Customer Service Specialist

R&D/Product Dvl Engineer II

EH&S Analyst I

Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Staff/Principal Engineer, NAND TD, RDA

Principal/Staff Engineer - Process Development, CVD/Diffusion

Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND

Electrical Engineer – Industrial Power

Process Technician

Mechanical Engineer

Responsibilities: Quote and Order Management: <ul><li>Interface with Customers for Quote request or Price inquiries and approval</li><li>Submit quotation request for pricing team approval.&nbsp;</li><li>Sales order entry, order confirmation &amp; expediting orders.</li><li>Order change and backlog price adjustment</li><li>On-going Backlog Management</li><li>Shipment release and follow up</li><li>Report and support past due backlog reduction</li><li>NPI - follow up with PM/Plant/Finance for part master and cost setup</li><li>Handle Sample order</li><li>Process RMA / Goods replacement</li></ul> Customer Service: <ul><li>Handle customer enquiries &amp; complaints. Investigate and work with other departments to resolve customer issues in a timely manner.&nbsp;</li><li>Emails/Conference calls / Customer and company Plant Visits for critical delivery issues, expedition or projects.&nbsp;</li><li>Work out solutions on Customer’s special requirements, such as label, Customs process, packing &amp; etc.&nbsp;</li><li>NPS/VOC/Customer Service Survey Improvement Process. Identify and work on corrective actions to recurring issues.&nbsp;</li></ul> Customer Supply Chain Management: <ul><li>Initiate Stock Requisition for customer advance order or buffer stock.</li><li>Work with Planning team on capacity adjustment in order to fulfill Customer’s demands</li><li>Consignment Stock Management/ Customer demand forecast monitoring and accuracy analysis</li><li>Manage customer forecast/demand and inventory level, work with Supply Chain to fulfill customer demand.&nbsp;</li><li>Negotiate with Customer for VMI liability and deadstock compensation.</li><li>Resolve logistics and custom issues with relevant functions</li></ul> Customer Credit and Billing Management: <ul><li>Billing attainment</li><li>Follow up queries with Account Receivable</li><li>Coordinate with Finance and Customer to solve pass due invoices issue</li><li>Manage customer credit status &amp; escalate for any abnormal status</li><li>Apply credit release</li><li>Process Credit note / Debit Note</li></ul> Requirements: <ul><li>Bachelor’s degree or equivalent</li><li>2–3+ years in customer service / order management (manufacturing preferred)</li><li>Strong communication and stakeholder management skills</li><li>Experience handling customer complaints and resolution</li><li>Ability to work under pressure in a fast-paced environment</li><li>Proactive mindset with strong ownership and accountability</li><li>SAP knowledge preferred</li><li>Mandarin communication capability is a plus</li></ul>

Responsibilities: <ul><li>Subject matter expert in signal integrity design, simulation and validation activities through product development cycles</li><li>Establishing signal integrity design performance/functional requirements for new products</li><li>Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.</li><li>Performing PCB design schematic and layout reviews</li><li>Creating actionable recommendations based upon design reviews and simulation results</li><li>Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement.</li></ul> Requirements: <ul><li>Bachelor’s degree in Electrical Engineering.</li><li>Experience with interconnect design or experience with connector &amp;/or cable/cable assembly design (high speed twinax/RF cables, direct attach copper (DAC) cables)</li><li>Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent)</li><li>A solid understanding of electromagnetic theory and electrical circuit behavior</li><li>Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.</li><li>Familiarity with printed circuit board design, fabrication and assembly.</li><li>Excellent verbal and written communication skills</li><li>Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies</li><li>Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English</li><li>Individual must be highly motivated, a quick learner, and able to work independently</li></ul>

Responsibilities: EHS Analysts have full authority to: <ul><li>input, maintain, and update internal EHS databases and logs</li><li>Generate, analyze, and distribute EHS performance reports</li><li>Manage document versions and ensure accessibility of EHS policies and procedures</li><li>Coordinate with contractors, labs, or suppliers for compliance support</li><li>Can initiate fact-finding activities for minor incidents and near misses</li></ul> EHS analysts are required to escalate the following: <ul><li>Approval of changes to EHS policies, programs, or procedures</li><li>Final review and submission of external regulatory reports to government agencies</li><li>Signing of contracts or service agreements with third-party vendors</li><li>Initiation of major corrective actions involving cost, manpower, or cross-functional coordination</li><li>Disciplinary recommendations related to EHS non-compliance (major safety violations)</li></ul> Requirements: <ul><li>Minimum 1 to 3 years or more working experience in Environment Health and Safety Roles</li><li>Experience as a Safety Officer or Pollution Control Officer is an advantage</li><li>Experience in working with a multinational company, local or abroad, is an advantage</li><li>College degree, major in Environmental, Chemical, Electrical, Mechanical Civil Engineering.</li><li>Highly Knowledgeable in MS Office applications (Word, Excel, PowerPoint, Forms, etc.)</li></ul>

