Filters
Skills
technical skills
communication skills
product development
project management
six sigma
account management
advanced packaging
analytical skills
application engineering
capa
Industry
No results found
Location
singapore, singapore
bangkok, thailand
pune, india
perai, malaysia
batangas, philippines
bengaluru, india
houston, united states
penang, malaysia
sydney, australia
alabang, philippines
Jobtitle
senior manufacturing engineer
account manager iv - connected living solutions
business analyst - sap mm
customer engineer - c3
customer quality engineer (cqe)
electrical design engineer
facilities technician
key account manager - north
maintenance engineer
manufacturing engineer ii - ccd support
Filter
49 automotive electronics Jobs found
1-10 of 49
S
Senior Manufacturing Engineer
12 days ago
S
Management & LeadershipManufacturing Engineering SkillsContinuous ImprovementQuality & Process ImprovementTechnical & Production SkillsLean & Operational Excellence
K
Key Account Manager - North
12 days ago
K
Key Account Management SkillsNorth Region/Territory ManagementSales & Commercial SkillsCustomer & Stakeholder ManagementReporting & Leadership
S
Senior HR Business Partner
a month ago
S
Global Organizational DevelopmentEmployee RelationsSuccession PlanningWorkforce PlanningHrbpUnionized EnvironmentGlobal Talent DevelopmentTalent Development
S
Senior Process Engineer, Dry Etch
a month ago
S
Wafer ProcessEquipment MaintenanceHigh Volume ProductionStatistical SoftwareStrong Technical CompetencyPlasma AshingWafer Process Engineering
A
A
B2b SalesCustomer ServiceAccount ManagementWire HarnessIntegrity
S
Sourcing Specialist
a month ago
S
NegotiationContract DraftingSupplier QuotationsProcurementSourcingSupply Chain
T
Territory Sales Executive
2 months ago
T
Business DevelopmentChannel SalesRefrigerationTechnical SalesTechnical QualificationsHvacApplication Engineering
Q
Quality Analyst (5-4) – Assembly Quality
2 months ago
Q
Six SigmaTechnical SkillsPPAPMeasurement System AnalysisPareto analysisQuality Management SoftwareTime Management
Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer
P
Test Coverage OptimizationDRAM Device Fundamentals and PhysicsHigh Bandwidth Memory (HBM) ArchitectureReliability CharacterizationReliability Risk AssessmentDefectivity Analysis
WhiteCrow 
