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advanced semiconductor packaging
python
visual basic
micro-bump & fine-pitch interconnects
wafer fab
advanced packaging integration
assembly
automation & control knowledge
circuit analysis
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Location
singapore, singapore
batangas, philippines
Jobtitle
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
engineer, staff/manager (wet etch / electroplating)
environment health and safety engineer
operations manager
principal engineer/mts - member of technical staff, hig-hbm product system engineering (media health
principal engineer/mts - member of technical staff, hig-hbm product system engineering (media health)
senior process engineer, dry etch
staff facility engineering - electrical
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14 wafer dicing die singulation Jobs found
1-10 of 14
S
Senior Process Engineer, Dry Etch
24 days ago
S
Wafer ProcessEquipment MaintenanceHigh Volume ProductionStatistical SoftwareStrong Technical CompetencyPlasma AshingWafer Process Engineering
P
Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology
Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer
Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
P
Test Coverage OptimizationDRAM Device Fundamentals and PhysicsHigh Bandwidth Memory (HBM) ArchitectureReliability CharacterizationReliability Risk AssessmentDefectivity Analysis
P
ScriptingData AnalysisProduct EngineeringCircuit AnalysisStrong LeadershipRoot-Cause Analysis
DOEAdvanced PackagingWafer FabVisual BasicPython
P
Visual BasicRMSWarpage ControlPythonAdvanced PackagingWafer Bonding
PythonAdvanced PackagingSQLVisual BasicDie StackingEquipment Evaluation
E
E
Scrap ReductionWafer FabricationElectroplatingProcess IntegrationStatistical Process ControlYield Improvement
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