Manager - Training

Principal NAND Reliability Product Engineer

Staff/Principal Engineer - CMP Advanced NAND

Fronted End Central Process Integration Senior Engineer

Front End Central Product Integration (FE CPIE) MTS (FE)

MTS – FECOS CPIE Device

Manager I - R&D Product Development Engineering

Regional Manager – South India

AI Analytics and Visualization Engineer

Machine Learning Engineer Lead

Responsibilities: <ul><li>The job holder will be responsible to design, develop, deliver and administer training programs that enhance employee knowledge, skills, behaviours, and performance to support the company attain its strategic objectives.</li><li>Develop and implement comprehensive Training intervention programs that aligns with Talent Management strategy and overall development of the employees to address specific skill gaps.</li><li>Conduct needs assessment to identify skill gaps and training needs and create training programs that are designed to effectively improve performance and productivity of employees.</li><li>Plan the annual training calendar and delivery of Internal/ External trainings and development programs by rolling out suitable training programs that enhance employees’ skills and performance, increase productivity/ quality of work and meet the identified needs in alignment with the organizations values and culture.</li><li>Facilitate training and awareness sessions/ workshops for employees and leaders and maintain close communication with all to discuss training needs, training methodologies and solutions to ensure that they are fully aware of training opportunities available.</li><li>Deliver training sessions, workshops, and seminars to employees, ensuring content is engaging, relevant, and interactive.</li><li>Develop and manage the training budget to ensure that the best quality of trainings are provided within the established budget and ensure that resources are allocated effectively across all levels of the organization.</li><li>Identify and partner with external vendors to source training content and solutions as needed and measure performance to ensure that the organizations learning and development programs have access to the best training content and solutions available in the market.</li><li>Provide coaching and support to managers and leaders to help them develop their teams and support employee development.</li><li>Conduct post-training surveys to measure training program and vendor effectiveness and relevancy along with individual retention and adoption of learnings.</li></ul> Requirements: <ul><li>Bachelor’s degree in Business Administration with Major’s in Human Resources; Master’s degree- preferred</li><li>Professional certification in Assessment and Learning and/or CIPD in Learning and Development (level 3 or 5)- preferred</li><li>Certified Coach or Certified NLP (Neuro-Linguistic Programming) practitioner - preferred</li></ul>

Responsibilities: <ul><li>Define and implement NAND Flash reliability test flows to assess product reliability performance and prevent extrinsic/intrinsic reliability escapes.</li><li>Perform high volume statistical data analysis to evaluate NAND DPM/ intrinsic reliability risks and trends.</li><li>Drive electrical failure analysis, including advance characterization, to identify root causes and solution spaces.</li><li>Develop short term countermeasures such as targeted stresses and screens, applying knowledge of digital/analog circuits, device physics, and process engineering.</li><li>Qualify the product with innovative control measures to provide best in Class DPM and Cell reliability.</li><li>Collaborate closely with Fab, NAND Technology, NAND Design, Product Development, System Development, and Quality/Reliability teams to develop solutions and enable shipment of high quality end products.</li></ul> Requirements: <ul><li>Bachelor’s degree&nbsp;with &gt; 10 years or Master’s degree&nbsp;with &gt; 7 years or PhD with &gt; 5 years&nbsp;of relevant experience in Electrical Engineering or related field.</li><li>Experience in Semiconductor Reliability, NAND Technology, and Electrical Failure Analysis.</li><li>In depth background in NAND Design, Device Physics, Circuits,&nbsp;Process, Test, Validation.&nbsp;</li><li>Experience with application of AI tools, LLMs ,&nbsp;data analysis tools (e.g., Python, JMP, Tableau)</li><li>Strong statistical analysis, communication, and problem solving skills.</li><li>Experience in leading cross functional projects and mentoring&nbsp;junior engineers.</li><li>Strong analytical and problem solving skills.</li><li>Team player and self driver.</li></ul>

Responsibilities: <ul><li>As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of company memory parts.</li><li>Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts</li><li>Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications</li><li>Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions</li><li>Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes</li><li>Incorporate best known manufacturing methods into early development phase of upcoming nodes</li><li>Design and implement advanced process monitoring and control methodologies</li><li>Provide strategic roadmap for N+, N++ and future NAND Nodes</li><li>Serve as a technical expert within company contributing to technical projects for improvements to processes, procedures, and equipment</li><li>Define and leads complex, multi-functional projects of critical importance to company, helps to define strategic direction</li><li>Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers</li><li>This position requires communication and collaboration with partners both locally and globally. Strict adherence to company Intellectual Property Protection policy is necessary</li></ul> Requirements: <ul><li>PhD with ≥5 years, or Master’s degree with ≥7 years, or Bachelor’s degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field, with demonstrated expertise in semiconductor Experience in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication.</li><li>Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads</li><li>Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology</li><li>Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes</li><li>An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.</li><li>Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.</li><li>Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.</li><li>Strong collaboration and communication skills (verbal and written).</li><li>Self-driven, adaptable, and able to manage multiple projects.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</li><li>Proven ability to take calculated risks and execute novel solutions.</li><li>Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.</li></ul>

