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advanced packaging
advanced semiconductor packaging
python
six sigma
visual basic
advanced packaging integration
cable assembly
continuous improvement
doe
metrology & characterization

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Location

singapore, singapore
perai, malaysia
bac ninh province, vietnam
bandar baru enstek, malaysia
bangkok, thailand
dubai, united arab emirates
shanghai, china

Jobtitle

principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
associate engineer - factory innovation
customer quality engineer
ehs analyst iii
principal/staff engineer - process development, cvd/diffusion
process engineering manager (electroplating)
pse
senior engineer-advance quality

Filter

18 doe Jobs found

1-10 of 18
T

Singapore, Singapore

T

Thermal ManagementAdvanced Packaging IntegrationPackage ArchitectureAdvanced InterconnectsHeterogeneous IntegrationProcess Integration
P

Singapore, Singapore

P

Electroplating Process EngineeringElectrochemical EngineeringElectroplating EquipmentMetrology & CharacterizationReliability Engineering
S

Singapore, Singapore

S

Technical Documentation3D Quantum IntegrationCryogenic PackagingAdvanced PackagingThermal ManagementMechanical Design
E

EHS Analyst III

12 days ago

Perai, Malaysia

E

Environmental, Health & Safety (EHS) ManagementEHS Compliance & Regulatory AuditsRisk Assessment & Hazard IdentificationEmergency Response & PreparednessWaste Management
A

Bandar Baru Enstek, Malaysia

A

Quality & SafetyPeople ManagementManufacturing SkillsAutomationDigital ManufacturingFactory EngineeringContinuous Improvement
S

Dubai, United Arab Emirates

S

CommunicationTalent ManagementUae Labour LawPerformance ManagementProject Management
C

Bac Ninh Province, Vietnam

C

Six Sigma8DQualityFailure AnalysisReliability EngineeringCustomer Interface
S

Perai, Malaysia

S

FMEADOEApqp MethodQuality ControlCable AssemblyNpi Management

Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer