Manager I - R&D Product Development Engineering

Supply Chain Analyst

AI Transformation Engineer

AI Analytics and Visualization Engineer

Machine Learning Engineer Lead

Technical Director, Advanced Packaging Integration

Director, Advanced Packaging Disruptive Technology

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Cargospot System Specialist

Role Description: <ul><li>Automotive Industry offers products for vehicle electrification systems like chassis systems, convenience applications, driver information, infotainment solutions, miniaturization solutions, motor and powertrain applications etc.&nbsp;</li><li>The client Automotive BU is focused on developing new and improved vehicle architecture approaches to efficiently address these challenges in Connectivity from power to propulsion and safety.&nbsp;</li><li>The Manager R&amp;D Product development contributes to the development of organizational strategy and supports in implementation of operational plans.</li><li>Being part of Product development team responsible to develop for new products and sustenance of existing product lines of Automotive business unit of client.</li><li>This position drives development of PCB connectors for automotive applications including Board to Board, Wire to Board and Flex to Board connectors.</li></ul> Responsibilities: <ul><li>Managing experienced professional and/or supervisors who exercise independence in their assignments and providing them with the required guidance and also be a strong technical contributor.</li><li>Providing strategic leadership to foster growth of the business.</li><li>Interacting and cooperating with multiple organizational levels to meet schedule and technical expectations.</li><li>Administrating schedules and ensuring performance requirements.</li><li>Providing knowledge of engineering tools such as Creo, etc. and product domain expertise in multiple projects.</li><li>Assist Inside Device Connectivity (InDeCo) engineering teams with New Product Developments across a range of projects and executing on cost optimization/reduction (VA/VE) opportunities for the business.</li><li>Preparing design verification test plans, Design &amp; Process FMEAs.</li><li>Successfully facilitate transfer and support of new product introduction (NPI) into high volume manufacturing.</li><li>Contributing to technical function initiatives across various initiatives.</li><li>Reverse Engineering and benchmarking of competitor products.</li><li>Support product environmental compliance and approvals for all new products and platforms as required by our customers.</li><li>Be a strong technical partner and provide support to Product management teams.</li><li>Attend/support customer meetings, technology days and site visits as required.</li></ul> Requirements: <ul><li>Master’s degree in mechanical engineering or equivalent is preferred with minimum 8 years of experience in related fields.</li><li>Mechanical or equivalent engineering Degree with minimum 10 years of related product development experience.&nbsp;</li><li>Experience with product design of PCB Connector such as Board to Board, Flex to Board, Wire to Board is essential.</li><li>Knowledge in product design of plastic, terminals (sheet metal), fine pitch connectors, rubber components.</li><li>Working knowledge of driving diversity and inclusion, customer/market focus, result orientation, managing multiple priorities, envisioning the future, coaching and developing people and collaborating across boundaries</li><li>Extensive experience executing plans in a disciplined way and in holding people accountable.</li><li>Organized, methodical and self-motivated individual.</li><li>A person with the ability to achieve goals and the highest standards of performance in a dynamic fast paced environment.</li><li>Attention to detail and on time delivery.</li><li>Excellent judgment, timely and high-quality decision-making skills.</li><li>Proven ability to execute engineering deliverables.</li><li>Strong customer service mindset and mentality of delivering quality products and services on time and within company cost and profitability objectives.</li><li>Fluent communication skills facilitate collaboration with own team, customers, internal business leaders and technology leaders to create value.</li><li>Individual must be self-motivated, have strong planning skills and be able to deal with and balance multiple competing priorities.</li></ul> Functional: Mandatory: <ul><li>Working knowledge of product development (Processes, Approaches, Tools and Techniques) &amp; Validation</li><li>Working knowledge of manufacturing processes like injection Mold, plating, assembly &amp; High-speed stamping</li><li>Working knowledge to apply Six Sigma / DFSS methodology to design, development, and delivery of technology products and process.</li><li>Working knowledge in use of CAD systems (CREO Part modeling &amp; Sheet Metal)</li><li>Interpretation of simulation results &amp; translating into product design</li><li>Working knowledge in Design for Manufacturability (DFM) &amp; FMEA&nbsp;</li><li>Proficient in Tolerance stack-up and GD&amp;T</li><li>Ability to generate design concepts and solve design problems&nbsp;</li><li>Working knowledge in prototyping methods</li><li>Working knowledge in Manufacturing process (Molding / Stamping / Plating)</li><li>Understanding of linear and non-linear analysis</li><li>Working knowledge of product life cycle.</li><li>Basic Knowledge in quality tools (8D, Why Why analysis, Fish bone….)</li><li>Awareness of recognition &amp; protection of IP (intellectual property) features</li><li>Basic knowledge of PPAP documentation.</li></ul> Preferred: <ul><li>Knowledge of customer application&nbsp;</li><li>Experience in development of automotive signal and power connectors.</li></ul> Department specific: <ul><li>Exposure to PCB Connector design</li><li>Ability to understand specifications for validation as per US CAR / LV 214 / Similar Specification</li><li>Knowledge about crimping technologies, Ultrasonic welding technologies, Laser welding technologies</li></ul>

