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micro-bump & fine-pitch interconnects
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singapore, singapore
alabang, philippines
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beijing, china
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Jobtitle
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
cmp equipment engineer
customer engineer - c3
customer service specialist
dry etch principal engineer/ mts lead, process development, advance nand
engineer, staff/manager (wet etch / electroplating)
field service engineer
gps (global product support) engineer
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31 semiconductor Jobs found
1-10 of 31
P
Production Supervisor
24 days ago
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High Volume ProductionSemiconductorProduction PlanningManufacturing Process KnowledgeRoot Cause Analysis
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Product Engineer/Senior - FDC/R2R
a month ago
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SQLData & IntegrationDevOps & Cloud SkillsUnit TestingTest AutomationFinance & Record-to-ReportERP & Financial SystemsProduct EngineeringJava
P
Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology
Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer
Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
P
Test Coverage OptimizationDRAM Device Fundamentals and PhysicsHigh Bandwidth Memory (HBM) ArchitectureReliability CharacterizationReliability Risk AssessmentDefectivity Analysis
P
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Computer ArchitectureStatistical AnalysisHBM Architecture and OperationTest Flow DevelopmentLoopbackValidation Coverage
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SemiconductorProduct EngineeringProduct DevelopmentDesign EngineeringYield Enhancement
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ScriptingData AnalysisProduct EngineeringCircuit AnalysisStrong LeadershipRoot-Cause Analysis
DOEAdvanced PackagingWafer FabVisual BasicPython
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