Manager - Training

Principal/Staff Engineer – Firmware Development

Principal NAND Reliability Product Engineer

Staff/Principal Engineer - CMP Advanced NAND

Fronted End Central Process Integration Senior Engineer

Front End Central Product Integration (FE CPIE) MTS (FE)

MTS – FECOS CPIE Device

VP, Senior Data Engineering Manager

Manager I - R&D Product Development Engineering

Regional Manager – South India

Responsibilities: <ul><li>The job holder will be responsible to design, develop, deliver and administer training programs that enhance employee knowledge, skills, behaviours, and performance to support the company attain its strategic objectives.</li><li>Develop and implement comprehensive Training intervention programs that aligns with Talent Management strategy and overall development of the employees to address specific skill gaps.</li><li>Conduct needs assessment to identify skill gaps and training needs and create training programs that are designed to effectively improve performance and productivity of employees.</li><li>Plan the annual training calendar and delivery of Internal/ External trainings and development programs by rolling out suitable training programs that enhance employees’ skills and performance, increase productivity/ quality of work and meet the identified needs in alignment with the organizations values and culture.</li><li>Facilitate training and awareness sessions/ workshops for employees and leaders and maintain close communication with all to discuss training needs, training methodologies and solutions to ensure that they are fully aware of training opportunities available.</li><li>Deliver training sessions, workshops, and seminars to employees, ensuring content is engaging, relevant, and interactive.</li><li>Develop and manage the training budget to ensure that the best quality of trainings are provided within the established budget and ensure that resources are allocated effectively across all levels of the organization.</li><li>Identify and partner with external vendors to source training content and solutions as needed and measure performance to ensure that the organizations learning and development programs have access to the best training content and solutions available in the market.</li><li>Provide coaching and support to managers and leaders to help them develop their teams and support employee development.</li><li>Conduct post-training surveys to measure training program and vendor effectiveness and relevancy along with individual retention and adoption of learnings.</li></ul> Requirements: <ul><li>Bachelor’s degree in Business Administration with Major’s in Human Resources; Master’s degree- preferred</li><li>Professional certification in Assessment and Learning and/or CIPD in Learning and Development (level 3 or 5)- preferred</li><li>Certified Coach or Certified NLP (Neuro-Linguistic Programming) practitioner - preferred</li></ul>

