Technical Director, Advanced Packaging Integration

Director of Technology (Product Development)

Director, Advanced Packaging Disruptive Technology

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

Assistant Vice President - Principal Engineer

AVP, Principal Software Engineer (Senior Technical lead)

L3 Production Support (AS400, RPG), Core Banking

Responsibilities: <ul><li>Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies</li><li>Define, document, and implement end-to-end process flows for panel-level packaging technologies</li><li>Lead material selection, characterization, and compatibility assessments for large form factor substrates</li><li>Partner with customers to define and align process specifications and acceptance criteria</li><li>Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers</li><li>Contribute to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps</li><li>Analyze process data to identify trends, drive optimization, and improve performance</li><li>Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability</li><li>Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions</li><li>Publish and present technical findings at leading industry conferences and in peer-reviewed journals</li><li>Mentor and guide early-career engineers; provide technical direction and best practices</li></ul> Requirements: <ul><li>Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field</li><li>In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows</li><li>Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level</li><li>Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs</li><li>Proficiency in statistical data analysis (e.g. DoE, JMP)</li><li>Knowledge of industry standards and best practices in semiconductor packaging</li><li>Solid understanding of process characterization, metrology, materials &amp; failure analysis</li><li>Working knowledge of reliability requirements and qualification methodologies</li><li>Proven capability to lead multi-functional teams to resolve complex technical problems</li><li>Exceptional written and verbal communication skills</li><li>Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts</li><li>Drive structured technical discussions with customers and suppliers</li><li>Articulate positions, influence decisions, and align technical direction</li><li>Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications</li><li>Ability to work effectively across geographies and time zones</li></ul>

Responsibilities: <ul><li>Lead and develop a multidisciplinary technology team across chamber design, process development, systems engineering, controls, and integration.</li><li>Define and execute the chamber technology roadmap, product architecture, risk retirement plans, and development milestones.</li><li>Drive end-to-end technical execution of chamber development programs to meet performance, schedule, cost, quality, and reliability goals.</li><li>Provide technical guidance on chamber hardware, process performance, plasma or chemical interactions, materials compatibility, defectivity, cleanliness, and manufacturability.</li><li>Partner with product management, manufacturing, supply chain, service, and customer-facing teams to deliver customer-focused product solutions.</li><li>Lead customer issue resolution, including containment, root-cause analysis, corrective actions, recovery plans, and long-term product improvements.</li><li>Represent the technology organization in customer engagements, executive reviews, technical reviews, and escalation discussions.</li></ul> Requirements: <ul><li>Bachelor’s degree or higher in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical discipline; advanced degree preferred.</li><li>Significant experience leading semiconductor equipment, process module, or chamber development programs.</li><li>Proven ability to lead technical teams and drive cross-functional execution in a global, matrixed organization.</li><li>Strong knowledge of product development lifecycle, including feasibility, design validation, process integration, NPI, reliability, and manufacturing readiness.</li><li>Excellent communication and stakeholder management skills, with the ability to influence executive, customer, and engineering audiences.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Strategy <ul><li>Define and execute long-range (N+2 and beyond) pathfinding roadmap for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.</li><li>Drive concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms (e.g., novel interconnect schemes, heterogeneous integration architectures, advanced substrate innovations).</li><li>Evaluate emerging technology options and guide make/buy/partner decisions to establish differentiated capability ahead of industry adoption cycles.</li><li>Anticipate and define technology inflections aligned to AI, HPC, memory integration, chiplet ecosystems, and future system architectures.</li></ul> Innovation Leadership &amp; Team Building <ul><li>Build, lead, and inspire a world-class pathfinding and innovation team, fostering a culture of bold thinking, experimentation, and calculated risk-taking.</li><li>Instill an innovation-first mindset, encouraging teams to challenge existing assumptions and explore unconventional solutions.</li><li>Establish structured frameworks for idea generation, incubation, rapid prototyping, and down-selection.</li><li>Mentor technical leaders and create a pipeline of innovation talent capable of sustaining long-term differentiation.</li></ul> Customer &amp; Market-Driven Innovation <ul><li>Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.</li><li>Engage deeply with key customers to identify latent needs and unmet challenges not addressed by current packaging solutions.</li><li>Drive creation of new product concepts and technology platforms that deliver step-function improvements in performance, cost, power, and scalability.</li><li>Position offerings to create clear value differentiation and long-term competitive advantage.</li></ul> Ecosystem Development &amp; Strategic Partnerships <ul><li>Build and lead a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.</li><li>Identify and activate disruptive partnerships that accelerate innovation cycles and enable early validation of emerging technologies.</li><li>Drive joint development programs and consortia engagement to shape industry direction and standards.</li></ul> Program Leadership &amp; Execution Governance <ul><li>Establish governance models for early-stage technology programs, balancing exploration with execution discipline.</li><li>Drive alignment across engineering, product, and business units to transition pathfinding concepts into development pipelines.</li><li>Develop executive-level narratives and decision frameworks to communicate technology trade-offs, investments, and strategic priorities.</li><li>Ensure learnings from early exploration are captured, scaled, and leveraged across the organization.</li></ul> Leadership Expectations <ul><li>Visionary Technology Leader: Anticipates industry disruption and defines future-state architectures ahead of the market.</li><li>Innovation Catalyst: Creates an environment where breakthrough ideas are generated, tested, and scaled.</li><li>Strategic Connector: Bridges customer roadmaps, internal capabilities, and ecosystem innovations into cohesive strategies.</li><li>Builder of Teams &amp; Culture: Attracts, develops, and retains top talent while fostering collaboration and accountability.</li><li>Decisive Change Agent: Operates effectively in ambiguity, making high-impact decisions with incomplete data.</li></ul> Requirements: <ul><li>15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.</li><li>Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.</li><li>Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc), with the ability to think beyond existing paradigms.</li><li>Proven experience building and leading cross-functional or exploratory R&amp;D teams.</li><li>Ability to translate complex technology concepts into business impact and strategic direction.</li></ul>