Responsibilities: <ul><li>Technical Expertise: Capable to provide manual cuts along with building skills for future automated FIB cuts&nbsp;</li><li>Analytical Skills: Strong data analysis and problem-solving abilities.</li><li>Equipment Management: Set up equipment, monitor stability, improve capability, and interact with vendor representatives for advanced functionality and application work.</li><li>Recipe Management: Write or modify equipment recipes to support the needs of the RDA area.</li><li>Tool Recovery: Perform basic and advanced recoveries of down tools for assigned workstations.</li><li>Software Upgrades: Drive software upgrades and improvements, working with internal and external vendors for implementation.</li><li>Tool Monitoring: Monitor tool qualification SPC charts for deviations, initiate tool repairs, and adjust limits as necessary.</li><li>Data Science skills: Apply scripting, coding, or programming for monitoring performance and capabilities of the inspection data</li><li>Data Analysis: Collect and analyze tool/process data to suggest ways to improve performance and efficiency.</li><li>Collaboration: Collaborate with vendors for escalation results on application issues and with Equipment Owners to identify long-term solutions to tool issues.</li><li>Communication: Excellent verbal and written communication skills for effective vendor and team interactions.</li><li>Project Management: Ability to manage multiple projects and priorities effectively.</li></ul> Requirements: Application Expertise:&nbsp;<ul><li>Deep technical expertise in Focused Ion Beam (FIB) operations, including advanced cross sectioning, milling optimization, and defect characterization</li><li>Strong proficiency in SEM imaging and interpretation for systematic/random defect identification</li></ul> Training and Mentoring:&nbsp;<ul><li>Proven experience in training and mentoring engineers and technicians</li></ul> Vendor Relations: <ul><li>Experience working with vendors for FIB/SEM equipment setup, troubleshooting, and upgrades &gt;3years</li></ul> Education:&nbsp;<ul><li>Bachelor’s or Masters Degree in Electrical Engineering, Chemical Engineering, Materials Science &amp; Engineering, or related field accepted</li></ul> Experience: <ul><li>More than 5 years semiconductor manufacturing experience in RDA/inspection recipe setup for defect analysis&nbsp;</li></ul>

Responsibilities: <ul><li>Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes.</li><li>Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects.</li><li>Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR).</li><li>Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions.</li><li>Architect inspection recipes and sampling strategies; optimize sensitivity, throughput, and cost of ownership.</li><li>Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield.</li><li>Influence supplier roadmaps; evaluate, qualify, and release next gen optical/e-beam inspection capabilities.</li><li>Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites.</li><li>Mentor, coach, and upskill engineers; develop succession plans and technical ladders within the RDA domain.</li><li>Champion safety and continuous improvement (CIP); drive kaizen/lean initiatives that improve cycle time and learning velocity.</li></ul> Requirements: <ul><li>Bachelor’s degree with 7+ years relevant semiconductor experience, or Master’s/PhD with 5+ years.</li><li>Minimum 3+ years hands-on RDA experience in semiconductor manufacturing or equipment engineering.</li><li>Demonstrated expertise in defect inspection, process monitoring, and yield learning.</li></ul> Technical Competencies <ul><li>Realtime Defect Analysis (RDA) systems and workflows.</li><li>Optical and e-beam inspection technologies.</li><li>Statistical data analysis, correlation development, and large dataset interpretation.</li><li>Semiconductor process integration and technology development.</li><li>Root cause analysis and systematic problem solving (e.g., 8D, DMAIC).</li><li>Leadership &amp; Behavioral Competencies</li><li>Recognized technical authority with the ability to influence without direct authority.</li><li>Strong mentoring and coaching mindset with proven talent development outcomes.</li><li>Clear, concise communication skills across technical and executive audiences.</li><li>Ownership-driven, execution-focused; comfortable operating in ambiguity.</li><li>Impact &amp; Success Measures</li><li>Reduced defect-related yield loss and faster learning cycles.</li><li>On-time qualification and adoption of next-generation inspection capabilities.</li><li>Uplift in organizational RDA skill depth and succession pipeline.</li><li>Alignment of inspection strategy and capability to future NAND nodes.</li></ul>

