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advanced semiconductor packaging
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Jobtitle
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
127217 senior quality & reliability engineer
customer quality engineer
customer quality engineer (cqe)
facilities technician
field application engg (fae)
manager i - r&d product development engineering
manager ii - manufacturing & process development engineering
Filter
39 cable assembly Jobs found
1-10 of 39
M
Product DevelopmentEngineering ManagementProduct DesignProject ManagementEngineering Analysis
M
MFG & Process DVL Engineer 2
12 days ago
M
Manufacturing Process DevelopmentProcess Design & OptimizationNew Product IntroductionContinuous ImprovementTime Study & Process Capacity Analysis
P
Production Manager
12 days ago
P
Production SkillsQuality & SafetyLeadership & Analytical SkillsVendor & Stakeholder ManagementInventory & Material Planning
F
Field Application Engg (FAE)
12 days ago
F
Technical Customer SupportApplication Engineering & Product IntegrationTroubleshooting & Root Cause AnalysisProduct Demonstration & Technical PresentationCustomer Requirement Analysis
O
Operations Manager - Cable
17 days ago
O
Cable Manufacturing OperationsProduction Planning & SchedulingQuality Control & AssuranceBudget & Resource ManagementVendor & Supplier Management
C
Customer Quality Engineer
2 months ago
C
Six Sigma8DQualityFailure AnalysisReliability EngineeringCustomer Interface
S
Senior Manager-Advanced Quality Engineering
2 months ago
S
FMEADOEApqp MethodQuality ControlCable AssemblyNpi Management
Q
Quality Analyst (5-4) – Assembly Quality
2 months ago
Q
Six SigmaTechnical SkillsPPAPMeasurement System AnalysisPareto analysisQuality Management SoftwareTime Management
P
Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology
Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer
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