MFG & Process DVL Engineer 2

F&B Storekeeper

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health

Operations Manager

Responsibilities: <ul><li>High-Speed Stamping Die Design – Hands-on experience in designing and developing high-precision, high-speed progressive dies, including strip layout, component design, tolerance management, die trials, troubleshooting, and prove-out.</li><li>DFM &amp; Product Understanding – Excellent DFM skills with strong knowledge of automotive product drawings, GD&amp;T, and customer specifications, converting product requirements into feasible stamping concepts.</li><li>Die Costing &amp; Project Management – Proficient in die cost estimation covering materials, machining, standard components, and tooling investment, with end-to-end project handling from RFQ and design through validation and PPAP.</li><li>Communication &amp; Negotiation – Strong communication and negotiation skills for effective customer, supplier, and cross-functional coordination, including technical discussions, change management, timelines, and cost negotiations</li><li>Demonstrate a proactive approach and apply lateral thinking to solve problems and improve processes.</li></ul> Requirements: <ul><li>Bachelor’s degree in mechanical engineering</li><li>Post Diploma in Tool design</li><li>Diploma in Tool making</li><li>5 to 10 years of relevant experience.</li><li>Proficient with CAD software – 3D modelling, 2D drafting, and assembly.</li><li>Proficient with MS Office tools.</li><li>Good knowledge in manufacturing processes.</li><li>Good communication skills for stakeholder interaction; proactive and capable of lateral thinking.</li></ul>

Responsibilities: Procurement &amp; System Management <ul><li>Operate procurement and inventory systems (e.g., Oracle, SAP, FMC, or equivalent) for:&nbsp;</li><li>Purchase orders verification</li><li>Goods Receiving Notes (GRN)</li><li>Invoice matching and accrual entries</li><li>Ensure all transactions are recorded accurately and in a timely manner</li><li>Coordinate with procurement and finance teams on pending deliveries and discrepancies</li></ul> Receiving &amp; Storage Operations <ul><li>Verify all incoming goods against PO specifications (quantity, quality, price)</li><li>Inspect deliveries for damages, temperature compliance, and expiry dates</li><li>Ensure proper storage according to category:&nbsp;</li><li>Chilled, frozen, and dry goods or general items</li><li>Maintain organized, hygienic, and compliant storage areas</li><li>Adhere to Dubai Municipality Food Code and HACCP requirements</li></ul> Inventory Management <ul><li>Maintain accurate inventory records and stock levels</li><li>Conduct stock counts</li><li>Investigate and report any variances, damages, or losses</li><li>Ensure strict adherence to FIFO / FEFO principles</li><li>Coordinate stock transfers between locations/assets when required</li></ul> Issuance &amp; Operations Support <ul><li>Issue stock to outlets based on approved requisitions</li><li>Ensure timely availability of stock to support park operations and events</li><li>Coordinate with kitchen, service, and stewarding teams for stock requirements</li><li>Support high-volume operations with efficient stock movement and replenishment</li></ul> Reporting &amp; Documentation <ul><li>Prepare inventory reports</li><li>Support month-end closing activities including:&nbsp;</li><li>Stock valuation</li><li>Accrual tracking</li><li>GRN reconciliation</li><li>Maintain proper documentation for audits and compliance checks</li><li>Use Excel for reporting, tracking, and reconciliation (advanced proficiency required)</li></ul> Health, Safety &amp; Compliance <ul><li>Ensure compliance with food safety standards, HACCP, and Food Watch requirements</li><li>Maintain proper temperature logs and storage conditions</li><li>Follow company HSE procedures and safety guidelines</li><li>Report any risks, damages, or unsafe practices immediately</li></ul> Physical &amp; Operational Requirements <ul><li>Handle physical movement of goods including lifting, carrying, and stacking</li><li>Ability to lift and move items up to 20–25 kg regularly</li><li>Operate safely in storage environments (chillers, freezers, warehouses)</li><li>Maintain high levels of energy and physical fitness to support operational demands</li></ul> Requirements: <ul><li>Education &amp; Experience: Bachelor’s degree in Hospitality, Leisure Management, or a related field, with 2–5 years of experience in F&amp;B storekeeping or inventory management; high-volume operations experience preferred.</li><li>Inventory &amp; Systems Expertise: Proficiency in Oracle, SAP, FMC, or equivalent inventory/procurement systems, with strong Excel skills and experience in GRN processing, invoice matching, accruals, and inventory reconciliation.</li><li>Food Safety &amp; Compliance: Strong knowledge of HACCP, food safety standards, FIFO/FEFO practices, audit compliance, and accurate inventory documentation.</li><li>Operational Performance: Ability to maintain inventory accuracy, ensure timely system transactions, reduce wastage/spoilage/expired stock, and optimize stock issuance and availability.</li><li>Core Competencies: Strong attention to detail, accountability, teamwork, time management, problem-solving, integrity, and effective communication with F&amp;B, Park Operations, HSE teams, suppliers, vendors, and regulatory bodies.</li></ul>