Roe Description: <ul><li>Transportation Solutions BU makes products for Connecting and Sensing Data, Power and Signal for vehicles ranging from Two wheelers to Heavy Commercial trucks.</li><li>There is a clear business strategy till 2025 to support the business growth. The growth is driven mainly driven from localization of Core India Specific products and also New technology products.</li><li>To establish “Single source of Truth” by integrating and maintaining all Key performance metrics of SCM/CS LIVE through Tableau/Power BI</li><li>To define the Capacity/Demand ratio for each part at each source location and make a trigger mechanism for new capacity&nbsp;</li><li>To optimize the supply network by exploring opportunities to increase sea vs Air movement from Source country to India Warehouse and exploring clubbing opportunities at Source.&nbsp;</li><li>Need to closely work with SCM team and Global Logistics team for integrated results.</li><li>To continuously monitor the ageing stock (SCM) and ageing orders (CS)</li></ul> Responsibilities: Capacity/Demand ratio: <ul><li>Establish the C/D ratio of each part in each source plant and work with Planner for getting enhanced capacity as per demand.</li><li>Also work with Demand team and Sales &amp; Marketing to get validated 24 months forecast</li></ul> Supply Network Optimization: <ul><li>To optimize the supply network by exploring opportunities to increase sea vs Air movement from Source country to India Warehouse and also exploring clubbing opportunities at Source.&nbsp;</li><li>Need to closely work with SCM team and Global Logistics team for integrated results.</li></ul> Monitor ageing stock and orders: <ul><li>To continuously monitor the ageing stock (SCM) and ageing orders (CS) and work with CS/SCM/sales &amp; marketing to liquidate those stocks/orders.</li></ul> Analytics: <ul><li>Work with application and product marketing and managing alternate part master.</li></ul> Requirements:&nbsp; <ul><li>MBA in Supply Chain&nbsp;</li><li>Expertise in Excel</li><li>Understanding of Tableau/Power BI</li><li>Understanding in SAP IBP</li><li>2 to 5 years of experience Handling large scale transformational SCM projects like SAP IBP/APO.</li><li>Extensive exposure to Excel/Macros.</li><li>Experience in Plant production planning.</li><li>SAP IBP - Conduct the IBP execution starting from demand review, supply review and integrated reconciliation</li><li>Strategic agility - Long Term capacity planning.</li><li>Supply network planning - Supply Network optimization by choosing the right network (Factory - SKU’s – Depot) based on the minimum total delivered cost (Freight Cost, Conversion Cost, Raw material cost and Tax benefit).</li><li>Frequency from factory to warehouse).</li><li>Ability to understand customer requirements.</li><li>Stakeholder alignment - Developing relationships and partnerships with key customers, industry leaders and core suppliers.</li></ul>