Responsibilities: SUPPORT CUSTOMERS AND DEBUG FIRMWARE <ul><li>Customer engineering support: Act as the primary technical escalation point for Security Firmware on SSD products — triage, prioritize, and drive customer reported security issues to closure within committed response times</li><li>Security feature enablement: Guide customers through the configuration, integration, and validation of SSD security features; including, but not limited to: TCG Opal/Pyrite/Ruby and Enterprise SSC, ATA and NVMe security commands, self-encrypting drive operation, secure boot and signed firmware update, sanitize and cryptographic erase, key management, and device attestation</li><li>Debug and root cause analysis: Reproduce customer, qualification, and field failures in the lab; analyze firmware logs, traces, and bus captures; debug Security Firmware source; and deliver documented root cause and corrective action</li><li>Firmware fixes and validation: Develop, unit test, and functionally validate targeted Security Firmware changes and customer specific configurations and builds, ensuring each change meets the security, functional, performance, and quality/reliability requirements of the technical spec matrix before release</li><li>Vulnerability and incident response: Assess the impact of reported vulnerabilities and security findings on products already in the field, and support mitigation planning, remediation delivery, and customer disclosure</li><li>Customer qualification and compliance support: Support customer security audits, security questionnaires, and certification activities (e.g. TCG specification compliance, FIPS 140-3, Common Criteria), and produce the application notes, integration guides, and technical documentation customers depend on</li></ul> STAKEHOLDER MANAGEMENT <ul><li>Represent our client in direct technical engagement with customer engineering teams, translating Security Firmware behavior, constraints, and risk into terms that are clear to both engineering and non-engineering audiences</li><li>Dedicatedly provide to management, multi-functional team members, and the firmware team consistent, detailed, and properly summarized information regarding customer issues, escalation status, and the progress of firmware fixes</li><li>Maintain accurate issue records, root cause reports, and knowledge base content so that recurring customer questions are answered faster over time</li></ul> PEOPLE DEVELOPMENT <ul><li>Multi-functional Teamwork: Develop and maintain collaborative, open and, constructive relationships with peers, management, and partner teams across firmware development, product engineering, quality, and field applications</li><li>Team Development: Provide technical capability that continuously improves team involvement, morale, and productivity</li><li>Personal Development: Work to continuously improve your technical capability and communication skills</li></ul> AI UTILIZATION <ul><li>Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and requirements.</li><li>Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.</li></ul> Requirements: <ul><li>Bachelors/masters degree in computer or electrical engineering with 5+ years of relevant experience.</li><li>Experience in a customer facing engineering role such as customer engineering support, field applications, sustaining engineering, or escalation management is strongly preferred</li><li>Embedded Security domain knowledge and experience, including cryptography fundamentals (AES, RSA/ECC, SHA), key management, secure boot, and secure firmware update</li><li>Familiarity with storage security standards and features such as TCG Opal and Enterprise SSC, ATA Security, NVMe security and sanitize commands, and self-encrypting drives is an advantage</li><li>Expertise in the use of programming languages (eg. C, C++, RUST), programming tools &amp; environments</li><li>Experience programming in Python for test automation, log parsing, and debug tooling is an advantage</li><li>Understanding of storage interfaces including ideally PCIe/NVMe, SATA, or SAS</li><li>Experience with NAND flash and other non-volatile storage is an advantage</li><li>Experience in storage industry, storage systems, or a related technology is an advantage</li><li>Proficiency in debugging and resolving code problems for firmware applications, including the use of debuggers, firmware trace and log analysis, and protocol analyzers</li><li>Experience with defect tracking, change control, and firmware release processes in a production or sustaining environment</li><li>Excellent written and verbal communication skills, with the ability to manage multiple concurrent escalations under time pressure and stay effective in customer visible situations</li><li>Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.</li></ul>

Responsibilities: <ul><li>Define and implement NAND Flash reliability test flows to assess product reliability performance and prevent extrinsic/intrinsic reliability escapes.</li><li>Perform high volume statistical data analysis to evaluate NAND DPM/ intrinsic reliability risks and trends.</li><li>Drive electrical failure analysis, including advance characterization, to identify root causes and solution spaces.</li><li>Develop short term countermeasures such as targeted stresses and screens, applying knowledge of digital/analog circuits, device physics, and process engineering.</li><li>Qualify the product with innovative control measures to provide best in Class DPM and Cell reliability.</li><li>Collaborate closely with Fab, NAND Technology, NAND Design, Product Development, System Development, and Quality/Reliability teams to develop solutions and enable shipment of high quality end products.</li></ul> Requirements: <ul><li>Bachelor’s degree&nbsp;with &gt; 10 years or Master’s degree&nbsp;with &gt; 7 years or PhD with &gt; 5 years&nbsp;of relevant experience in Electrical Engineering or related field.</li><li>Experience in Semiconductor Reliability, NAND Technology, and Electrical Failure Analysis.</li><li>In depth background in NAND Design, Device Physics, Circuits,&nbsp;Process, Test, Validation.&nbsp;</li><li>Experience with application of AI tools, LLMs ,&nbsp;data analysis tools (e.g., Python, JMP, Tableau)</li><li>Strong statistical analysis, communication, and problem solving skills.</li><li>Experience in leading cross functional projects and mentoring&nbsp;junior engineers.</li><li>Strong analytical and problem solving skills.</li><li>Team player and self driver.</li></ul>

