Sr. Manager – R&D/Product Development Engineering – PCB Design & Simulation

123106 Principal R&D/Product DVL Engineer

High Purity Specialist

Role Description: <ul><li>Sr. Manager is a senior engineering leader for high-speed PCB Design and Simulations.</li><li>They lead teams in designing, simulating, and validating high-performance high speed printed circuit boards for AI and Datacentre applications ensuring quality, performance, and manufacturability through strategic planning, technical guidance, and collaboration across cross-functional teams.</li><li>Responsibilities include team development, design and simulation strategy, project management, and continuous process improvement to meet deadlines, budget targets, and project performance goals.</li></ul> Responsibilities:&nbsp; <ul><li>Team Leadership &amp; Development: Lead, mentor, and develop teams of high-speed PCB design and simulation managers and engineers, focusing on their career growth and skill development.</li><li>Strategic Design and Simulation: Define and implement high speed design and simulation roadmaps, methodologies and best practices for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal analysis.</li><li>Cross-Functional Collaboration: Work closely with hardware, firmware, mechanical, and manufacturing teams to translate requirements into viable designs and resolve issues.</li><li>Project &amp; Resource Management: Oversee the management of multiple complex PCB design and simulation projects, ensuring they meet deadlines, budget requirements, and performance targets.</li><li>Technical Oversight: Provide technical guidance on PCB layout, schematic creation, and component selection, staying current with new technologies and design standards.</li><li>Design review and verifications: Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.</li><li>Continuous improvement: Drive innovation and improvement in high-speed PCB design and simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.</li><li>Quality and Validation: lead and drive accuracy in design and simulations, conduct design of experiments (DoE), plausibility check and sensitivity study of simulations, validate simulation results with experimental data, and design optimizations for first time right manufacturability (prototypes and mass production).</li></ul> Requirements: Candidate Desired Profile: <ul><li>Education: A bachelor’s degree in electrical or electronics engineering from a premier institute/university.</li><li>A master’s degree in a must</li><li>Experience: 17+ yrs extensive hands-on experience in high-speed PCB design and simulation with a proven track record of delivering complex projects.&nbsp;</li><li>Leadership: 8-10 years progressive leadership or management experience in leading and developing high-performing engineering teams. Experience in customer engagement and stakeholder management is essential.</li></ul> Technical Skills: <ul><li>Deep understanding of engineering principles for high-speed PCB design, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.</li><li>Deep understanding of PCB layout, schematic creation, routing, and manufacturability.&nbsp;</li><li>Expertise in high-speed PCB design tools such as Altium Designer, Allegro or PADS.&nbsp;</li><li>Expertise in high-speed PCB simulation tools for electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.</li><li>Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).&nbsp;</li></ul> Soft Skills: <ul><li>Proven abilities on inspiring leadership, team management, prioritisation, strategy and execution.</li><li>Experience in organizational development, and talent attraction/management/retention.</li><li>Promote and manage employee wellbeing and work-life balance.</li><li>Passion for Technology and scientific/engineering excellence.</li><li>Excellent problem-solving and analytical skills to resolve complex technical issues.</li><li>Strong in Technical Documentations, Report preparation and presentation</li><li>Strong verbal and written communication skills to articulate complex technical concepts to both technical and non-technical stakeholders.</li><li>Ability to work effectively in a fast-paced, collaborative global environment and global time zones.</li><li>Proficient using MS office software (Word, Excel, PPT, Outlook, MS Teams, etc.).</li></ul> What Your Background Should Look Like <ul><li>Generally requires Bachelors degree in appropriate field with 12 or more years of experience; or Masters with 10 or more years of experience; or PhD level with 6 or more years of experience; or local equivalent</li></ul>

