VP Security Engineer (AS400)

Senior Production Support Engineer – IDM Engineering (VP2)

Staff / Senior Engineer Electrical?Facility Engineer)

Process Engineer(Functional Litho & Acoustic Litho)

CMP Equipment Engineer

Engineer, Staff/Manager (Wet Etch / Electroplating)

Engineer, Senior (Process Development -Microacoustics Lithography)

R&D/Product Dvl Engineer II

Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Staff/Principal Engineer, NAND TD, RDA

Responsibilities: <ul><li>Design, develop, deploy, maintain, and enhance infrastructure security capabilities for AS400 and Mainframe platforms.</li><li>Support day-to-day operations of the bank’s security suite of products with a focus on AS400 and Mainframe.</li><li>Manage and execute security related change requests related to AS400 and Mainframe systems.</li><li>Develop and maintain documentation including Security Standards, Access Control Baselines, and operational processes.</li><li>Identify and implement automation opportunities for AS400 System &amp; Security Administration.</li><li>Collaborate with Business and Systems Services teams to align infrastructure and application requirements with GIS-managed security solutions.</li><li>Provide production support and monitoring to ensure control efficacy and solution reliability.</li><li>Conduct product research, define requirements, and perform technical Proof of Concept for new security initiatives.</li><li>Contribute to the development and maintenance of AS400 security policies, standards, and procedures to ensure regulatory compliance and alignment with industry best practices.</li><li>Respond to audit and regulatory requests with timely and accurate information.</li></ul> Requirements: <ul><li>Diploma/Degree in Engineering/Computer Science/IT/Cyber Security from a recognized education institution</li><li>Professional security related qualifications (e.g., CISSP, CISA, CISM, etc.) will be favorable although not mandatory</li><li>At least 5 years of relevant experience in performing AS400 Security Administration and/or management of AS400 Application systems, with strong analytical and problem solving skills</li><li>Experience in managing projects (preferably AS400 related projects)</li><li>Hands on experience with AS400-related programming languages</li><li>Proven experience leading relevant security programs in large organizations</li><li>Strong understanding of regulatory requirements such as MAS TRM, PCI DSS, etc.</li></ul>

Responsibilities: <ul><li>Engage in day-to-day support activities including incident and problem management</li><li>Perform production deployments, patch activities on the supported applications and servers.</li><li>Work with product support/development team for permanent resolution/change review – all types including enhancements, bug fixes, etc.</li><li>Work with level 1 support in application knowledge transfer in establishing standard first level recovery process/system health check monitoring/scheduled activities as well as common application user queries.</li><li>Collaborate with internal stakeholders like application, business, infrastructure, security, and operations to continuously improve the stability of applications.</li><li>Develop support operational documents to summarize common support issues.</li><li>Develop reports and drive audit RFI’s and requirements.</li><li>Develop Linux scripts based on the requirements.</li><li>Provide after office hours’ standby support and for emergency recoveries, including managing major incident of critical services.</li><li>Expected to drive improvements through influence and strong relationships with managers in other teams.</li><li>Correlate events across multiple systems to proactively surface and resolve deep, underlying issues.</li></ul> Requirements: <ul><li>Diploma/Degree in engineering/Computer Science / IT/Cyber Security from a recognized education institution</li><li>Professional qualification in information security, such as CISSP / CISM / CEH, or data Security product certifications will be advantageous.</li><li>9 to 12 years relevant experience</li><li>Strong working knowledge on Oracle Identity Governance 12c, Oracle Database, WebLogic, BI Publisher, Oracle Connectors, Linux, Unix &amp; Windows Enterprise Server OS, with mixed skills around administration, performance tuning and troubleshooting</li><li>Working knowledge of Python, java, Java Scripts,</li><li>Knowledge in network infrastructure like Load balancers, Firewalls, SSL etc</li><li>Working Knowledge on Directory - LDAP and AD Databases</li><li>Strong knowledge of Oracle SQL and proficient in writing complex SQL queries with hands on experience with reporting tools along with excellent computational ability.</li><li>Strong understanding of cybersecurity principles and frameworks including ISO 27001 &amp; NIST Cybersecurity Framework;</li></ul>

