Director, Advanced Packaging Disruptive Technology

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

VP, Engineering Manager

 IIAD / SAD / LAD Artificial Intelligence Engineer

Responsibilities: Disruptive Pathfinding &amp; Technology Strategy <ul><li>Define and execute long-range (N+2 and beyond) pathfinding roadmap for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.</li><li>Drive concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms (e.g., novel interconnect schemes, heterogeneous integration architectures, advanced substrate innovations).</li><li>Evaluate emerging technology options and guide make/buy/partner decisions to establish differentiated capability ahead of industry adoption cycles.</li><li>Anticipate and define technology inflections aligned to AI, HPC, memory integration, chiplet ecosystems, and future system architectures.</li></ul> Innovation Leadership &amp; Team Building <ul><li>Build, lead, and inspire a world-class pathfinding and innovation team, fostering a culture of bold thinking, experimentation, and calculated risk-taking.</li><li>Instill an innovation-first mindset, encouraging teams to challenge existing assumptions and explore unconventional solutions.</li><li>Establish structured frameworks for idea generation, incubation, rapid prototyping, and down-selection.</li><li>Mentor technical leaders and create a pipeline of innovation talent capable of sustaining long-term differentiation.</li></ul> Customer &amp; Market-Driven Innovation <ul><li>Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.</li><li>Engage deeply with key customers to identify latent needs and unmet challenges not addressed by current packaging solutions.</li><li>Drive creation of new product concepts and technology platforms that deliver step-function improvements in performance, cost, power, and scalability.</li><li>Position offerings to create clear value differentiation and long-term competitive advantage.</li></ul> Ecosystem Development &amp; Strategic Partnerships <ul><li>Build and lead a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.</li><li>Identify and activate disruptive partnerships that accelerate innovation cycles and enable early validation of emerging technologies.</li><li>Drive joint development programs and consortia engagement to shape industry direction and standards.</li></ul> Program Leadership &amp; Execution Governance <ul><li>Establish governance models for early-stage technology programs, balancing exploration with execution discipline.</li><li>Drive alignment across engineering, product, and business units to transition pathfinding concepts into development pipelines.</li><li>Develop executive-level narratives and decision frameworks to communicate technology trade-offs, investments, and strategic priorities.</li><li>Ensure learnings from early exploration are captured, scaled, and leveraged across the organization.</li></ul> Leadership Expectations <ul><li>Visionary Technology Leader: Anticipates industry disruption and defines future-state architectures ahead of the market.</li><li>Innovation Catalyst: Creates an environment where breakthrough ideas are generated, tested, and scaled.</li><li>Strategic Connector: Bridges customer roadmaps, internal capabilities, and ecosystem innovations into cohesive strategies.</li><li>Builder of Teams &amp; Culture: Attracts, develops, and retains top talent while fostering collaboration and accountability.</li><li>Decisive Change Agent: Operates effectively in ambiguity, making high-impact decisions with incomplete data.</li></ul> Requirements: <ul><li>15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.</li><li>Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.</li><li>Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc), with the ability to think beyond existing paradigms.</li><li>Proven experience building and leading cross-functional or exploratory R&amp;D teams.</li><li>Ability to translate complex technology concepts into business impact and strategic direction.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Development <ul><li>Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.</li><li>Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.</li><li>Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates).</li><li>Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.</li><li>Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.</li></ul> Technical Innovation &amp; Execution <ul><li>Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.</li><li>Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.</li><li>Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.</li><li>Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.</li><li>Document and communicate findings to influence technology roadmap decisions and downstream development programs.</li></ul> Customer &amp; Market Alignment <ul><li>Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems.</li><li>Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.</li><li>Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits.</li></ul> Ecosystem Collaboration <ul><li>Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.</li><li>Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.</li><li>Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.</li></ul> Program Contribution &amp; Technical Leadership <ul><li>Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.</li><li>Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities.</li><li>Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.</li><li>Mentor junior engineers and contribute to building technical depth and innovation culture within the team.</li></ul> Leadership Expectations <ul><li>Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration.</li><li>Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact.</li><li>Influencer: Drives alignment and decisions across teams without formal authority.</li><li>Problem Solver: Thrives in ambiguity, breaking down complex challenges into actionable solutions.</li><li>Collaborator: Effectively works across organizational and ecosystem boundaries.</li></ul> Requirements: <ul><li>10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.</li><li>Demonstrated experience in technology development, pathfinding, or exploratory R&amp;D.</li><li>Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).</li><li>Proven ability to solve complex technical problems and translate concepts into experimental validation.</li><li>Strong communication skills to articulate technical insights and business relevance.</li></ul>