Responsibilities: <ul><li>Collaborate with multi-functional network teams from PIE, Process &amp; Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop.</li><li>May require travel to global company sites to foster collaboration and drive execution.</li><li>Communicate module related issues to the Fab engineering and leadership teams.</li><li>Design, execute, and analyze experiments to improve fab process, yield, and quality.</li><li>Collect and interpret complex data to optimize Fab processes and increase yields.</li><li>Engage and/or lead cross-area engineering teams to tackle process issues.</li><li>Work closely with global partners to stay ahead of on module related topics and process alignment projects.</li><li>Collaborate with other PI module owners and sister fabs to drive business process alignment</li><li>Partner with IE, Process and Equipment Engineering and Production to better forecast and balance yield, output and process issues</li><li>Promote network synergy through improved benchmarking and standardization of known engineering best-known methods (BKMs), business process.</li></ul> Requirements: <ul><li>Bachelor’s or advanced degree in Engineering or Science is required</li><li>Strong analytical, logical, and critical thinking skills</li><li>Effective communicator, able to collaborate across all levels</li><li>Growth mindset with a passion for continuous learning</li><li>Internship or experience in the semiconductor industry is a plus</li><li>Demonstrated leadership and a track record of impact are highly desirable</li><li>Interest in and knowledge of the semiconductor industry and company is preferred.</li></ul>

Responsibilities: <ul><li>Lead process integration (PI) structural uniformity and cross loop integration for critical modules (e.g., capacitance loop), owning end to end integration strategies to resolve yield, quality, and reliability gaps. </li><li>Drive physics&nbsp;and process based integration solutions through close collaboration with cross module process owners, PI subject matter experts, and key suppliers to optimise integration structures and achieve BIC yield and quality targets.</li><li>Develop and apply model based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry dependent effects) to diagnose structural non uniformity. Define, implement, and continuously strengthen critical inline monitoring and defence lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.</li><li>Own and advance product integration programs and loop level domain expertise, maintaining deep technical knowledge across node transitions. </li><li>Proactively drive node over node “shift left” integration, including early implementation of uniformity, bevel, and backside best known methods (BKMs) during development phases to accelerate whole wafer (centre-to-edge) yield and quality ramp.</li><li>Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and leveraging network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimization, and re engineering to improve benchmark performance, cycle time, and development productivity.</li><li>Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.</li></ul> Requirements: <ul><li>Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 10 years experience in process related role in the semiconductor industry.</li><li>With more than 7 years of relevant industry experience/knowledges.</li><li>Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front-end and backend assembly processes.</li><li>Good model-based problem solving, together with data-driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device-related issues, and address root cause.</li><li>Good organizational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to company sites as necessary for face-to-face collaboration.</li><li>Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.</li><li>Good multi-tasking, verbal and written communication skills.</li><li>Ability to apply baseline digital fluency and role appropriate AI literacy to use AI enabled tools responsibly and effectively for research, analysis, content creation, problem solving, operational tasks, and achieving business outcomes</li></ul>

Responsibilities: <ul><li>Enable technology ramp in high-volume production for CMOS and memory devices.</li><li>Improve device performance with a focus on variability reduction and robustness.</li><li>Support and execute design and test optimization to enhance manufacturability and performance.</li><li>Identify and implement process simplification and working methodology improvements.</li><li>Lead or actively contribute to cross-functional problem-solving for device, yield, and quality issues.</li></ul> Requirements: <ul><li>Minimum 5 years of relevant working experience is requiredA masters or Ph.Ddegree in Physics or Engineering areas is preferred.</li><li>Working experience in wafer fab process or process integration engineeringDirect experience in advanced CMOS device technology such as FinFET or GAA is preferable.</li><li>Proven knowledge in semiconductor physics and understanding of transistor operations, scaling limitations and reliability, basic knowledge of CMOS circuits and characterisation methods.</li><li>Understanding of wafer fabrication process areas, including tool sets, process mechanisms, tuning knobs, etc.</li><li>Excellent data analysis skills using software (JMP, SPOTFIRE, etc).</li><li>Strong task ownership, self-motivated to work with other team members to make progress collaboratively.</li><li>Open-minded attitude to learn new skills and could adapt to a new working environment swiftly.</li><li>Good digital literacy with MS OfficeProgramming capability such as Python is a plus.</li><li>Occasional international business travel is required for this position.</li></ul>