Responsibilities: Operate &amp; Maintenance: <ul><li>Leads safe, compliant operation and maintenance of electrical infrastructure, establishes and controls MOS/SOP with strong change management, maintains accurate technical documentation, partners with Engineering, Operations, and EHS on regulatory compliance, drives risk and safety programs (FMEA, LOTO, arc flash, permits), and ensures full standards compliance and audit readiness.</li></ul> Reliability &amp; Risk Management: <ul><li>Drives root cause analysis for electrical disturbances, leads predictive and preventive maintenance programs, and strengthens system reliability to minimize unplanned downtime.</li></ul> Capacity Planning &amp; Tool Install: <ul><li>Plans and manages electrical load models across fab and facilities operations, ensures proper feeder loading, redundancy, and diversity, and reviews/approves designs while overseeing safe energization and commissioning.</li></ul> Projects &amp; Commissioning: <ul><li>Define acceptance criteria, test protocols, and witness critical tests.</li><li>Manage vendor performance and ensure documentation close out (O&amp;Ms, as builts).</li></ul> Power Quality &amp; Energy Performance: <ul><li>Monitor PQ and deploy mitigations (filters, SEMI F47 ride through, UPS tuning).</li><li>Drive energy efficiency projects (e.g., transformer loading optimization, UPS efficiency, busway losses, smart metering analytics).</li></ul> Requirements: <ul><li>At least a Bachelor’s degree in Electrical Engineering or equivalent.</li><li>Minimum 6 years of related work experience in Electrical Engineering within wafer fab/semiconductor</li><li>Experience in high volume manufacturing of electronics components in an MNC or semi-conductor industry.</li><li>Direct working experience in wafer fab facilities will be added advantage.</li><li>Possess strong technical competencies in his field of study.</li><li>Able to work under pressure and with strong commitment at work.</li><li>Experience with software applications such as MS Power Point, Excel and Word.</li></ul>

Responsibilities: <ul><li>Drive/contribute in cost reduction, weed out unwarranted expenses/wastages, find alternative sources and improve processes with innovative solutions to raise efficiency.</li><li>Drive/contribute in quality investigations and continuous improvement programs to resolve chronic process and quality issues, and institute permanent resolutions to assure product quality and enhance process robustness.</li><li>Enforce on line controls and execution to conform to work instructions and procedures.&nbsp;</li><li>Apply hands-on and with deep involvement at work.</li><li>Monitor and analyse SPC charts and drive process control improvements.</li><li>Effective and timely disposition of on hold lots.</li><li>Regular reviews of OCAP, FMEA and Control Plans.</li><li>Ensure timely update of procedures and effective implementations.</li><li>Guide and train technicians in processes and problem solving and analysis to build up their technical competencies and achieve self-sustenance.</li><li>Take accountability of work and possesses strong sense of responsibility and team work.</li><li>Ensure non-conformance is dealt with in a proper and effective manner.</li><li>Establish, review and perform regular update of FMEA, OCAP, Process control, Risk Assessment and SIPOC on all critical processes to ensure a robust process.</li><li>Compliance with CSR, EHS, QM, ESD, 5S standard and cleanroom protocol.</li></ul> Requirements: <ul><li>Minimum Bachelor’s degree in Physics / Chemistry / Material Science/ Mechanical / Electronic or Electrical Engineering or equivalent.</li><li>Knowledge on semiconductor process technology.</li><li>Possess strong technical competencies in his field of study.</li><li>Good knowledge of statistical and quality tools.</li><li>Able to work under pressure and with strong commitment at work.</li><li>Experience with software applications such as MS Power Point, Excel and Word.</li><li>Experience with Lithography tools (Optional)</li></ul>