Responsibilities: <ul><li>Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging, Chip-on-Wafer (CoW), and Chip-to-Wafer (C2W) die stacking.</li><li>Improve product quality, yield, productivity, and manufacturing cost.</li><li>Drive process management projects supporting future technology nodes.</li><li>Evaluate, qualify, and implement new equipment and materials.</li><li>Establish process parameters for semiconductor manufacturing equipment.</li><li>Ensure robust quality through process monitoring, inspection, testing, SPC, DOE, and defect analysis.</li><li>Use data analytics to establish advanced process controls and identify improvement opportunities.</li><li>Collaborate with Package Integration, Assembly Engineering, Front-End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality teams.</li><li>Support seamless transition from product development through qualification into High Volume Manufacturing (HVM).</li><li>Provide Process of Record (POR) and Model of Record (MOR) documentation.</li></ul> Requirements: <ul><li>B.S./M.S./Ph.D. (or equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical discipline.</li><li>2+ years of semiconductor process development or equipment evaluation experience, preferably in wafer bonding, die stacking, or advanced packaging.</li><li>Proficiency in Python, R, and SQL.</li><li>Experience with Visual Basic for automation and tool integration.</li><li>Knowledge of E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System).</li><li>Strong data analytics capability supporting SPC, DOE, defect analysis, and dashboards.</li><li>Strong understanding of semiconductor process flows, yield, performance, and reliability.</li><li>Strong problem-solving and root-cause analysis skills.</li><li>Ability to work effectively under aggressive timelines and limited resources.</li></ul>

Responsibilities: <ul><li>Lead Media Health Manufacturing activities for DRAM, Interface Die, and stacked HBM products.</li><li>Optimize manufacturing test coverage for current and future HBM architectures and process nodes.</li><li>Develop, validate, characterize, and qualify next-generation HBM products.</li><li>Support design verification and circuit debug using CAD tools and Verilog simulations.</li><li>Improve manufacturing yield, reduce test time, and optimize device reliability.</li><li>Drive root-cause analysis and resolution of manufacturing test flow, qualification, and RMA issues.</li><li>Promote innovation in Design-for-Test (DFT), manufacturing strategy, and test optimization.</li><li>Mentor engineers and develop technical and project management capabilities within the team.</li><li>Lead technical decision-making, risk analysis, and project prioritization.</li><li>Collaborate with Fab, HBM Technology Development, Design, System Development, Test Solution Engineering, and Quality/Reliability teams.</li></ul> Requirements: <ul><li>Bachelors or Masters Degree in Electrical &amp; Electronics Engineering.</li><li>8+ years of semiconductor industry experience with Product Engineering experience preferred.</li><li>Strong leadership, circuit analysis, and root-cause problem-solving skills.</li><li>Knowledge of statistics, scripting, and data analysis tools.</li><li>Ability to adapt to technical leadership and people leadership responsibilities.</li><li>Proven collaboration across cross-functional engineering organizations.</li><li>Strong accountability, communication, and presentation skills.</li><li>Passion for mentoring and developing engineering talent.</li><li>Willingness to work onsite in Singapore and travel internationally (US, Taiwan, Japan).</li></ul>