Role Description: <ul><li>The AI Transformation Engineer is responsible for identifying, evaluating, and deploying AI-enabled solutions that improve engineering productivity, accelerate development activities, and enhance decision-making across ICT Engineering.</li><li>The role serves as the bridge between engineering teams, AI technical specialists, and business stakeholders to ensure AI opportunities are translated into measurable business outcomes. This position leads the implementation lifecycle of approved AI initiatives, from opportunity assessment through deployment and value realization.</li><li>The role focuses primarily on engineering workflows, knowledge work, and business processes where AI can eliminate non-value-added activities, improve engineering effectiveness, and reduce time-to-market.</li></ul> Responsibilities: ﻿Opportunity Identification &amp; Assessment <ul><li>Partner with engineering teams to identify productivity challenges, workflow inefficiencies, and opportunities for AI-enabled improvement.</li><li>Analyze current-state engineering processes and determine the potential value of AI solutions.</li><li>Gather business requirements and define desired outcomes.</li><li>Partner with AI technical specialists to assess technical feasibility and solution options.</li><li>Work with the AI Value Realization Engineer to establish baseline measurements, value estimates, success criteria, and evidence requirements.</li><li>Provide use-case requirements, value assumptions, and implementation estimates to support prioritization and business-case development.</li><li>Determine whether identified opportunities are best addressed through AI, conventional automation, process improvement, or a combination of approaches.</li></ul> Solution Delivery &amp; Deployment <ul><li>Lead execution of approved AI initiatives from pilot through full deployment.</li><li>Coordinate stakeholders across engineering, digital technology, AI development teams, and subject matter experts.</li><li>Manage pilots, validation activities, user testing, and deployment readiness.</li><li>Drive user adoption and organizational change management activities.</li><li>Ensure solutions deliver expected business outcomes and user value.</li><li>Rapidly prototype and evaluate AI-enabled workflows using available enterprise AI platforms, low-code/no-code tools, and workflow automation technologies.</li></ul> Value Realization <ul><li>Own achievement of approved project objectives and targeted business benefits.</li><li>Monitor adoption, usage, and performance of deployed solutions.</li><li>Identify and resolve barriers to implementation success.</li><li>Partner with the AI Value Realization Engineer to validate benefits and track realized value.</li></ul> Requirements: Experience &amp; Qualifications <ul><li>Bachelors degree in Engineering or related technical discipline.</li><li>5+ years of engineering, product development, manufacturing engineering, or related experience.</li><li>Strong understanding of engineering workflows and development processes.</li><li>Experience leading cross-functional projects and driving organizational change.</li><li>Ability to translate business challenges into actionable improvement opportunities.</li><li>Strong communication, facilitation, and stakeholder management skills.</li><li>Demonstrated passion for AI and digital transformation.</li><li>Practical experience applying AI, automation, or digital technologies to engineering or business problems; experience with generative AI, LLMs, AI agents, or workflow automation preferred.</li><li>Experience rapidly prototyping and evaluating AI-enabled workflows using enterprise AI platforms, low-code/no-code tools, or workflow automation technologies.</li><li>Working understanding of LLM capabilities and limitations, including common failure modes, validation approaches, and human-in-the-loop considerations.</li></ul>