Responsibilities: <ul><li>Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products</li><li>Manage, develop, plan and execute process engineering projects for entire range of products</li><li>Interact with key customers to resolve significantly complex process engineering issues for entire range of products</li><li>Develop and implement new technology, products and analytical instrumentation</li><li>Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products</li><li>Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products</li><li>Contributes to market share gains through technology improvement</li></ul> Requirements: <ul><li>Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.</li><li>8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition technologies.</li><li>Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.</li><li>Proven experience leading process development, technology innovation, and product qualification in an R&amp;D environment.</li><li>Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.</li><li>Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.</li><li>Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.</li><li>Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.</li><li>Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Development <ul><li>Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.</li><li>Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.</li><li>Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates).</li><li>Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.</li><li>Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.</li></ul> Technical Innovation &amp; Execution <ul><li>Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.</li><li>Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.</li><li>Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.</li><li>Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.</li><li>Document and communicate findings to influence technology roadmap decisions and downstream development programs.</li></ul> Customer &amp; Market Alignment <ul><li>Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems.</li><li>Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.</li><li>Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits.</li></ul> Ecosystem Collaboration <ul><li>Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.</li><li>Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.</li><li>Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.</li></ul> Program Contribution &amp; Technical Leadership <ul><li>Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.</li><li>Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities.</li><li>Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.</li><li>Mentor junior engineers and contribute to building technical depth and innovation culture within the team.</li></ul> Leadership Expectations <ul><li>Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration.</li><li>Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact.</li><li>Influencer: Drives alignment and decisions across teams without formal authority.</li><li>Problem Solver: Thrives in ambiguity, breaking down complex challenges into actionable solutions.</li><li>Collaborator: Effectively works across organizational and ecosystem boundaries.</li></ul> Requirements: <ul><li>10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.</li><li>Demonstrated experience in technology development, pathfinding, or exploratory R&amp;D.</li><li>Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).</li><li>Proven ability to solve complex technical problems and translate concepts into experimental validation.</li><li>Strong communication skills to articulate technical insights and business relevance.</li></ul>