Responsibilities: <ul><li>As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of company memory parts.</li><li>Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts</li><li>Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications</li><li>Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions</li><li>Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes</li><li>Incorporate best known manufacturing methods into early development phase of upcoming nodes</li><li>Design and implement advanced process monitoring and control methodologies</li><li>Provide strategic roadmap for N+, N++ and future NAND Nodes</li><li>Serve as a technical expert within company contributing to technical projects for improvements to processes, procedures, and equipment</li><li>Define and leads complex, multi-functional projects of critical importance to company, helps to define strategic direction</li><li>Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers</li><li>This position requires communication and collaboration with partners both locally and globally. Strict adherence to company Intellectual Property Protection policy is necessary</li></ul> Requirements: <ul><li>PhD with ≥5 years, or Master’s degree with ≥7 years, or Bachelor’s degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field, with demonstrated expertise in semiconductor Experience in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication.</li><li>Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads</li><li>Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology</li><li>Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes</li><li>An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.</li><li>Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.</li><li>Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.</li><li>Strong collaboration and communication skills (verbal and written).</li><li>Self-driven, adaptable, and able to manage multiple projects.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</li><li>Proven ability to take calculated risks and execute novel solutions.</li><li>Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.</li></ul>

Responsibilities: <ul><li>Collaborate with multi-functional network teams from PIE, Process &amp; Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop.</li><li>May require travel to global company sites to foster collaboration and drive execution.</li><li>Communicate module related issues to the Fab engineering and leadership teams.</li><li>Design, execute, and analyze experiments to improve fab process, yield, and quality.</li><li>Collect and interpret complex data to optimize Fab processes and increase yields.</li><li>Engage and/or lead cross-area engineering teams to tackle process issues.</li><li>Work closely with global partners to stay ahead of on module related topics and process alignment projects.</li><li>Collaborate with other PI module owners and sister fabs to drive business process alignment</li><li>Partner with IE, Process and Equipment Engineering and Production to better forecast and balance yield, output and process issues</li><li>Promote network synergy through improved benchmarking and standardization of known engineering best-known methods (BKMs), business process.</li></ul> Requirements: <ul><li>Bachelor’s or advanced degree in Engineering or Science is required</li><li>Strong analytical, logical, and critical thinking skills</li><li>Effective communicator, able to collaborate across all levels</li><li>Growth mindset with a passion for continuous learning</li><li>Internship or experience in the semiconductor industry is a plus</li><li>Demonstrated leadership and a track record of impact are highly desirable</li><li>Interest in and knowledge of the semiconductor industry and company is preferred.</li></ul>

Responsibilities: <ul><li>Lead process integration (PI) structural uniformity and cross loop integration for critical modules (e.g., capacitance loop), owning end to end integration strategies to resolve yield, quality, and reliability gaps. </li><li>Drive physics&nbsp;and process based integration solutions through close collaboration with cross module process owners, PI subject matter experts, and key suppliers to optimise integration structures and achieve BIC yield and quality targets.</li><li>Develop and apply model based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry dependent effects) to diagnose structural non uniformity. Define, implement, and continuously strengthen critical inline monitoring and defence lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.</li><li>Own and advance product integration programs and loop level domain expertise, maintaining deep technical knowledge across node transitions. </li><li>Proactively drive node over node “shift left” integration, including early implementation of uniformity, bevel, and backside best known methods (BKMs) during development phases to accelerate whole wafer (centre-to-edge) yield and quality ramp.</li><li>Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and leveraging network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimization, and re engineering to improve benchmark performance, cycle time, and development productivity.</li><li>Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.</li></ul> Requirements: <ul><li>Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 10 years experience in process related role in the semiconductor industry.</li><li>With more than 7 years of relevant industry experience/knowledges.</li><li>Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front-end and backend assembly processes.</li><li>Good model-based problem solving, together with data-driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device-related issues, and address root cause.</li><li>Good organizational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to company sites as necessary for face-to-face collaboration.</li><li>Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.</li><li>Good multi-tasking, verbal and written communication skills.</li><li>Ability to apply baseline digital fluency and role appropriate AI literacy to use AI enabled tools responsibly and effectively for research, analysis, content creation, problem solving, operational tasks, and achieving business outcomes</li></ul>