Responsibilities:&nbsp;<ul><li>Subject matter expert in signal integrity design, simulation and validation activities through product development cycles</li><li>Establishing signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers&nbsp;</li><li>Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.</li><li>Driving product development for business success</li><li>Engaging in innovative simulation and test tool improvement and process enhancement</li><li>Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint.</li><li>Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences.</li><li>Being an expert in analyzing competitive products and driving internal &amp; competing IP positions</li></ul> Requirements:&nbsp;<ul><li>Bachelor’s degree in Electrical Engineering; Masters Degree preferred</li><li>Minimum of 10 years of relevant work experience in electrical Design, RF design or PCB design</li><li>A solid understanding of electromagnetic theory and electrical circuit behavior</li><li>Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)</li><li>Expert with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)</li><li>Expert with high-speed test equipment (VNA, TDR, BERT)</li><li>Expert with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.</li><li>Expert with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces</li><li>Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.</li><li>Experience with physical layer communications systems and architectures.</li><li>Fluent in English (both verbal and written)</li><li>Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.</li><li>Expert in analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.</li><li>Learning Capability: Open minded, coachable, willing to learn new skills, and motivated to grow</li><li>Pro-active in identifying complex situations, providing solutions, and driving improvements to evolving procedures</li><li>Experience writing technical papers and presenting to BU-level organizations, external conferences, and critical customer contacts</li><li>Proficient at owning project SI responsibilities and driving team actions across multi-discipline engineering &amp; manufacturing teams</li></ul>&nbsp;Nice to Have Skills/Experience: <ul><li>&nbsp;Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system</li><li>Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems)</li><li>Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English</li><li>Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction.</li><li>Six Sigma methodologies or other strong data analytics background.</li><li>Printed circuit board design, fabrication and assembly (Altium, AutoCAD)</li><li>Experience in project leadership, especially as it applies across design, development &amp; manufacturing teams</li><li>Test equipment (oscilloscope, vector network analyzer, BERT)</li><li>Signal conditioning techniques (equalization, amplification)</li><li>Direct customer design and support experience</li><li>Application and test knowledge of high-speed devices and equalization techniques</li></ul>

Responsibilities:Lead the Process Development for new machine and parts for Cleaning & Handling processes (Precision Cleaning, Fixture Design, Contamination Control, Pre-packaging, Inspection, etc.).Work together with NPI, Fixture Designer, CADCAM Programmer and Production to support new product development and proposal for DFMA (Design for Manufacturing and Assembly).Support NPI for new products feasibility study and provide Cleaning Process cycle time for costing purpose.Excellent in leading problem-solving skills: defining the problem, identifying objectives, assessing risk, developing approach, analyzing results, implement corrective actions and effectively communicate those actions to all required personnel.Implement industry standard process control techniques such as six sigma techniques to manage and develop production efficiencies and qualities.Initiate and conduct process review to improve Safety, Production Yield, Quality and Cycle time (Continuous Improvement, PFMEA).Work closely with counterparts from company (High Purity and Cleaning) for new Equipment, Process and System development for technological advancement.Conduct training for Production staffs in the use and applications of various machining and cleaning process techniques.Support daily task as given by Management.Requirements:Atleast 3 years in cleaning process (aqueous, precision cleaning, micro-contamination) which have intermediate or advanced knowledge on cleaning major element influencesDegree in Mechanical Engineering / Chemical Engineering / Material EngineeringKnowledge in contamination control and high purity cleaning processCandidate should at least understand to interpret RGA, GCMS, ICPMS, FTIR & LPC Lab analysis if at intermediate level in cleaning process Pro-active, Organized, good team leader or player and costumer-orientedStrong problem-solving skill (8D, 7QC, lean six sigma) and developing test such as DOE.Experienced in process control (SPC, PFMEA)Good in presentation and documentation on item related to engineering change and problem solvingStrong organization, time management, planning skills and ability to manage multiple tasks with tight deadlines.

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Sr. Manager – R&D/Product Development Engineering – PCB Design & Simulation

123106 Principal R&D/Product DVL Engineer

High Purity Specialist

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Sr. Manager – R&D/Product Development Engineering – PCB Design & Simulation

123106 Principal R&D/Product DVL Engineer

High Purity Specialist

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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