Responsibilities: <ul><li>Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices</li><li>Evaluate innovative process and equipment solutions for early experimentation and process margin improvement</li><li>Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges</li><li>Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement</li><li>Partner with Boise TD Films teams to align future device requirements with process capabilities</li><li>Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams</li><li>Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation</li><li>Design and execute experiments to expand process margins and validate manufacturability of next-node solutions</li><li>Lead cross-functional initiatives to simplify processes and implement improvements</li><li>Embed best-known manufacturing practices into early-stage development of new nodes</li><li>Develop and apply advanced process monitoring and control methodologies.</li><li>Serve as a technical expert, contributing to process, equipment, and procedural improvements</li><li>Lead multidisciplinary projects across teams, sites, and suppliers focused on quality, yield, cost, and productivity</li><li>Advise management on significant technical issues and drive innovation through patents and technical publications</li><li>Maintain strict adherence to our client Intellectual Property protection policies</li><li>Engage continuously with global TD partners and suppliers to push for breakthrough solutions</li><li>Own and manage module-level business processes</li></ul> Requirements: <ul><li>Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 5 years of relevant experience or PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics</li></ul> Strong understanding of: <ul><li>Flow dynamics, thermodynamics, and physical phenomena in deposition</li><li>Precursor depletion effects in 3D structures and mitigation strategies</li><li>Interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)</li><li>Integration and structural constraints in film deposition processes</li><li>Memory process flows, especially for planar and vertical NAND</li><li>Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)</li><li>Excellent communication skills for both in-person and remote interactions</li><li>Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment</li></ul>

Responsibilities: Program and Project Management <ul><li>Manage efforts and set the strategy for developing process technology for assigned products in Process R&amp;D.</li><li>Offer routine project coordination and technical support to your process development team.</li><li>Handle the demands of several customers to determine priorities for your team.</li><li>Resolve yield and defect issues related to your process area.</li><li>Collaborate with the Manufacturing Development Engineering team to meet R&amp;D product quality and cycle time goals.</li><li>Work with R&amp;D Management, Process Integration, and High-Volume Manufacturing Sites to regularly align on project requirements, priorities, and timelines.</li><li>Engage manufacturing sites, Manufacturing Integration, and Central Teams to provide technical direction and maintain alignment between production and R&amp;D.</li><li>Drive ongoing process and operational efficiency improvements to meet the needs of PI and manufacturing by actively interacting with the equipment development team and suppliers.</li><li>Interact with equipment and chemical vendors to ensure alignment and timely progress on our roadmaps, as well as foster a positive relationship.</li></ul> Performance Management <ul><li>Partner with direct reports to develop long/short-term goals and projects that meet the needs of the Technology Development department.</li><li>Offer ongoing feedback to your team members on performance, establishing a career plan and mentoring your team members to encourage their professional development.</li><li>Set and communicate performance goals for the team, and lead goal-based performance evaluations for all team members.</li><li>Mentor team members on technical as well as soft skills (presentation skills, risk management, decision making, vendor interaction, etc.)</li><li>Recognize and reward company team members for outstanding performance.</li><li>Recruit both external and internal candidates to fill headcount in the group.</li><li>Provide conflict resolution if issues arise.</li></ul> Requirements: <ul><li>PhD or Masters in Physics, Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, along with at least 8 years of experience in the semiconductor industry concentrating on dry etch technology and managing personnel.</li><li>Bachelors degree in Physics, Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, along with at least 15 years of experience in the semiconductor sector concentrating on Dry Etch technology and managing personnel.</li><li>At least five years of experience leading a process development team in a semiconductor R&amp;D or high-volume manufacturing environment.</li><li>Comprehensive understanding of Plasma Dry Etch Technology.</li><li>Knowledge and experience in high aspect ratio etch development.</li><li>Demonstration of collaborative ways of problem solving.</li><li>Understand hard mask requirements based on material properties.</li><li>Positive relationship building skills, both with internal and external customers.</li><li>Demonstrated structured problem-solving capabilities.</li><li>Strong communication and interpersonal skills (written, verbal, and presentation).</li><li>Experience in being a mentor to manage the performance of direct reports.</li><li>Ability to seek opportunities for continuous improvement, as a team member, leader, and for the organization.</li></ul>