Responsibilities: <ul><li>Enable technology ramp in high-volume production for CMOS and memory devices.</li><li>Improve device performance with a focus on variability reduction and robustness.</li><li>Support and execute design and test optimization to enhance manufacturability and performance.</li><li>Identify and implement process simplification and working methodology improvements.</li><li>Lead or actively contribute to cross-functional problem-solving for device, yield, and quality issues.</li></ul> Requirements: <ul><li>Minimum 5 years of relevant working experience is requiredA masters or Ph.Ddegree in Physics or Engineering areas is preferred.</li><li>Working experience in wafer fab process or process integration engineeringDirect experience in advanced CMOS device technology such as FinFET or GAA is preferable.</li><li>Proven knowledge in semiconductor physics and understanding of transistor operations, scaling limitations and reliability, basic knowledge of CMOS circuits and characterisation methods.</li><li>Understanding of wafer fabrication process areas, including tool sets, process mechanisms, tuning knobs, etc.</li><li>Excellent data analysis skills using software (JMP, SPOTFIRE, etc).</li><li>Strong task ownership, self-motivated to work with other team members to make progress collaboratively.</li><li>Open-minded attitude to learn new skills and could adapt to a new working environment swiftly.</li><li>Good digital literacy with MS OfficeProgramming capability such as Python is a plus.</li><li>Occasional international business travel is required for this position.</li></ul>

Responsibilities: <ul><li>Provide vision, leadership, and strategic direction for data engineers to deliver modern, high-quality data pipelines, models, and products, while fostering</li><li>innovation and new approaches to solving enterprise technical challenges.</li><li>Lead cloud data transformation and migration initiatives, helping define target-state cloud data engineering standards while ensuring solutions are resilient, scalable, high-performing, cost-optimized, and secure.</li><li>Drive data engineering excellence through AI adoption, automation, reusable frameworks, pipeline standardization, testing automation, and continuous</li><li>improvement to reduce complexity, increase consistency, and accelerate delivery.</li><li>Establish and advance best practices for data ingestion, transformation, standardization, productization, data quality, metadata management, lineage,</li><li>observability, orchestration, automated deployment, data protection, and secure data consumption.</li><li>Oversee the development of best-in-class data models and testing practices that are aligned to business objectives and enable trusted, consistent, secure, and easily usable data across the enterprise.</li><li>Partner with company leaders, the Data Office, Supervisory Affairs, Risk &amp; Compliance, other process owners, and other Technology and Business</li><li>stakeholders to ensure strategic data solutions sufficiently mitigate risk, strengthen controls, and respond to regulatory expectations.</li><li>Champion agile delivery with the Office of Agile and cross-functional teams using SAFe methods, managing execution across multiple priorities, projects, and release trains while proactively addressing dependencies, risks, and issues.</li><li>Develop, coach, and retain a high-performing team through skill development, career growth, inclusive leadership, succession planning, and ongoing focus on</li><li>team effectiveness.</li><li>Perform other duties and/or special projects as assigned.</li></ul> Requirements: <ul><li>Bachelors Degree and a minimum of 12 years of IT experience, OR in lieu of a Degree minimum of 14 years of experience in an IT environment</li><li>Minimum of 5 years of data engineering experience leveraging public cloud capabilities.</li><li>Minimum of 7 years of experience in a large complex organization</li><li>Minimum of 9 years of Demonstrated experience leading data engineering delivery for enterprise-scale data platforms, pipelines, data models, or analytic products.</li><li>Ability to communicate complex technical concepts clearly to business, technology, risk, and executive stakeholders</li></ul>