Role Description: <ul><li>The AI Analytics &amp; Value Realization Engineer is responsible for ensuring AI initiatives deliver measurable business value across ICT Engineering.</li><li>The role establishes value measurement frameworks, validates benefits, develops performance dashboards, and enables data-driven decision making across the AI portfolio. This position serves as the primary subject-matter expert for AI adoption measurement, business impact reporting, value realization tracking, and portfolio analytics</li></ul> Responsibilities: Value Definition &amp; Business Case Support <ul><li>Partner with AI Transformation Engineers during opportunity assessments.</li><li>Establish baseline metrics, value hypotheses, and expected business outcomes.</li><li>Define standardized measurement methodologies and evidence requirements for AI initiatives, distinguishing between forecast, validated, realized, and sustained business value.</li><li>Develop approaches for measuring engineering productivity and operational benefits, including time savings, cycle-time reduction, quality improvement, throughput, and adoption where direct financial measurement is not feasible.</li><li>Challenge assumptions and ensure value estimates are fact-based and measurable.</li></ul> Portfolio Measurement &amp; Reporting <ul><li>Develop and maintain AI portfolio dashboards and KPI reporting.</li><li>Track solution adoption, utilization, and business impact.</li><li>Collect and analyze deployment performance data.</li><li>Ensure consistent reporting across all AI initiatives.</li><li>Generate monthly reporting for ICT Engineering leadership, ICT AI leadership, and segment AI leadership.</li></ul> Value Realization &amp; Validation <ul><li>Validate achievement of project objectives and business benefits.</li><li>Monitor sustainability of realized benefits after deployment.</li><li>Identify underperforming initiatives and recommend corrective actions.</li><li>Support prioritization decisions using objective performance and value data.</li><li>Develop standardized value realization methodologies and reporting processes.</li><li>Design measurement approaches that compare pre- and post-deployment performance and provide credible evidence that observed improvements are attributable to deployed solutions.</li></ul> Advanced Analytics <ul><li>Perform portfolio analytics and trend analysis.</li><li>Support executive decision-making with actionable insights.</li><li>Maintain data quality and governance standards for AI program reporting.</li><li>Build Power BI dashboards and reporting solutions.</li></ul> Requirements: Experience &amp; Qualifications <ul><li>Bachelors degree in Engineering, Data Analytics, Business Analytics, Statistics, or related field.</li><li>Experience with analytics and visualization tools such as Power BI, including dashboard development, KPI reporting, and data analysis.</li><li>Strong analytical and quantitative problem-solving skills.</li><li>Experience developing and maintaining business metrics and measurement frameworks.</li><li>Experience establishing performance baselines and designing measurement approaches to evaluate the impact of implemented solutions.</li><li>Ability to translate complex data into actionable business insights.</li><li>Knowledge of engineering, technology, or transformation programs preferred.</li><li>Strong communication and executive presentation skills.</li></ul>

﻿Responsibilities: &nbsp;<ul><li>Lead, mentor, and grow a team of 4-5 ML engineers.</li><li>Provide architectural direction and code-level guidance.</li><li>Establish engineering best practices for ML system design, testing, and deployment.</li><li>Conduct design reviews, performance reviews, and technical roadmap planning.</li><li>Architect distributed ML systems serving multiple global products.</li><li>Standardize infrastructure patterns for LLM serving and retrieval systems.</li><li>Define and implement enterprise-ready agentic frameworks.</li><li>Architect multi-step reasoning systems.</li><li>Lead decisions on deterministic workflows vs. autonomous agents.</li><li>Implement guardrails, safety layers, and traceability mechanisms.</li><li>Develop evaluation frameworks to measure reasoning quality, hallucination rates, and reliability.</li><li>Establish CI/CD standards for ML lifecycle management.</li><li>Ensure compliance with enterprise data governance and responsible AI standards.</li></ul>&nbsp;Requirements &nbsp;<ul><li>8-10 years of Machine Learning/Software Engineer experience</li><li>2-3 years of people management experience.</li><li>Master’s degree or bachelors degree, computer science degree is highly desirable.</li><li>Strong software engineering background with experience in building system design, architecting AI feature/products that caters large number of users and deals with large volume of unstructured data.</li></ul>