Role Description: <ul><li>Automotive Industry offers products for vehicle electrification systems like chassis systems, convenience applications, driver information, infotainment solutions, miniaturization solutions, motor and powertrain applications etc.&nbsp;</li><li>The client Automotive BU is focused on developing new and improved vehicle architecture approaches to efficiently address these challenges in Connectivity from power to propulsion and safety.&nbsp;</li><li>The Manager R&amp;D Product development contributes to the development of organizational strategy and supports in implementation of operational plans.</li><li>Being part of Product development team responsible to develop for new products and sustenance of existing product lines of Automotive business unit of client.</li><li>This position drives development of PCB connectors for automotive applications including Board to Board, Wire to Board and Flex to Board connectors.</li></ul> Responsibilities: <ul><li>Managing experienced professional and/or supervisors who exercise independence in their assignments and providing them with the required guidance and also be a strong technical contributor.</li><li>Providing strategic leadership to foster growth of the business.</li><li>Interacting and cooperating with multiple organizational levels to meet schedule and technical expectations.</li><li>Administrating schedules and ensuring performance requirements.</li><li>Providing knowledge of engineering tools such as Creo, etc. and product domain expertise in multiple projects.</li><li>Assist Inside Device Connectivity (InDeCo) engineering teams with New Product Developments across a range of projects and executing on cost optimization/reduction (VA/VE) opportunities for the business.</li><li>Preparing design verification test plans, Design &amp; Process FMEAs.</li><li>Successfully facilitate transfer and support of new product introduction (NPI) into high volume manufacturing.</li><li>Contributing to technical function initiatives across various initiatives.</li><li>Reverse Engineering and benchmarking of competitor products.</li><li>Support product environmental compliance and approvals for all new products and platforms as required by our customers.</li><li>Be a strong technical partner and provide support to Product management teams.</li><li>Attend/support customer meetings, technology days and site visits as required.</li></ul> Requirements: <ul><li>Master’s degree in mechanical engineering or equivalent is preferred with minimum 8 years of experience in related fields.</li><li>Mechanical or equivalent engineering Degree with minimum 10 years of related product development experience.&nbsp;</li><li>Experience with product design of PCB Connector such as Board to Board, Flex to Board, Wire to Board is essential.</li><li>Knowledge in product design of plastic, terminals (sheet metal), fine pitch connectors, rubber components.</li><li>Working knowledge of driving diversity and inclusion, customer/market focus, result orientation, managing multiple priorities, envisioning the future, coaching and developing people and collaborating across boundaries</li><li>Extensive experience executing plans in a disciplined way and in holding people accountable.</li><li>Organized, methodical and self-motivated individual.</li><li>A person with the ability to achieve goals and the highest standards of performance in a dynamic fast paced environment.</li><li>Attention to detail and on time delivery.</li><li>Excellent judgment, timely and high-quality decision-making skills.</li><li>Proven ability to execute engineering deliverables.</li><li>Strong customer service mindset and mentality of delivering quality products and services on time and within company cost and profitability objectives.</li><li>Fluent communication skills facilitate collaboration with own team, customers, internal business leaders and technology leaders to create value.</li><li>Individual must be self-motivated, have strong planning skills and be able to deal with and balance multiple competing priorities.</li></ul> Functional: Mandatory: <ul><li>Working knowledge of product development (Processes, Approaches, Tools and Techniques) &amp; Validation</li><li>Working knowledge of manufacturing processes like injection Mold, plating, assembly &amp; High-speed stamping</li><li>Working knowledge to apply Six Sigma / DFSS methodology to design, development, and delivery of technology products and process.</li><li>Working knowledge in use of CAD systems (CREO Part modeling &amp; Sheet Metal)</li><li>Interpretation of simulation results &amp; translating into product design</li><li>Working knowledge in Design for Manufacturability (DFM) &amp; FMEA&nbsp;</li><li>Proficient in Tolerance stack-up and GD&amp;T</li><li>Ability to generate design concepts and solve design problems&nbsp;</li><li>Working knowledge in prototyping methods</li><li>Working knowledge in Manufacturing process (Molding / Stamping / Plating)</li><li>Understanding of linear and non-linear analysis</li><li>Working knowledge of product life cycle.</li><li>Basic Knowledge in quality tools (8D, Why Why analysis, Fish bone….)</li><li>Awareness of recognition &amp; protection of IP (intellectual property) features</li><li>Basic knowledge of PPAP documentation.</li></ul> Preferred: <ul><li>Knowledge of customer application&nbsp;</li><li>Experience in development of automotive signal and power connectors.</li></ul> Department specific: <ul><li>Exposure to PCB Connector design</li><li>Ability to understand specifications for validation as per US CAR / LV 214 / Similar Specification</li><li>Knowledge about crimping technologies, Ultrasonic welding technologies, Laser welding technologies</li></ul>