Responsibilities: <ul><li>Drive/contribute in cost reduction, weed out unwarranted expenses/wastages and improve equipment performance.</li><li>Drive/contribute in equipment fault investigations and continuous improvement programs to resolve chronic equipment issues, and institute permanent resolutions to assure product quality and enhance process robustness.&nbsp;</li><li>Enforce on equipment maintenance controls and execution to conform to work instructions and procedures. </li><li>Apply hands-on and with deep involvement at work.&nbsp;</li><li>Guide and train technicians in equipment problem solving and analysis to build up their technical competencies and achieve self-sustenance.&nbsp;</li><li>Provide effective equipment trainings to the technicians to build up their technical and skill competencies.&nbsp;</li><li>Ensure non-conformance is dealt with in a proper and effective manner.&nbsp;</li><li>Take accountability of work and possesses strong sense of responsibility and team work.&nbsp;</li><li>Manage and control spare parts availability and costs.&nbsp;</li><li>Manage vendor services and supports and ensuring compliance with factory protocol.&nbsp;</li><li>Establish, review and perform regular update of PM procedures, Risks Assessments and Troubleshooting guidelines.&nbsp;</li><li>Create technical specification for new and transferred equipment.&nbsp;&nbsp;</li><li>Execute the equipment move-in, installation, set up and buy-off, meeting set timelines.&nbsp;</li><li>Compliance with CSR, EHS, QM, ESD, 5S standard and cleanroom protocol.</li></ul> Requirements: <ul><li>Minimum Bachelor’s degree in Electronic or Electrical /Mechanical Engineering or equivalent.</li><li>Knowledge in semiconductor process technology.&nbsp;</li><li>Possess strong technical competencies in his field of study.&nbsp;</li><li>Good knowledge of statistical and quality tools.&nbsp;</li><li>Able to work under pressure and with strong commitment at work.&nbsp;</li><li>Experience with computer systems and proficient with software applications such as MS Power Point, Excel and Word.</li></ul>

Responsibilities: <ul><li>Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes</li><li>Manage and develop a team of engineers and technicians in a high volume manufacturing environment</li><li>Drive excellence in output, quality, cost, equipment uptime, and safety</li><li>Ensure robust process control, stability, and integration across wet etch and plating operations</li><li>Lead root cause investigations for process, quality, and equipment issues and drive permanent corrective actions</li><li>Drive yield improvement, scrap reduction, and defect reduction through data driven analysis</li><li>Ensure high equipment availability and reliability, particularly for wet benches and plating tools</li><li>Apply and sustain SPC and statistical analysis tools to monitor and improve process performance</li><li>Actively contribute to continuous improvement programs to resolve chronic manufacturing or quality issues</li><li>Work closely with cross functional teams including Process Integration, Equipment, Quality, and Manufacturing</li><li>Provide technical and operational leadership during crisis situations impacting fab operations</li><li>Ensure strict compliance with EHS requirements, quality systems, cleanroom discipline, and wafer fab protocols</li></ul> Requirements: <ul><li>Bachelor’s degree in Engineering, Chemistry, Materials Science, Physics, or related discipline</li><li>Minimum 10 years of relevant experience in semiconductor wafer fabrication</li><li>Strong hands on technical expertise in Wet Etch, Electroplating, and related wet processes</li><li>Prior experience in high volume semiconductor manufacturing within an MNC environment</li><li>Strong understanding of:</li><li>Process integration</li><li>Statistical Process Control (SPC)</li><li>Yield improvement and scrap reduction methodologies</li><li>Equipment maintenance strategies for wet benches and plating tools</li><li>Proven people management experience, including coaching, talent development, succession planning, and manpower deployment</li><li>Demonstrated ability to lead root cause analysis and corrective action implementation</li><li>Strong sense of ownership with the ability to work effectively under pressure</li><li>Hands on leadership style with strong problem solving and decision making capabilities</li><li>Excellent communication and cross functional collaboration skills</li><li>Familiarity with statistical analysis tools, Excel, PowerPoint, and Word</li><li>Strong commitment to Environmental Health &amp; Safety (EHS), quality systems, and fab compliance</li></ul>