Responsibilities: <ul><li>Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies</li><li>Define, document, and implement end-to-end process flows for panel-level packaging technologies</li><li>Lead material selection, characterization, and compatibility assessments for large form factor substrates</li><li>Partner with customers to define and align process specifications and acceptance criteria</li><li>Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers</li><li>Contribute to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps</li><li>Analyze process data to identify trends, drive optimization, and improve performance</li><li>Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability</li><li>Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions</li><li>Publish and present technical findings at leading industry conferences and in peer-reviewed journals</li><li>Mentor and guide early-career engineers; provide technical direction and best practices</li></ul> Requirements: <ul><li>Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field</li><li>In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows</li><li>Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level</li><li>Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs</li><li>Proficiency in statistical data analysis (e.g. DoE, JMP)</li><li>Knowledge of industry standards and best practices in semiconductor packaging</li><li>Solid understanding of process characterization, metrology, materials &amp; failure analysis</li><li>Working knowledge of reliability requirements and qualification methodologies</li><li>Proven capability to lead multi-functional teams to resolve complex technical problems</li><li>Exceptional written and verbal communication skills</li><li>Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts</li><li>Drive structured technical discussions with customers and suppliers</li><li>Articulate positions, influence decisions, and align technical direction</li><li>Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications</li><li>Ability to work effectively across geographies and time zones</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Strategy <ul><li>Define and execute long-range (N+2 and beyond) pathfinding roadmap for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.</li><li>Drive concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms (e.g., novel interconnect schemes, heterogeneous integration architectures, advanced substrate innovations).</li><li>Evaluate emerging technology options and guide make/buy/partner decisions to establish differentiated capability ahead of industry adoption cycles.</li><li>Anticipate and define technology inflections aligned to AI, HPC, memory integration, chiplet ecosystems, and future system architectures.</li></ul> Innovation Leadership &amp; Team Building <ul><li>Build, lead, and inspire a world-class pathfinding and innovation team, fostering a culture of bold thinking, experimentation, and calculated risk-taking.</li><li>Instill an innovation-first mindset, encouraging teams to challenge existing assumptions and explore unconventional solutions.</li><li>Establish structured frameworks for idea generation, incubation, rapid prototyping, and down-selection.</li><li>Mentor technical leaders and create a pipeline of innovation talent capable of sustaining long-term differentiation.</li></ul> Customer &amp; Market-Driven Innovation <ul><li>Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.</li><li>Engage deeply with key customers to identify latent needs and unmet challenges not addressed by current packaging solutions.</li><li>Drive creation of new product concepts and technology platforms that deliver step-function improvements in performance, cost, power, and scalability.</li><li>Position offerings to create clear value differentiation and long-term competitive advantage.</li></ul> Ecosystem Development &amp; Strategic Partnerships <ul><li>Build and lead a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.</li><li>Identify and activate disruptive partnerships that accelerate innovation cycles and enable early validation of emerging technologies.</li><li>Drive joint development programs and consortia engagement to shape industry direction and standards.</li></ul> Program Leadership &amp; Execution Governance <ul><li>Establish governance models for early-stage technology programs, balancing exploration with execution discipline.</li><li>Drive alignment across engineering, product, and business units to transition pathfinding concepts into development pipelines.</li><li>Develop executive-level narratives and decision frameworks to communicate technology trade-offs, investments, and strategic priorities.</li><li>Ensure learnings from early exploration are captured, scaled, and leveraged across the organization.</li></ul> Leadership Expectations <ul><li>Visionary Technology Leader: Anticipates industry disruption and defines future-state architectures ahead of the market.</li><li>Innovation Catalyst: Creates an environment where breakthrough ideas are generated, tested, and scaled.</li><li>Strategic Connector: Bridges customer roadmaps, internal capabilities, and ecosystem innovations into cohesive strategies.</li><li>Builder of Teams &amp; Culture: Attracts, develops, and retains top talent while fostering collaboration and accountability.</li><li>Decisive Change Agent: Operates effectively in ambiguity, making high-impact decisions with incomplete data.</li></ul> Requirements: <ul><li>15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.</li><li>Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.</li><li>Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc), with the ability to think beyond existing paradigms.</li><li>Proven experience building and leading cross-functional or exploratory R&amp;D teams.</li><li>Ability to translate complex technology concepts into business impact and strategic direction.</li></ul>