Role Description: <ul><li>Responsible for sales and business development for Two-Wheeler (2W) OEM customers within clients Automotive Business Unit.</li><li>Drive key account growth, customer acquisition, and execution of Component Aggregate Manufacturer (CAM) and Harness Maker (HM) development strategies.&nbsp;</li></ul> Responsibilities:&nbsp; <ul><li>Drive revenue growth for assigned 2W OEM accounts across Karnataka &amp; Tamil Nadu Region</li><li>Develop and execute account strategies aligned with Automotive BU objectives</li><li>Maintain strong relationships with key stakeholders across OEMs including procurement, engineering, and program teams&nbsp;</li><li>Identify and develop new business opportunities with 2W OEMs and emerging EV players&nbsp;</li><li>Lead Component Aggregate Manufacturer (CAM) engagement activities including RFQs, pricing, negotiations, and contract closure&nbsp;</li><li>Collaborate with engineering and product teams for new product introductions and customization&nbsp;</li><li>Drive Harness Maker (HM) ecosystem development for increased wallet share&nbsp;</li><li>Track market trends, competitor activity, and customer strategy in 2W segment&nbsp;</li><li>Ensure accurate sales forecasting and pipeline management&nbsp;</li><li>Drive design-in activities and support project lifecycle from concept to SOP</li><li>Intensive travel &amp; expected to be at customer’s location (more than 75% working days) within Karnataka &amp; Tamil Nadu Region</li></ul> Key Performance Indicators (KPIs)&nbsp; <ul><li>Retention and growth of existing business across assigned accounts&nbsp;</li><li>Comprehensive competition mapping and strategic counter-planning&nbsp;</li><li>Deep understanding and effective promotion of our client portfolio&nbsp;</li><li>Driving new product development (NPD) aligned with customer needs&nbsp;</li><li>Achieve and exceed revenue growth targets year-on-year&nbsp;</li><li>Maintain healthy Accounts Receivable (AR) and ensure timely collections&nbsp;</li><li>Build and sustain a strong 5-year revenue pipeline&nbsp;</li><li>Identify, understand, and capitalize on future trends in the 2W (ICE &amp; EV) industry&nbsp;</li><li>Increase our client content per vehicle/platform&nbsp;</li><li>Coordinate with cross-functional teams (CFTs) to drive new project wins and execution&nbsp;</li><li>Strong understanding of 2W ICE and EV architectures to enable solution selling&nbsp;</li></ul> Requirements:&nbsp; Qualifications &amp; Experience&nbsp; <ul><li>Bachelor’s degree in Engineering (Mechanical/Electrical/Electronics preferred); MBA is a plus&nbsp;</li><li>5-10 years of experience in automotive sales/business development&nbsp;</li><li>Strong exposure to Two-Wheeler OEMs in India&nbsp;</li><li>Experience in connectors, wiring harness, or automotive components preferred&nbsp;</li><li>Proven track record in key account management and business growth&nbsp;</li></ul> Skills&nbsp; <ul><li>Strong negotiation and influencing skills&nbsp;</li><li>Excellent relationship management&nbsp;</li><li>Strategic thinking and execution&nbsp;</li><li>Technical understanding of automotive electrical/electronic systems&nbsp;</li><li>Strong communication and presentation skills&nbsp;</li></ul>