Responsibilities: Technology Development: <ul><li>Lead and/ or co-work with global process cluster on the development of next generation lithography for microacoustics filter and wafer-level packaging from concept to qualification and manufacturing release.</li><li>Define process requirements, success criteria, design of experiments (DOE), and characterization plans.</li><li>Drive root cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.</li><li>Translate product requirements into process specifications and control strategies.</li></ul>&nbsp;Technology Transfer &amp; Ramp: <ul><li>Work with project leader on technology transfer – from pilot line to high volume manufacturing. Adapts to shifting priorities while ensuring deadlines are met.</li><li>Lead and drive technical discussions to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.</li><li>Work with process cluster on establishing critical process windows, statistical control limits, and ramp readiness criteria.</li><li>Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.</li></ul> Requirements: <ul><li>Bachelor’s or Master’s degree in Engineering (Materials Science, Chemical Engineering, Microelectronics or related fields).</li><li>4+ years of experience in industry environment with broad lithography exposure in handing KrF/ I-line scanner</li><li>Hand-on experiences in metrology including CD-SEM, Overlay, etc.</li><li>Strong lithography skills set on lithography theory, characteristics of photo-resist and corresponding applications, process set-up, optimization and margin improvement.</li><li>Strong skills in DOE, SPC, data analytics, FMEA, troubleshooting.</li><li>Excellent communication, technical documentation, and stakeholder management skills.</li></ul>

Responsibilities: <ul><li>Subject matter expert in signal integrity design, simulation and validation activities through product development cycles</li><li>Establishing signal integrity design performance/functional requirements for new products</li><li>Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.</li><li>Performing PCB design schematic and layout reviews</li><li>Creating actionable recommendations based upon design reviews and simulation results</li><li>Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement.</li></ul> Requirements: <ul><li>Bachelor’s degree in Electrical Engineering.</li><li>Experience with interconnect design or experience with connector &amp;/or cable/cable assembly design (high speed twinax/RF cables, direct attach copper (DAC) cables)</li><li>Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent)</li><li>A solid understanding of electromagnetic theory and electrical circuit behavior</li><li>Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.</li><li>Familiarity with printed circuit board design, fabrication and assembly.</li><li>Excellent verbal and written communication skills</li><li>Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies</li><li>Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English</li><li>Individual must be highly motivated, a quick learner, and able to work independently</li></ul>

Responsibilities: <ul><li>Technical Expertise: Capable to provide manual cuts along with building skills for future automated FIB cuts&nbsp;</li><li>Analytical Skills: Strong data analysis and problem-solving abilities.</li><li>Equipment Management: Set up equipment, monitor stability, improve capability, and interact with vendor representatives for advanced functionality and application work.</li><li>Recipe Management: Write or modify equipment recipes to support the needs of the RDA area.</li><li>Tool Recovery: Perform basic and advanced recoveries of down tools for assigned workstations.</li><li>Software Upgrades: Drive software upgrades and improvements, working with internal and external vendors for implementation.</li><li>Tool Monitoring: Monitor tool qualification SPC charts for deviations, initiate tool repairs, and adjust limits as necessary.</li><li>Data Science skills: Apply scripting, coding, or programming for monitoring performance and capabilities of the inspection data</li><li>Data Analysis: Collect and analyze tool/process data to suggest ways to improve performance and efficiency.</li><li>Collaboration: Collaborate with vendors for escalation results on application issues and with Equipment Owners to identify long-term solutions to tool issues.</li><li>Communication: Excellent verbal and written communication skills for effective vendor and team interactions.</li><li>Project Management: Ability to manage multiple projects and priorities effectively.</li></ul> Requirements: Application Expertise:&nbsp;<ul><li>Deep technical expertise in Focused Ion Beam (FIB) operations, including advanced cross sectioning, milling optimization, and defect characterization</li><li>Strong proficiency in SEM imaging and interpretation for systematic/random defect identification</li></ul> Training and Mentoring:&nbsp;<ul><li>Proven experience in training and mentoring engineers and technicians</li></ul> Vendor Relations: <ul><li>Experience working with vendors for FIB/SEM equipment setup, troubleshooting, and upgrades &gt;3years</li></ul> Education:&nbsp;<ul><li>Bachelor’s or Masters Degree in Electrical Engineering, Chemical Engineering, Materials Science &amp; Engineering, or related field accepted</li></ul> Experience: <ul><li>More than 5 years semiconductor manufacturing experience in RDA/inspection recipe setup for defect analysis&nbsp;</li></ul>