Responsibilities: <ul><li>Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products</li><li>Manage, develop, plan and execute process engineering projects for entire range of products</li><li>Interact with key customers to resolve significantly complex process engineering issues for entire range of products</li><li>Develop and implement new technology, products and analytical instrumentation</li><li>Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products</li><li>Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products</li><li>Contributes to market share gains through technology improvement</li></ul> Requirements: <ul><li>Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.</li><li>8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition technologies.</li><li>Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.</li><li>Proven experience leading process development, technology innovation, and product qualification in an R&amp;D environment.</li><li>Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.</li><li>Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.</li><li>Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.</li><li>Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.</li><li>Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Development <ul><li>Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.</li><li>Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.</li><li>Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates).</li><li>Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.</li><li>Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.</li></ul> Technical Innovation &amp; Execution <ul><li>Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.</li><li>Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.</li><li>Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.</li><li>Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.</li><li>Document and communicate findings to influence technology roadmap decisions and downstream development programs.</li></ul> Customer &amp; Market Alignment <ul><li>Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems.</li><li>Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.</li><li>Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits.</li></ul> Ecosystem Collaboration <ul><li>Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.</li><li>Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.</li><li>Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.</li></ul> Program Contribution &amp; Technical Leadership <ul><li>Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.</li><li>Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities.</li><li>Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.</li><li>Mentor junior engineers and contribute to building technical depth and innovation culture within the team.</li></ul> Leadership Expectations <ul><li>Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration.</li><li>Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact.</li><li>Influencer: Drives alignment and decisions across teams without formal authority.</li><li>Problem Solver: Thrives in ambiguity, breaking down complex challenges into actionable solutions.</li><li>Collaborator: Effectively works across organizational and ecosystem boundaries.</li></ul> Requirements: <ul><li>10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.</li><li>Demonstrated experience in technology development, pathfinding, or exploratory R&amp;D.</li><li>Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).</li><li>Proven ability to solve complex technical problems and translate concepts into experimental validation.</li><li>Strong communication skills to articulate technical insights and business relevance.</li></ul>

Role Description: <ul><li>Looking for a Cargospot System Specialist to support and optimise the Cargospot system across the EMEA region.</li><li>The role will focus on Level 2/3 functional support, troubleshooting, system configuration, business requirements and system enhancements. You will work closely with Operations, Finance, internal Cargospot teams and external technical partners to ensure the system effectively supports business needs.</li><li>Strong hands-on Cargospot experience is essential. Knowledge of billing processes is an added advantage.</li></ul>&nbsp;Responsibilities: <ul><li>Provide Level 2/3 functional support for Cargospot, including troubleshooting and resolution of complex system issues.</li><li>Investigate and manage system support tickets through to resolution.</li><li>Support Cargospot configuration, administration, and functional optimisation.</li><li>Understand business requirements from Operations and Finance and assess how these can be supported within Cargospot.</li><li>Translate business requirements into clear specifications for technical/development teams.</li><li>Coordinate system enhancements, including testing, feedback, and releases.</li><li>Work with external technical partners on system developments and enhancements.</li><li>Support users with Cargospot queries and provide training where required.</li><li>Identify opportunities to improve system functionality, processes, and user experience.</li><li>Support billing and revenue-related requirements, including investigating billing discrepancies and supporting month-end validation.</li><li>Analyse system/data issues and identify trends or opportunities for improvement.</li><li>Work with stakeholders across Operations, Finance, Cargospot and external technology partners.</li><li>Support wider regional applications activities when required.</li></ul>&nbsp;Requirements: Essential: <ul><li>Strong hands-on experience with Cargospot.</li><li>Experience in Cargospot functional support, administration, configuration, or optimisation.</li><li>Good understanding of air cargo operations and processes.</li><li>Strong troubleshooting and problem-solving skills.</li><li>Ability to understand business requirements and translate them into system solutions.</li><li>Experience with system testing and release processes.</li><li>Strong communication and stakeholder management skills.</li></ul>&nbsp;Advantageous: <ul><li>Experience with Cargospot billing, pricing, or revenue-related processes.</li><li>Experience working with external technology/development partners.</li><li>Data analysis, reconciliation, and reporting experience.</li><li>Knowledge of Power BI or Crystal Reports.</li><li>French language skills.</li><li>Experience using AI tools for automation, validation, or anomaly detection.</li></ul>

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190 core machine learning ai expertise Jobs found

Manager I - R&D Product Development Engineering

Supply Chain Analyst

AI Transformation Engineer

AI Analytics and Visualization Engineer

Machine Learning Engineer Lead

Technical Director, Advanced Packaging Integration

Director, Advanced Packaging Disruptive Technology

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Cargospot System Specialist

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190 core machine learning ai expertise Jobs found

Manager I - R&D Product Development Engineering

Supply Chain Analyst

AI Transformation Engineer

AI Analytics and Visualization Engineer

Machine Learning Engineer Lead

Technical Director, Advanced Packaging Integration

Director, Advanced Packaging Disruptive Technology

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Cargospot System Specialist

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WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.