblem SolvingMarket and Competitive AnalysisCorporate Strategy and Business PlanningAdvanced ExcelData Visualization
S

Dubai, United Arab Emirates

S

Customer ExperienceProject ManagementDigital TransformationManaging TeamDevelopingImplementing
E

Kuala Lumpur, Malaysia

E

Stakeholder ManagementAI GovernanceEnterprise AnalyticsMachine Learning OperationsPythonSQLDocker and KubernetesPredictive Analytics
S

Beverly, United States

S

Global Organizational DevelopmentEmployee RelationsSuccession PlanningWorkforce PlanningHrbpUnionized EnvironmentGlobal Talent DevelopmentTalent Development
S

Bengaluru, India

S

Documentation SkillsProject & Change ManagementSignavio SkillsProcess Improvement MethodologiesSAP KnowledgeBusiness Process ManagementData & Analytics
P

Singapore, Singapore

P

SQLData & IntegrationDevOps & Cloud SkillsUnit TestingTest AutomationFinance & Record-to-ReportERP & Financial SystemsProduct EngineeringJava
M

Perai, Malaysia

M

Preventative MaintenanceManufacturingEquipment Downtime AnalysisQuality ControlMaintenanceIndustrial Safety

Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology

Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
P

Singapore, Singapore

P

Computer ArchitectureStatistical AnalysisHBM Architecture and OperationTest Flow DevelopmentLoopbackValidation Coverage