Responsibilities: <ul><li>Create 3D integration and packaging solutions for different platforms and quantum structures</li><li>Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices</li><li>Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines</li><li>Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues</li><li>Generate internal and external documentation for products, presentations and technical reports</li><li>Design and conduct experiment, measure material and device properties and interpret data</li><li>Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies</li><li>Collaborate with customers, start-ups, or universities to identify key problems and develop enabling solutions</li></ul> Requirements: <ul><li>PhD, Masters, or Bachelors degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.</li><li>5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.</li><li>Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip, and related packaging technologies.</li><li>Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology.</li><li>Experience with DOE, data analysis, process optimization, and root cause analysis.</li><li>Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.</li><li>Strong problem-solving, technical communication, and cross-functional collaboration skills.</li><li>Ability to work effectively with customers, startups, universities, and multidisciplinary R&amp;D teams.</li></ul>

Responsibilities: <ul><li>Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines</li><li>Perform hardware characterization on a variety of difficult systems, within safety guidelines</li><li>Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues</li><li>Generate internal and external documentation for products, presentations and technical reports</li><li>Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision</li><li>Measure film properties and interpret data</li><li>Identify, select and work with vendors and suppliers with limited supervision</li><li>Implement new technology, products and analytical instrumentation</li></ul> Requirements: <ul><li>PhD or Masters Degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field</li><li>Research focus in semiconductor would be an added advantage</li><li>Relevant experiences in semiconductor process development field</li><li>Good communication and interpersonal skills</li><li>Problem-solver attitude with determination and quality-mindset</li></ul>

Responsibilities: <ul><li>Lead the design and architect solutions that meet SYF business requirements to deliver business value by enabling rapid innovation through modern software development practices and product delivery through rapid innovation and continuous integration. In-depth knowledge of credit application and web application platforms.</li><li>Perform Technology Alternate Assessment, create Proof-of-Concept (as necessary) Provides guidance and direction to product teams to ensure compliance with the standards and best practices Work collaboratively with Product Management and Platform Engineering teams during development, launch and continuing refinement of products iteratively</li><li>Lead Agile sprints as the technical expert, including sprint planning, daily standups, backlog grooming sessions, and sprint reviews Influence and collaborate with software developers, UX designers, product managers, application architects, and customer application experts to create high performing and reliable application components.</li><li>Work with third party vendors to develop software and/or integrate their software into the companys products</li><li>Drive a CI/CD strategy using our Jenkins, Bitbucket, and uDeploy stack.</li><li>Maintain deep hands-on technical knowledge of evaluating trends in modern software development practices.</li></ul> Requirements: <ul><li>Bachelor’s degree and a minimum 7 years of experience with software engineering OR, in lieu of degree 9 years of experience with software engineering.</li><li>5+ years of applied Java experience</li><li>5+ years of hands-on experience in Credit Card Acquisition platform with ample knowledge in credit card application processing and decisioning systems.</li><li>Experience in Front End UI (JavaScript/Typescript) development and Backend Java programming.</li><li>Critical Thinking, creativity and problem-solving skills.</li><li>Strong analytical and problem-solving skills.</li><li>Excellence in technical communication with technical and non-technical peers.</li><li>Basic understanding of Artificial Intelligence.</li></ul>