Role Description: <ul><li>Automotive Industry offers products for vehicle electrification systems like chassis systems, convenience applications, driver information, infotainment solutions, miniaturization solutions, motor and powertrain applications etc.&nbsp;</li><li>The client Automotive BU is focused on developing new and improved vehicle architecture approaches to efficiently address these challenges in Connectivity from power to propulsion and safety.&nbsp;</li><li>The Manager R&amp;D Product development contributes to the development of organizational strategy and supports in implementation of operational plans.</li><li>Being part of Product development team responsible to develop for new products and sustenance of existing product lines of Automotive business unit of client.</li><li>This position drives development of PCB connectors for automotive applications including Board to Board, Wire to Board and Flex to Board connectors.</li></ul> Responsibilities: <ul><li>Managing experienced professional and/or supervisors who exercise independence in their assignments and providing them with the required guidance and also be a strong technical contributor.</li><li>Providing strategic leadership to foster growth of the business.</li><li>Interacting and cooperating with multiple organizational levels to meet schedule and technical expectations.</li><li>Administrating schedules and ensuring performance requirements.</li><li>Providing knowledge of engineering tools such as Creo, etc. and product domain expertise in multiple projects.</li><li>Assist Inside Device Connectivity (InDeCo) engineering teams with New Product Developments across a range of projects and executing on cost optimization/reduction (VA/VE) opportunities for the business.</li><li>Preparing design verification test plans, Design &amp; Process FMEAs.</li><li>Successfully facilitate transfer and support of new product introduction (NPI) into high volume manufacturing.</li><li>Contributing to technical function initiatives across various initiatives.</li><li>Reverse Engineering and benchmarking of competitor products.</li><li>Support product environmental compliance and approvals for all new products and platforms as required by our customers.</li><li>Be a strong technical partner and provide support to Product management teams.</li><li>Attend/support customer meetings, technology days and site visits as required.</li></ul> Requirements: <ul><li>Master’s degree in mechanical engineering or equivalent is preferred with minimum 8 years of experience in related fields.</li><li>Mechanical or equivalent engineering Degree with minimum 10 years of related product development experience.&nbsp;</li><li>Experience with product design of PCB Connector such as Board to Board, Flex to Board, Wire to Board is essential.</li><li>Knowledge in product design of plastic, terminals (sheet metal), fine pitch connectors, rubber components.</li><li>Working knowledge of driving diversity and inclusion, customer/market focus, result orientation, managing multiple priorities, envisioning the future, coaching and developing people and collaborating across boundaries</li><li>Extensive experience executing plans in a disciplined way and in holding people accountable.</li><li>Organized, methodical and self-motivated individual.</li><li>A person with the ability to achieve goals and the highest standards of performance in a dynamic fast paced environment.</li><li>Attention to detail and on time delivery.</li><li>Excellent judgment, timely and high-quality decision-making skills.</li><li>Proven ability to execute engineering deliverables.</li><li>Strong customer service mindset and mentality of delivering quality products and services on time and within company cost and profitability objectives.</li><li>Fluent communication skills facilitate collaboration with own team, customers, internal business leaders and technology leaders to create value.</li><li>Individual must be self-motivated, have strong planning skills and be able to deal with and balance multiple competing priorities.</li></ul> Functional: Mandatory: <ul><li>Working knowledge of product development (Processes, Approaches, Tools and Techniques) &amp; Validation</li><li>Working knowledge of manufacturing processes like injection Mold, plating, assembly &amp; High-speed stamping</li><li>Working knowledge to apply Six Sigma / DFSS methodology to design, development, and delivery of technology products and process.</li><li>Working knowledge in use of CAD systems (CREO Part modeling &amp; Sheet Metal)</li><li>Interpretation of simulation results &amp; translating into product design</li><li>Working knowledge in Design for Manufacturability (DFM) &amp; FMEA&nbsp;</li><li>Proficient in Tolerance stack-up and GD&amp;T</li><li>Ability to generate design concepts and solve design problems&nbsp;</li><li>Working knowledge in prototyping methods</li><li>Working knowledge in Manufacturing process (Molding / Stamping / Plating)</li><li>Understanding of linear and non-linear analysis</li><li>Working knowledge of product life cycle.</li><li>Basic Knowledge in quality tools (8D, Why Why analysis, Fish bone….)</li><li>Awareness of recognition &amp; protection of IP (intellectual property) features</li><li>Basic knowledge of PPAP documentation.</li></ul> Preferred: <ul><li>Knowledge of customer application&nbsp;</li><li>Experience in development of automotive signal and power connectors.</li></ul> Department specific: <ul><li>Exposure to PCB Connector design</li><li>Ability to understand specifications for validation as per US CAR / LV 214 / Similar Specification</li><li>Knowledge about crimping technologies, Ultrasonic welding technologies, Laser welding technologies</li></ul>