Responsibilities: <ul><li>Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes.</li><li>Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects.</li><li>Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR).</li><li>Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions.</li><li>Architect inspection recipes and sampling strategies; optimize sensitivity, throughput, and cost of ownership.</li><li>Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield.</li><li>Influence supplier roadmaps; evaluate, qualify, and release next gen optical/e-beam inspection capabilities.</li><li>Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites.</li><li>Mentor, coach, and upskill engineers; develop succession plans and technical ladders within the RDA domain.</li><li>Champion safety and continuous improvement (CIP); drive kaizen/lean initiatives that improve cycle time and learning velocity.</li></ul> Requirements: <ul><li>Bachelor’s degree with 7+ years relevant semiconductor experience, or Master’s/PhD with 5+ years.</li><li>Minimum 3+ years hands-on RDA experience in semiconductor manufacturing or equipment engineering.</li><li>Demonstrated expertise in defect inspection, process monitoring, and yield learning.</li></ul> Technical Competencies <ul><li>Realtime Defect Analysis (RDA) systems and workflows.</li><li>Optical and e-beam inspection technologies.</li><li>Statistical data analysis, correlation development, and large dataset interpretation.</li><li>Semiconductor process integration and technology development.</li><li>Root cause analysis and systematic problem solving (e.g., 8D, DMAIC).</li><li>Leadership &amp; Behavioral Competencies</li><li>Recognized technical authority with the ability to influence without direct authority.</li><li>Strong mentoring and coaching mindset with proven talent development outcomes.</li><li>Clear, concise communication skills across technical and executive audiences.</li><li>Ownership-driven, execution-focused; comfortable operating in ambiguity.</li><li>Impact &amp; Success Measures</li><li>Reduced defect-related yield loss and faster learning cycles.</li><li>On-time qualification and adoption of next-generation inspection capabilities.</li><li>Uplift in organizational RDA skill depth and succession pipeline.</li><li>Alignment of inspection strategy and capability to future NAND nodes.</li></ul>

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180 energy engineer gm Jobs found

VP Security Engineer (AS400)

Senior Production Support Engineer – IDM Engineering (VP2)

Staff / Senior Engineer Electrical?Facility Engineer)

Process Engineer(Functional Litho & Acoustic Litho)

CMP Equipment Engineer

Engineer, Staff/Manager (Wet Etch / Electroplating)

Engineer, Senior (Process Development -Microacoustics Lithography)

R&D/Product Dvl Engineer II

Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Staff/Principal Engineer, NAND TD, RDA

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180 energy engineer gm Jobs found

VP Security Engineer (AS400)

Senior Production Support Engineer – IDM Engineering (VP2)

Staff / Senior Engineer Electrical?Facility Engineer)

Process Engineer(Functional Litho & Acoustic Litho)

CMP Equipment Engineer

Engineer, Staff/Manager (Wet Etch / Electroplating)

Engineer, Senior (Process Development -Microacoustics Lithography)

R&D/Product Dvl Engineer II

Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Staff/Principal Engineer, NAND TD, RDA

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WhiteCrow is on a mission to connect companies with the best talent across the globe.