Responsibilities: Policies and Procedures (10%): <ul><li>Develop and implement the manufacturing related policies and procedures in order to align with government regulation and corporate policy, organize the formulation of the responsibilities of management personnel at all levels, and optimize the internal structure and staffing.</li><li>Develop and implement assembly function budget and plan allocate function target to subordinates and monitor the achievement of the budget and overall performance in order to achieve targeted of Plant performance.&nbsp;</li></ul> People Management (15%): <ul><li>Allocate and balance work across direct reports&nbsp;&nbsp;</li><li>Review and provide timely performance feedback to direct reports&nbsp;&nbsp;</li><li>Mentor, develop and motivate them&nbsp;</li><li>Help resolve people/functional issues in the team&nbsp;</li><li>Submit manpower application and interview the candidates in order to achieve targeted department performance and retain key talent.&nbsp;</li></ul> Production (25%): <ul><li>Supervise and monitor the production activities and process&nbsp;</li><li>Help to solve critical production issues&nbsp;</li><li>Cooperate with other functions within molding department and other departments in getting necessary support in order to ensure the normal day-to-day production.&nbsp;</li></ul> Assembly (25%):&nbsp; <ul><li>Review the maintenance plan&nbsp;</li><li>Monitor the maintenance plan execution&nbsp;</li><li>Approve the Purchase Request for spare parts&nbsp;</li><li>Provide overall mold/Die/Tool maintenance instruction and monitor the execution in order to ensure the normal operation of die and improve daily operating efficiency.&nbsp;</li></ul> Equipment maintenance (5%): <ul><li>Review the maintenance plan&nbsp;</li><li>Monitor the maintenance plan execution&nbsp;</li><li>Approve the Purchase Request for equipment and parts&nbsp;</li><li>Provide overall equipment maintenance instruction and monitor the execution in order to ensure equipment operate reliably and improve daily operating efficiency.&nbsp;</li></ul> Engineering (10%):&nbsp; <ul><li>Allocate new projects to engineers&nbsp;</li><li>Monitor the new project process and control the cost and schedule&nbsp;</li><li>Provide cross functions/departments coordination&nbsp;</li><li>Help to solve critical technical issues in order to ensure the successful completion of the project.&nbsp;</li></ul> EHS (5%):&nbsp; <ul><li>Formulate and perfect the department EHS management system and operational procedures, and ensure the effective implementation.&nbsp;</li><li>Fully understand and implement EHS responsibilities to ensure EHS work in department meets relevant requirements&nbsp;</li><li>Set departmental and individual EHS performance targets according to laws and regulations and requirements of the company, and check and evaluate the completion of the targets regularly&nbsp;</li><li>Check the safety situation of production site regularly to eliminate all kinds of unsafe factors and prevent accidents.&nbsp;</li></ul> Project Management and Activity (10%):&nbsp; <ul><li>To reduce the costs and improve efficiency of the department, organize and plan key improvement projects, and monitor the implementation of these projects (Tebit Saving, Kaizen)&nbsp;</li><li>In order to improve and cooperate with the plant in implementing the excellent operation objectives, actively participate in training and use tools for improvement, such as VS Transformation, CCF, etc.</li></ul> Requirements: <ul><li>Bachelor and above Degree&nbsp;</li><li>Good English skills (written and oral)&nbsp;</li><li>Min. 10 years shopfloor management experiences in elec. Industry, above two years on managerial positions&nbsp;</li><li>Solid Lean/6 Sigma knowledge and project experiences&nbsp;</li><li>Familiar with quality system and tools&nbsp;</li><li>Rich experiences in operator training and development&nbsp;</li><li>Planning knowledge and experiences&nbsp;</li><li>Proficient PC skills.</li></ul>

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6 die stacking Jobs found

MFG & Process DVL Engineer 2

F&B Storekeeper

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Operations Manager

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MFG & Process DVL Engineer 2

F&B Storekeeper

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Operations Manager

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