Role Description: <ul><li>Responsible for sales and business development for Two-Wheeler (2W) OEM customers within clients Automotive Business Unit.</li><li>Drive key account growth, customer acquisition, and execution of Component Aggregate Manufacturer (CAM) and Harness Maker (HM) development strategies.&nbsp;</li></ul> Responsibilities:&nbsp; <ul><li>Drive revenue growth for assigned 2W OEM accounts across Karnataka &amp; Tamil Nadu Region</li><li>Develop and execute account strategies aligned with Automotive BU objectives</li><li>Maintain strong relationships with key stakeholders across OEMs including procurement, engineering, and program teams&nbsp;</li><li>Identify and develop new business opportunities with 2W OEMs and emerging EV players&nbsp;</li><li>Lead Component Aggregate Manufacturer (CAM) engagement activities including RFQs, pricing, negotiations, and contract closure&nbsp;</li><li>Collaborate with engineering and product teams for new product introductions and customization&nbsp;</li><li>Drive Harness Maker (HM) ecosystem development for increased wallet share&nbsp;</li><li>Track market trends, competitor activity, and customer strategy in 2W segment&nbsp;</li><li>Ensure accurate sales forecasting and pipeline management&nbsp;</li><li>Drive design-in activities and support project lifecycle from concept to SOP</li><li>Intensive travel &amp; expected to be at customer’s location (more than 75% working days) within Karnataka &amp; Tamil Nadu Region</li></ul> Key Performance Indicators (KPIs)&nbsp; <ul><li>Retention and growth of existing business across assigned accounts&nbsp;</li><li>Comprehensive competition mapping and strategic counter-planning&nbsp;</li><li>Deep understanding and effective promotion of our client portfolio&nbsp;</li><li>Driving new product development (NPD) aligned with customer needs&nbsp;</li><li>Achieve and exceed revenue growth targets year-on-year&nbsp;</li><li>Maintain healthy Accounts Receivable (AR) and ensure timely collections&nbsp;</li><li>Build and sustain a strong 5-year revenue pipeline&nbsp;</li><li>Identify, understand, and capitalize on future trends in the 2W (ICE &amp; EV) industry&nbsp;</li><li>Increase our client content per vehicle/platform&nbsp;</li><li>Coordinate with cross-functional teams (CFTs) to drive new project wins and execution&nbsp;</li><li>Strong understanding of 2W ICE and EV architectures to enable solution selling&nbsp;</li></ul> Requirements:&nbsp; Qualifications &amp; Experience&nbsp; <ul><li>Bachelor’s degree in Engineering (Mechanical/Electrical/Electronics preferred); MBA is a plus&nbsp;</li><li>5-10 years of experience in automotive sales/business development&nbsp;</li><li>Strong exposure to Two-Wheeler OEMs in India&nbsp;</li><li>Experience in connectors, wiring harness, or automotive components preferred&nbsp;</li><li>Proven track record in key account management and business growth&nbsp;</li></ul> Skills&nbsp; <ul><li>Strong negotiation and influencing skills&nbsp;</li><li>Excellent relationship management&nbsp;</li><li>Strategic thinking and execution&nbsp;</li><li>Technical understanding of automotive electrical/electronic systems&nbsp;</li><li>Strong communication and presentation skills&nbsp;</li></ul>

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314 engineering design Jobs found

Manager - Training

Principal/Staff Engineer – Firmware Development

Principal NAND Reliability Product Engineer

Staff/Principal Engineer - CMP Advanced NAND

Fronted End Central Process Integration Senior Engineer

Front End Central Product Integration (FE CPIE) MTS (FE)

MTS – FECOS CPIE Device

VP, Senior Data Engineering Manager

Manager I - R&D Product Development Engineering

Regional Manager – South India

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314 engineering design Jobs found

Manager - Training

Principal/Staff Engineer – Firmware Development

Principal NAND Reliability Product Engineer

Staff/Principal Engineer - CMP Advanced NAND

Fronted End Central Process Integration Senior Engineer

Front End Central Product Integration (FE CPIE) MTS (FE)

MTS – FECOS CPIE Device

VP, Senior Data Engineering Manager

Manager I - R&D Product Development Engineering

Regional Manager – South India

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