Responsibilities: <ul><li>Lead the development effort for cloud-native applications across the Caching Solutions and Rewards System teams, ensuring timely execution against committed business outcomes.</li><li>Drive business commitments by aligning scope, sequencing, and technical approach with Product Management, and ensuring delivery plans are realistic, transparent, and measurable.</li><li>Design and implement continuous integration and continuous delivery (CI/CD) processes to deliver applications to production, fostering a culture of continuous process improvement.</li><li>Provide hands-on technical leadership through architecture/design reviews, code reviews, and guidance to engineers to ensure compliance with standards and best practices.</li><li>Perform Technology Alternate Assessments and create Proofs-of-Concept (as necessary) to validate options and inform technical decisions.</li><li>Work collaboratively with Product Management and Platform Engineering teams during development, launch, and continuing refinement of products iteratively.</li><li>Collaborate with internal technical resources and third-party vendors to resolve issues, understand</li><li>underlying causes, and implement sustainable solutions.</li><li>Work with team members to design, architect, and implement solutions across geographic locations, ensuring effective coordination and consistent engineering execution.</li><li>Coordinate and communicate status across stakeholders, and report delivery progress, risks, and dependency needs to leadership on a regular cadence.</li><li>Maintain deep hands-on technical knowledge by evaluating trends in modern software development practices; continuously learn and stay at the leading edge of industry trends.</li></ul> Requirements: <ul><li>Bachelor’s Degree with 8+ years of system engineering experience, or in lieu of a degree 10+ years of skilled system engineering experience.</li><li>8+ years of Strong hands-on development experience in Java and Spring Boot for building enterprise-grade services.</li><li>5+ years of Proven expertise in designing and implementing cloud-native applications using a microservices-based architecture.</li><li>Solid knowledge of event streaming and processing patterns using Kafka.</li><li>Experience deploying and operating applications on cloud platforms such as AWS and PCF (Pivotal Cloud Foundry).</li><li>Strong understanding of data storage and caching concepts and implementations using GemFire, Redis &amp; Elastic cache.</li><li>5+ years of Working knowledge of database design and persistence using MySQL, Aurora SQL &amp; no SQL.</li><li>Experience with observability, logging, and production monitoring, including tools such as Splunk and New Relic</li></ul>

Responsibilities: <ul><li>Act as the focal point of contact for technical resolutions while managing the incident, problem and knowledge management processes for the applications in scope.</li><li>Provide comprehensive support to internal customers; achieve resolution to outstanding problems or issues.</li><li>Manage 3rd party product vendors and integration partners to ensure application code fix deliveries are timely and good quality.</li><li>Design appropriate metrics for reporting on key performance and quality indicators.</li><li>Test, maintain and recommend software improvements to ensure strong functionality and optimization.</li><li>Work with production support team members to conduct root cause analysis of issues, review new and existing code and/or perform unit testing.</li><li>Work with business stakeholders to manage and prioritize the overall book of work in terms of problem remediation.</li><li>Contribute to improvement initiatives relating to methods, tools, people, architecture, project management and governance.</li></ul> Requirements: <ul><li>Degree in Computer Science, Engineering or similar domain; Additional professional/technical qualifications will be advantageous.</li><li>At least 6 years’ experience in relevant Banking applications / Information Technology.</li><li>Proficient in IBM AS400 platform, RPG, COBOL, CL programming.</li><li>Good understanding and experience in of Software Development Life Cycle (SDLC) or AGILE.</li><li>Well-versed in service management or production support’s process flow and cycle.</li><li>Experience leading a small team and providing guidance to junior developers.</li><li>Knowledge of Silverlake’s banking software suite is an added advantage.</li></ul>

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80 applied java programming Jobs found

Technical Director, Advanced Packaging Integration

Director of Technology (Product Development)

Director, Advanced Packaging Disruptive Technology

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

Assistant Vice President - Principal Engineer

AVP, Principal Software Engineer (Senior Technical lead)

L3 Production Support (AS400, RPG), Core Banking

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80 applied java programming Jobs found

Technical Director, Advanced Packaging Integration

Director of Technology (Product Development)

Director, Advanced Packaging Disruptive Technology

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

Assistant Vice President - Principal Engineer

AVP, Principal Software Engineer (Senior Technical lead)

L3 Production Support (AS400, RPG), Core Banking

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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WhiteCrow is on a mission to connect companies with the best talent across the globe.