Filters

Skills

python
advanced packaging
advanced semiconductor packaging
quality control
visual basic
advanced packaging integration
metrology & characterization
micro-bump & fine-pitch interconnects
process optimization
project management

Industry

chemicals
pharmaceuticals

Location

singapore, singapore
chestnut ridge, united states
hyderabad, india
bandar baru enstek, malaysia
batangas, philippines
dubai, united arab emirates
kinshasa, democratic republic of the congo
mexico city, mexico
penang, malaysia
perai, malaysia

Jobtitle

principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
associate engineer - factory innovation
asst area sales manager
chemist data reviewer
cto representative & immex program coordinator
director of technology (product development)
distribution resource planner
dry etch principal engineer/ mts lead, process development, advance nand

Filter

27 chemical Jobs found

1-10 of 27
T

Singapore, Singapore

T

Thermal ManagementAdvanced Packaging IntegrationPackage ArchitectureAdvanced InterconnectsHeterogeneous IntegrationProcess Integration
D

Singapore, Singapore

D

System IntegrationRisk ManagementTechnology Strategy & VisionProduct Development LeadershipNew Product Introduction (NPI)Advanced Technology DevelopmentProduct Architecture
P

Singapore, Singapore

P

Electroplating Process EngineeringElectrochemical EngineeringElectroplating EquipmentMetrology & CharacterizationReliability Engineering
S

Singapore, Singapore

S

PythonMinitabProcess Development & Scale-UpProcess OptimizationEquipment & Process DesignLeadershipProject Management
H

Perai, Malaysia

H

HR & RBA SkillsRisk, Compliance & GovernanceLeadership & Stakeholder ManagementHR Operations & AnalyticsSOP Development
S

Surabaya, Indonesia

S

Accounting & ComplianceLeadership & Interpersonal SkillsStrategic & Analytical SkillsSystems & Process ImprovementFinancial Management & Reporting
A

Bandar Baru Enstek, Malaysia

A

Quality & SafetyPeople ManagementManufacturing SkillsAutomationDigital ManufacturingFactory EngineeringContinuous Improvement

Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer

Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies