Mechanical Maintenance Engineer - Automation Technology

Senior SAP CO Consultant

Senior IT Engineer

Senior Field Application Engineer (Sr. FAE)

Lead Quality Automation Engineer

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health)

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

HIG HBM PE Principal Component Validation Engineer

Responsibilities: This position is responsible for mechanical maintenance and assembling automation systems in the manufacturing. <ul><li>Maintenance work on mechanical, electronic and pneumatic systems, including inspections, cleanings and lubrications.</li><li>Creation of machine safety concepts and machine data concepts.</li><li>Design and optimization of automation solutions for production plants using PLC controllers, robotics, industrial image processing, drive technology, testing technology, safety technology and other automation technologies.</li><li>Programming and commissioning of PLC controllers, safety controllers and HMI systems.</li><li>Mechanical design, assembly and wiring of machines and plants.</li><li>Integration of robotic systems and other automated components into existing production processes.</li><li>Functional tests and performance tests on automation systems, troubleshooting and optimization of control programs.</li><li>Preparation of technical documentation, operating instructions and training material.</li><li>Collaboration in planning and implementing projects for modernization and expansion of our production facilities.</li><li>Support in training of new employees in using new automation technologies.</li><li>Introduction of Industry 4.0 technologies (such as 3D printing, AMR, predictive maintenance, simulation, ).</li></ul> Requirements: <ul><li>Bachelors Degree in preferably mechanical engineering, automation engineering, mechatronics or a similar qualification.</li><li>Min 3 years of experience in industrial automation.</li><li>Knowledge of Cam-controlled machines like: Bihler (prefered), Wafios, Finzer.</li></ul>

Responsibilities: <ul><li>Strategic Execution: Orchestrate end-to-end SAP CO solution design to meet global finance requirements, while fostering strategic alignment with upstream and downstream IT workstreams to ensure holistic aligned solution.</li><li>Analytical Expertise: Apply deep analytical skills to evaluate complex business requirements, modeling gaps and data into sound architecture E2E solutions across a multi-workstream and multi-region transformation programme.</li><li>Clear communication: Translates complex SAP CO technical concepts into business-friendly language, ensuring stakeholders share a clear and common understanding.</li><li>Collaborative Teamwork: Partner with Finance, Accounting Shared Service, Supply chain functions, manufacturing, and IT teams across Europe, India, APAC to ensure seamless integration of SAP solutions and business processes</li><li>Coaching &amp; Development: Actively pursues personal growth by seeking feedback and embracing learning opportunities, while providing leadership and coaching to team members on complex SAP/Non-SAP topics. Aligns team technical and professional development with broader organizational goals to build sustainable internal capability.</li></ul> Requirements: <ul><li>3+ years of IT-related work experience with a Bachelors degree or 5+ years of IT-related work experience without a Bachelor’s degree.</li></ul> Functional Knowledge: Apply proficient SAP CO knowledge with a strong emphasis on: <ul><li>SAP S/4 HANA Universal Journal (ACDOCA), Fiori apps</li><li>Product costing in cost estimates, cost variants both in legal and group valuation</li><li>Material Ledger actual costing</li><li>Revenue accounting in context of intercompany sales</li></ul>

Responsibilities:&nbsp; <ul><li>Support the implementation and enhancement of Enterprise Datahub using Databricks, ensuring seamless integration with existing BI and ERP systems.</li><li>Support complex BI and data platform initiatives while maintaining quality, delivery timelines, and alignment with organizational goals.</li><li>Collaborate with business stakeholders, architects, developers, and analysts to translate requirements into solutions.</li><li>Design, implement, test, and optimize moderately complex data pipelines, ETL/ELT flows, semantic layers, and report solutions with the development team.</li><li>Apply technical knowledge and AI-driven optimization opportunities to improve data quality, validation, reliability, and operational efficiency across supported solutions.</li><li>Develop new and impactful ideas, approaches, and automation opportunities that improve the platform, processes, and user experience.</li><li>Communicates moderately complex information clearly, accurately, and in a timely manner, adapting the message to the audience.</li></ul> Requirements: <ul><li>Degree in Business Informatics, Information Technology, Data Engineering/Analytics, Engineering, or a related field.</li><li>Proven experience in data engineering, application support, BI analytics, or related technical roles.</li><li>Strong expertise in Databricks, GitHub, dbt, ETL, Tableau, Power BI, and SQL.</li><li>Familiarity with Generative AI tools (e.g., Copilot, LLM-based assistants) to enhance productivity, development, and documentation.</li><li>Ability to analyze moderately complex problems independently and drive resolution with minimal supervision.</li><li>Strong stakeholder management, teamwork, and clear written and verbal communication skills.</li><li>Experience contributing to technical improvements, process optimization, and operational quality.Proficiency in English, both written and spoken.</li></ul>

Role Description: <ul><li>As a Senior Field Applications Engineer (FAE) at our client, you will be the technical face of ICT new technology connector solutions.</li><li>You will partner closely with account managers, product managers and end customers to drive new business through engineering and design-in support.</li><li>This role bridges our client products and customer designs, guiding requirements discovery, product selection, specification, and validation.</li><li>Core focus areas: e-mobility, high-speed data connectivity, low voltage and electromechanical solutions.</li><li>You will capture Voice of Customer insights to influence roadmaps and identify application opportunities.</li></ul> Responsibilities: <ul><li>Partner with account managers to support customers with engineering and design-in guidance.</li><li>Translate application requirements into connector and interconnect solutions.</li><li>Lead technical discussions in customer engagements.</li><li>Support specification and validation activities.</li><li>Capture Voice of Customer, market trends, and competitive benchmarks.</li><li>Support events like customer Techdays and trade shows.</li><li>Manage multiple stakeholders and collaborate cross-functionally with sales, product management, and engineering.</li></ul> Requirements: Experience Required: <ul><li>5+ years of experience in applications engineering, FAE, or technical sales.</li><li>Engineering degree preferred (Mechanical, Electrical, or similar STEM discipline).</li><li>Experience with connectors/interconnect systems preferred.</li><li>Strong customer-facing communication and influencing skills.</li><li>Ability to work independently and manage multiple priorities.</li></ul> Additional Qualifications <ul><li>Strong technical knowledge of connectors and cable assemblies.</li><li>Experience translating customer requirements into product specifications.</li><li>Exposure to e-mobility, high-speed data, and electromechanical systems.</li><li>Experience with Voice of Customer and competitive benchmarking.</li><li>Strong organizational and stakeholder management skills.</li><li>Willingness to travel.</li></ul>

Role Description: <ul><li>We are seeking an experienced Lead Quality Automation Engineer to join our growing Quality Engineering practice in Leeds.&nbsp;</li><li>This role is suited to a highly technical Quality Engineer who enjoys solving complex engineering challenges while working directly with clients across multiple industries.&nbsp;</li><li>You will play a key role in designing automation solutions, driving engineering best practices, mentoring team members, and helping organisations modernise their quality engineering capabilities.&nbsp;</li><li>As a Lead Quality Automation Engineer, you will remain hands-on with automation development while providing technical leadership across delivery teams.&nbsp;</li></ul> Responsibilities:&nbsp; <ul><li>Design, develop and maintain scalable automated testing frameworks for enterprise applications.&nbsp;&nbsp;</li><li>Deliver high-quality automation solutions using modern testing tools and object-oriented programming languages.&nbsp;&nbsp;</li><li>Work collaboratively with software engineers, architects, product owners, and business stakeholders throughout the software development lifecycle.&nbsp;&nbsp;</li><li>Champion Shift-Left Quality Engineering practices by embedding testing early in the development process.&nbsp;&nbsp;</li><li>Analyse application source code to identify defects, improve test coverage, and support overall software quality.&nbsp;&nbsp;</li><li>Contribute to Continuous Integration and Continuous Delivery (CI/CD) pipelines to enable efficient automated testing.&nbsp;&nbsp;</li><li>Apply AI-assisted engineering tools and Generative AI technologies to improve testing efficiency and engineering productivity.&nbsp;&nbsp;</li><li>Provide technical leadership, mentoring, and guidance to junior engineers and project teams.&nbsp;&nbsp;</li><li>Support clients in adopting modern Quality Engineering practices and continuous improvement initiatives.&nbsp;&nbsp;</li><li>Participate in technical discussions, solution design, and engineering governance activities.&nbsp;&nbsp;</li></ul> Requirements: <ul><li>Proven experience in Quality Engineering and Test Automation within enterprise environments.&nbsp;&nbsp;</li><li>Hands-on experience developing and maintaining automation frameworks.&nbsp;&nbsp;</li><li>Strong programming experience in one or more object-oriented languages such as Java, Python, C#, JavaScript, or TypeScript.&nbsp;&nbsp;</li><li>Experience with modern automation frameworks such as Playwright, Selenium, or equivalent.&nbsp;&nbsp;</li><li>Experience working with cloud platforms including AWS, Microsoft Azure, or Google Cloud Platform.&nbsp;&nbsp;</li><li>Good understanding of Continuous Integration and Continuous Delivery (CI/CD) principles.&nbsp;&nbsp;</li><li>Experience working with AI productivity tools such as GitHub Copilot, Claude, or similar technologies.&nbsp;&nbsp;</li><li>Strong understanding of software development lifecycle (SDLC) and Shift-Left Testing methodologies.&nbsp;&nbsp;</li><li>Excellent communication and stakeholder management skills with the ability to work directly with clients.&nbsp;&nbsp;</li><li>Demonstrated ability to work independently while managing multiple priorities.&nbsp;&nbsp;</li></ul> Preferred Qualifications&nbsp; <ul><li>Commercial experience implementing Generative AI solutions within Quality Engineering.&nbsp;&nbsp;</li><li>Experience working within consulting or professional services organisations.&nbsp;&nbsp;</li><li>Knowledge of Agentic AI concepts.&nbsp;&nbsp;</li><li>Familiarity with LangChain and LangGraph.&nbsp;&nbsp;</li><li>Experience mentoring engineers and providing technical leadership.&nbsp;&nbsp;</li><li>Exposure to both public and private sector projects.&nbsp;&nbsp;</li></ul> Personal Attributes&nbsp; The successful candidate will demonstrate:&nbsp; <ul><li>Strong analytical and problem-solving skills.&nbsp;&nbsp;</li><li>Excellent verbal and written communication abilities.&nbsp;&nbsp;</li><li>Adaptability in fast-paced consulting environments.&nbsp;&nbsp;</li><li>A continuous learning mindset with evidence of ongoing professional development.&nbsp;&nbsp;</li><li>A collaborative approach with the ability to influence technical and non-technical stakeholders.&nbsp;&nbsp;</li></ul> Working Arrangement&nbsp; <ul><li>This role follows a hybrid working model with an expectation of approximately two to three days per week onsite, depending on client requirements.&nbsp;</li><li>Some travel to client locations may be required.&nbsp;</li></ul> Security Requirements&nbsp; <ul><li>Candidates must either hold Security Clearance (SC) or be eligible to obtain SC Clearance in accordance with UK Government requirements.&nbsp;</li></ul>

Responsibilities: <ul><li>Lead Media Health Manufacturing activities for DRAM, Interface Die, and stacked HBM products.</li><li>Optimize manufacturing test coverage for current and future HBM architectures and process nodes.</li><li>Develop, validate, characterize, and qualify next-generation HBM products.</li><li>Support design verification and circuit debug using CAD tools and Verilog simulations.</li><li>Improve manufacturing yield, reduce test time, and optimize device reliability.</li><li>Drive root-cause analysis and resolution of manufacturing test flow, qualification, and RMA issues.</li><li>Promote innovation in Design-for-Test (DFT), manufacturing strategy, and test optimization.</li><li>Mentor engineers and develop technical and project management capabilities within the team.</li><li>Lead technical decision-making, risk analysis, and project prioritization.</li><li>Collaborate with Fab, HBM Technology Development, Design, System Development, Test Solution Engineering, and Quality/Reliability teams.</li></ul> Requirements: <ul><li>Bachelors or Masters Degree in Electrical &amp; Electronics Engineering.</li><li>8+ years of semiconductor industry experience with Product Engineering experience preferred.</li><li>Strong leadership, circuit analysis, and root-cause problem-solving skills.</li><li>Knowledge of statistics, scripting, and data analysis tools.</li><li>Ability to adapt to technical leadership and people leadership responsibilities.</li><li>Proven collaboration across cross-functional engineering organizations.</li><li>Strong accountability, communication, and presentation skills.</li><li>Passion for mentoring and developing engineering talent.</li><li>Willingness to work onsite in Singapore and travel internationally (US, Taiwan, Japan).</li></ul>

Responsibilities: <ul><li>Develop and enable advanced package technologies for post-fab wafer finish and assembly processes.</li><li>Improve product quality, yield, productivity, and manufacturing cost.</li><li>Partner with process and product engineering teams to integrate semiconductor technologies.</li><li>Drive yield improvements through package integration innovation, layout optimization, design improvements, and process margin enhancement.</li><li>Collect and analyze data to support design, layout, and integration flow decisions.</li><li>Collaborate with Probe, Yield Analysis, Test, Product Engineering, PWF Engineering, Assembly Engineering, Front-End Wafer Fab, Assembly/Test Engineering, and Global Quality teams.</li><li>Ensure robust quality through process monitoring, inspection, testing, SPC, DOE, and defect analysis.</li><li>Support product transition from development through qualification into High Volume Manufacturing (HVM).</li><li>Provide Process of Record (POR) and Model of Record (MOR) documentation.</li></ul> Requirements: <ul><li>B.S./M.S./Ph.D. (or equivalent) in Electrical, Mechanical, Chemical Engineering, Physics, Materials Science, or related discipline.</li><li>2+ years of semiconductor process integration experience, preferably in advanced packaging, post-fab wafer finishing, or assembly processes.</li><li>Proficiency in Python, R, and SQL.</li><li>Experience with Visual Basic.</li><li>Knowledge of E3, FDC, and RMS (Recipe Management System).</li><li>Strong statistical analysis, process modeling, SPC, DOE, defect analysis, and dashboarding skills.</li><li>Strong understanding of semiconductor process flows and integration.</li><li>Strong root-cause analysis and complex problem-solving capability.</li><li>Ability to work under tight timelines and limited resources.</li></ul>

Responsibilities: <ul><li>Develop wafer-level process technologies including wafer thinning and backside metal interconnect.</li><li>Improve process capability, yield, and manufacturing cost.</li><li>Establish process management projects supporting future technology nodes.</li><li>Evaluate, qualify, and implement new equipment and materials.</li><li>Set process parameters for semiconductor manufacturing equipment.</li><li>Drive process quality through inspection, testing, measurement, SPC, DOE, and defect analysis.</li><li>Develop advanced process controls using data analytics.</li><li>Collaborate with Package Integration, Assembly Engineering, Front-End Wafer Fab, Product Engineering, Assembly/Test Engineering, and Global Quality teams.</li><li>Support product transfer from development through qualification to High Volume Manufacturing (HVM).</li><li>Provide Process of Record (POR) and Model of Record (MOR) documentation.</li></ul> Requirements: <ul><li>B.S./M.S./Ph.D. (or equivalent) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical discipline.</li><li>2+ years of semiconductor process development experience, preferably in wafer bonding, plating, warpage control, or advanced packaging.</li><li>Proficiency in Python, R, and SQL.</li><li>Experience with Visual Basic.</li><li>Knowledge of E3, FDC (Fault Detection &amp; Classification), and RMS (Recipe Management System).</li><li>Strong statistical analysis, process modeling, SPC, DOE, and dashboard development skills.</li><li>Strong understanding of semiconductor process interactions, yield, performance, and reliability.</li><li>Excellent problem-solving and root-cause analysis capability.</li><li>Ability to deliver results under aggressive timelines and limited resources.</li></ul>