Role Description: <ul><li>The AI Analytics &amp; Value Realization Engineer is responsible for ensuring AI initiatives deliver measurable business value across ICT Engineering.</li><li>The role establishes value measurement frameworks, validates benefits, develops performance dashboards, and enables data-driven decision making across the AI portfolio. This position serves as the primary subject-matter expert for AI adoption measurement, business impact reporting, value realization tracking, and portfolio analytics</li></ul> Responsibilities: Value Definition &amp; Business Case Support <ul><li>Partner with AI Transformation Engineers during opportunity assessments.</li><li>Establish baseline metrics, value hypotheses, and expected business outcomes.</li><li>Define standardized measurement methodologies and evidence requirements for AI initiatives, distinguishing between forecast, validated, realized, and sustained business value.</li><li>Develop approaches for measuring engineering productivity and operational benefits, including time savings, cycle-time reduction, quality improvement, throughput, and adoption where direct financial measurement is not feasible.</li><li>Challenge assumptions and ensure value estimates are fact-based and measurable.</li></ul> Portfolio Measurement &amp; Reporting <ul><li>Develop and maintain AI portfolio dashboards and KPI reporting.</li><li>Track solution adoption, utilization, and business impact.</li><li>Collect and analyze deployment performance data.</li><li>Ensure consistent reporting across all AI initiatives.</li><li>Generate monthly reporting for ICT Engineering leadership, ICT AI leadership, and segment AI leadership.</li></ul> Value Realization &amp; Validation <ul><li>Validate achievement of project objectives and business benefits.</li><li>Monitor sustainability of realized benefits after deployment.</li><li>Identify underperforming initiatives and recommend corrective actions.</li><li>Support prioritization decisions using objective performance and value data.</li><li>Develop standardized value realization methodologies and reporting processes.</li><li>Design measurement approaches that compare pre- and post-deployment performance and provide credible evidence that observed improvements are attributable to deployed solutions.</li></ul> Advanced Analytics <ul><li>Perform portfolio analytics and trend analysis.</li><li>Support executive decision-making with actionable insights.</li><li>Maintain data quality and governance standards for AI program reporting.</li><li>Build Power BI dashboards and reporting solutions.</li></ul> Requirements: Experience &amp; Qualifications <ul><li>Bachelors degree in Engineering, Data Analytics, Business Analytics, Statistics, or related field.</li><li>Experience with analytics and visualization tools such as Power BI, including dashboard development, KPI reporting, and data analysis.</li><li>Strong analytical and quantitative problem-solving skills.</li><li>Experience developing and maintaining business metrics and measurement frameworks.</li><li>Experience establishing performance baselines and designing measurement approaches to evaluate the impact of implemented solutions.</li><li>Ability to translate complex data into actionable business insights.</li><li>Knowledge of engineering, technology, or transformation programs preferred.</li><li>Strong communication and executive presentation skills.</li></ul>

﻿Responsibilities: &nbsp;<ul><li>Lead, mentor, and grow a team of 4-5 ML engineers.</li><li>Provide architectural direction and code-level guidance.</li><li>Establish engineering best practices for ML system design, testing, and deployment.</li><li>Conduct design reviews, performance reviews, and technical roadmap planning.</li><li>Architect distributed ML systems serving multiple global products.</li><li>Standardize infrastructure patterns for LLM serving and retrieval systems.</li><li>Define and implement enterprise-ready agentic frameworks.</li><li>Architect multi-step reasoning systems.</li><li>Lead decisions on deterministic workflows vs. autonomous agents.</li><li>Implement guardrails, safety layers, and traceability mechanisms.</li><li>Develop evaluation frameworks to measure reasoning quality, hallucination rates, and reliability.</li><li>Establish CI/CD standards for ML lifecycle management.</li><li>Ensure compliance with enterprise data governance and responsible AI standards.</li></ul>&nbsp;Requirements &nbsp;<ul><li>8-10 years of Machine Learning/Software Engineer experience</li><li>2-3 years of people management experience.</li><li>Master’s degree or bachelors degree, computer science degree is highly desirable.</li><li>Strong software engineering background with experience in building system design, architecting AI feature/products that caters large number of users and deals with large volume of unstructured data.</li></ul>

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196 dynamics design Jobs found

Manager - Training

Principal NAND Reliability Product Engineer

Staff/Principal Engineer - CMP Advanced NAND

Fronted End Central Process Integration Senior Engineer

Front End Central Product Integration (FE CPIE) MTS (FE)

MTS – FECOS CPIE Device

Manager I - R&D Product Development Engineering

Regional Manager – South India

AI Analytics and Visualization Engineer

Machine Learning Engineer Lead

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196 dynamics design Jobs found

Manager - Training

Principal NAND Reliability Product Engineer

Staff/Principal Engineer - CMP Advanced NAND

Fronted End Central Process Integration Senior Engineer

Front End Central Product Integration (FE CPIE) MTS (FE)

MTS – FECOS CPIE Device

Manager I - R&D Product Development Engineering

Regional Manager – South India

AI Analytics and Visualization Engineer

Machine Learning Engineer Lead

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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WhiteCrow is on a mission to connect companies with the best talent across the globe.