Responsibilities: <ul><li>Develop and execute complex projects that have a substantial mix of electrical, mechanical, physics, algorithms and software design; attend design reviews and provide input to meet market requirement specifications (MRS) and hardware/software specifications.</li><li>Ensure designs meet market requirement specifications (MRS). Coordinate with project marketing and management to understand system requirements.</li><li>Be able to chair architecture brainstorming meetings and drive the systems process to down select to a final architecture of a top-level system.</li><li>Participate in the design, development, and testing of radio-frequency components for semiconductor equipment, which includes high-power generators (up to 6 kW or more), matching networks, filters, or other tuning elements, with frequencies ranging from 300 kHz to 60 MHz.</li><li>Write detailed specifications that cover all aspects of subsystem modules including interfaces to the product by using systems analysis to create a diagram. </li><li>Create concepts for complex architectural design approaches. Lead team evaluations of architectures to provide recommendation for best system solution approach.</li><li>Fabricate or modify RF components to change their performance or enable access for instrumentation.</li><li>Instrument, characterize and troubleshoot RF sub-systems within larger semiconductor tool environment.</li><li>Problem identification and troubleshooting a wide range of difficult, complex engineering problems in field of technical expertise, including serviceability and manufacturability.</li><li>Support System Integration during the assembly and final testing of new product designs.</li><li>Interface with other groups to workout design, systems architecture development and integration issues.</li><li>Define all equipment interfaces and systems architecture and ensure they are up to date and documented.</li><li>Work with vendors to develop design requirements and ensure delivery of parts that meet specifications.</li></ul> Requirements: <ul><li>PhD/ Master/ Bachelor’s degree in Electrical or Mechanical Engineering with few years of relevant RF experiences</li><li>Understand principles and operation of network analyzers, oscilloscopes, power meters, directional couplers, and other radio-frequency test equipment</li><li>Knowledge of circuit theory and ability to develop analytical models of RF components</li><li>Problem-solving and troubleshooting skills</li><li>Excellent verbal and written communication skills and the ability to interact professionally with a diverse group of internal and external stakeholders</li><li>Self-starting individual, proactive and resourceful</li></ul>

Responsibilities: <ul><li>Assisting engineer to work on developing process technology for advanced CVD / PVD processes</li><li>Responsible for performing basic recipe and CH troubleshooting during process runs and implement changes based on directions from the engineer&nbsp;&nbsp;</li><li>Owner for the execution of module process, data collection for measurement &amp; inspection and sharing of data with the engineer</li><li>Interact with internal and external CH and metrology tool owners to align for tool time, execute process sequence and collect data to feedback to engineer</li><li>Occasional over-time to support process engineering support activities</li></ul> Requirements: <ul><li>Ability to work on rotational day, afternoon or night/ overnight shift</li><li>Basic understanding on semiconductor process is preferred</li><li>Candidates with prior semiconductor equipment experiences can be considered</li><li>Prior experience in Process Technology as technician in Fab/Cleanroom area (CVD, PVD, ALD etc.) will be added advantage</li></ul>

Responsibilities: <ul><li>In support of design projects, coordinate the procurement and assembly of mechanical components/equipment and identify sources of critical parts and subsystems to resolve basic technical issues</li><li>Design or modify mechanical engineering layouts/schematics, and/or detailed drawings/specifications of limited scope under direct supervision</li><li>Perform and document engineering test reports under direct supervision</li><li>Generate related alpha/gamma documentation for product release under direct supervision</li><li>Perform engineering analysis under direct supervision</li><li>Troubleshoots a variety of mechanical problems of general difficulty under direct supervision</li><li>Effective use of engineering processes in the resolution of basic mechanical problems of limited scope</li><li>May be responsible for the design, development and implementation of custom mechanical tooling, fixturing, and associated processes to enable the handling, assembly and/or disassembly of parts, components, sub-assemblies and final assemblies throughout the product life cycle</li><li>Work with suppliers to ensure parts can be manufactured in accordance with performance and cost objectives.</li><li>Perform 3D modelling</li></ul> Requirements: <ul><li>Master Degree in Mechanical Engineering</li><li>Basic knowledge or experiences in semiconductor industry</li><li>Prior 3D modelling experiences will be an added advantage</li><li>Skilled in Unigraphics - NX</li></ul>

Skills

Industry

Location

Jobtitle

207 cost engineer gm Jobs found

Customer Service Specialist

R&D/Product Dvl Engineer II

EH&S Analyst I

Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Staff/Principal Engineer, NAND TD, RDA

Principal/Staff Engineer - Process Development, CVD/Diffusion

Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND

Electrical Engineer – Industrial Power

Process Technician

Mechanical Engineer

WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.

EMPLOYER

TALENT

COMPANY

Contact Us

JOBS BY SKILLS

JOBS BY FUNCTION

JOBS BY INDUSTRY

JOBS BY LOCATIONS

MODEL JOBS

JOBS BY CITY

Skills

Industry

Location

Jobtitle

207 cost engineer gm Jobs found

Customer Service Specialist

R&D/Product Dvl Engineer II

EH&S Analyst I

Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Staff/Principal Engineer, NAND TD, RDA

Principal/Staff Engineer - Process Development, CVD/Diffusion

Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND

Electrical Engineer – Industrial Power

Process Technician

Mechanical Engineer

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

EMPLOYER

TALENT

COMPANY

Contact Us

JOBS BY SKILLS

JOBS BY FUNCTION

JOBS BY INDUSTRY

JOBS BY LOCATIONS

MODEL JOBS

JOBS BY CITY

WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.