Responsibilities: <ul><li>Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging, Chip-on-Wafer (CoW), and Chip-to-Wafer (C2W) die stacking.</li><li>Improve product quality, yield, productivity, and manufacturing cost.</li><li>Drive process management projects supporting future technology nodes.</li><li>Evaluate, qualify, and implement new equipment and materials.</li><li>Establish process parameters for semiconductor manufacturing equipment.</li><li>Ensure robust quality through process monitoring, inspection, testing, SPC, DOE, and defect analysis.</li><li>Use data analytics to establish advanced process controls and identify improvement opportunities.</li><li>Collaborate with Package Integration, Assembly Engineering, Front-End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality teams.</li><li>Support seamless transition from product development through qualification into High Volume Manufacturing (HVM).</li><li>Provide Process of Record (POR) and Model of Record (MOR) documentation.</li></ul> Requirements: <ul><li>B.S./M.S./Ph.D. (or equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical discipline.</li><li>2+ years of semiconductor process development or equipment evaluation experience, preferably in wafer bonding, die stacking, or advanced packaging.</li><li>Proficiency in Python, R, and SQL.</li><li>Experience with Visual Basic for automation and tool integration.</li><li>Knowledge of E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System).</li><li>Strong data analytics capability supporting SPC, DOE, defect analysis, and dashboards.</li><li>Strong understanding of semiconductor process flows, yield, performance, and reliability.</li><li>Strong problem-solving and root-cause analysis skills.</li><li>Ability to work effectively under aggressive timelines and limited resources.</li></ul>

Responsibilities: <ul><li>Coordinate with internal and external teams to prepare silicon validation activities.</li><li>Partner with manufacturing teams to ensure required resources are available.</li><li>Identify, evaluate, and validate HBM Component Validation equipment and testing flows.</li><li>Ensure silicon performance meets product expectations.</li><li>Debug failures, identify root causes, and implement design or process fixes.</li><li>Collaborate with Design Validation (DV), Quality Assurance (QA), and Global Quality (GQ) teams on customer returns and reliability improvements.</li><li>Partner with Engineering, Manufacturing, and Marketing organizations.</li><li>Develop, troubleshoot, and validate HBM component validation test programs.</li><li>Review datasheets and provide feedback to Application Engineers.</li><li>Prioritize activities across multiple cross-functional teams.</li><li>Provide technical leadership, mentoring, and On-the-Job Training (OJT) for engineers.</li><li>Support technical presentations, seminars, and product-specific expertise</li></ul> Requirements: <ul><li>Bachelors or Masters Degree with a minimum of 10 years of experience, preferably within the memory semiconductor industry.</li><li>Strong programming experience with Linux, Python, C/C++, Verilog, UVM, and version control systems (Git, SVN).</li><li>Excellent analytical, debugging, and problem-solving skills.</li><li>Strong communication, presentation, and data analytics capabilities.</li><li>Basic understanding of HBM and/or DRAM operation and computer networking.</li><li>Self-motivated with the ability to work effectively in collaborative team environments</li></ul>

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150 cost engineer gm Jobs found

Mechanical Maintenance Engineer - Automation Technology

Senior SAP CO Consultant

Senior IT Engineer

Senior Field Application Engineer (Sr. FAE)

Lead Quality Automation Engineer

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health)

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

HIG HBM PE Principal Component Validation Engineer

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150 cost engineer gm Jobs found

Mechanical Maintenance Engineer - Automation Technology

Senior SAP CO Consultant

Senior IT Engineer

Senior Field Application Engineer (Sr. FAE)

Lead Quality Automation Engineer

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health)

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

HIG HBM PE Principal Component Validation Engineer

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.