Responsibilities: People, Talent and Cross-Functional Collaboration:&nbsp; <ul><li>Ensure optimal staffing levels across front-end, back-end, full-stack, and platform specializations.&nbsp;</li><li>Hire, coach, and develop top-tier engineering talent.</li><li>Manage direct reports and technical leads, address performance issues promptly, and build strong relationships with Product, Design, Platform, Data, and agile train leadership to deliver cohesive, customer-focused solutions.</li><li>Community of Practice, Developer Experience and AI-Driven Engineering: As AI tooling becomes inseparable from modern engineering practice, own the convergence of Community of Practice standards and AI adoption as a single discipline.&nbsp;</li><li>Foster best practice adoption across the engineering community with AI tooling treated as a first-class part of the practice.</li><li>Define standards for responsible AI adoption — including when to use AI coding assistants, agents, skills, and MCP integrations versus traditional approaches.</li><li>Establish clear guidance on the distinction between AI Skills (deterministic capabilities) and Agents (autonomous, multi-step workflows). </li><li>Evaluate, pilot, and roll out AI tools (GitHub Copilot, Claude Code, Cursor, Windsurf, Continue.dev, Aider, Cline, Ollama). </li><li>Define governance for AI use in regulated financial services contexts including data handling, PII protection, IP compliance, and code provenance. </li><li>Track and measure the combined impact of CoP practices and AI adoption on cycle time, PR throughput, defect rates, and developer satisfaction.</li><li>System Architecture and Technical Direction: Own a modern view of system architecture spanning client, server, data, integration, and AI layers.&nbsp;</li><li>Champion patterns such as micro-frontends, BFF, event-driven, API-first, serverless, and composable architectures.&nbsp;</li><li>Partner with Enterprise Architects on platform alignment.&nbsp;</li><li>Guide trade-off decisions (monolith vs. microservices, sync vs. async, build vs. buy). Use AI-powered architecture tools to accelerate design exploration and generate ADRs.</li><li>Ensure teams document decisions so both humans and AI agents can reason about the system. </li><li>Understand how AI tools interact with system architecture — including RAG, vector databases, MCP integrations, and agentic workflows.</li></ul> Strategic Planning, Delivery and Operational Excellence:&nbsp; <ul><li>Ensure plans align with CoP goals, review quarterly commitments to flag risks early, and step in to resolve conflicts between product, design, and engineering.&nbsp;</li><li>Drive CI/CD best practices, ensure high-quality scalable solutions across the stack, and provide on-call support during escalations.&nbsp;</li><li>Support tech leads hands-on when needed, regardless of which layer of the stack the problem lives in.</li></ul> Requirements: <ul><li>Strong hands-on background in modern front-end technologies (ReactJS, TypeScript, NextJS, Cypress) as an anchor foundation, with working knowledge of back-end technologies, APIs, microservices, and data layer concepts.&nbsp;</li><li>Experience with AWS cloud services, CI/CD pipelines, and modern DevOps practices.&nbsp;</li><li>Proven ability to lead engineers working across the full stack.</li><li>Solid grounding in system architecture fundamentals — distributed systems, scalability, CAP trade-offs, caching, messaging, API design — and familiarity with modern patterns (micro-frontends, BFF, event-driven, CQRS, serverless, composable architectures).&nbsp;</li><li>Experience making and documenting architecture decisions (ADRs), with understanding of how AI-native architecture (RAG pipelines, vector databases, agent orchestration) differs from traditional architecture.</li><li>Hands-on experience with AI coding assistants (GitHub Copilot, Claude Code, Cursor, or equivalent) with clear understanding of the difference between AI Skills and Agents, familiarity with MCP (Model Context Protocol), RAG patterns, and experience defining AI usage guidelines and governance frameworks for regulated environments.&nbsp;</li><li>Awareness of the open-source AI tooling ecosystem (Continue.dev, Aider, Cline, Ollama).</li><li>Proven experience leading and growing high-performing engineering teams, running or contributing to a Community of Practice, and strong communication skills with the ability to influence across organizational levels.</li></ul>

Responsibilities: Agentic AI Development:&nbsp;&nbsp; <ul><li>Design, build, and deploy agentic AI systems using frameworks such as LangChain, Lang Graph, and related libraries.&nbsp;&nbsp;</li><li>Develop and deploy multi-agent systems capable of autonomous decision-making, reasoning, planning, and collaboration.&nbsp;</li></ul> RAG Pipelines:&nbsp; <ul><li>Implement and optimize retrieval-augmented generation (RAG) systems, ensuring agents can access and incorporate external knowledge sources for grounded, accurate responses.&nbsp;</li></ul> LLM Engineering:&nbsp; <ul><li>Fine-tune and prompt-engineer LLMs for task-specific reasoning, planning, and dynamic adaptation.&nbsp;</li><li>Work with LLM/SLM APIs, embeddings, and advanced generative AI techniques.&nbsp;</li></ul> Enterprise AI Platform:&nbsp; <ul><li>Lead the development of enterprise-grade AI platforms integrating LLMs, RAG, embeddings, and agentic AI protocols.&nbsp;</li><li>Implement and standardize Model Context Protocol (MCP) for consistent context management across models and agents.&nbsp;</li></ul> MLOps &amp; Observability:&nbsp; <ul><li>Establish and enforce best practices for MLOps, monitoring, and observability, ensuring scalable and maintainable AI solutions.&nbsp;</li><li>Applied AI Prototyping:&nbsp;</li></ul> Rapidly prototype, experiment, and iterate to improve AI agent capabilities.&nbsp; Collaboration &amp; Research:&nbsp; <ul><li>Participate in the full research cycle: literature review, data exploration, experimentation, and presentation of findings.&nbsp;</li><li>Collaborate effectively with other engineers, researchers, and data scientists.&nbsp;</li><li>Contribute to the documentation and standardization of technical code and practices.&nbsp;</li></ul>&nbsp;Requirements: <ul><li>Bachelor’s degree in Computer Science, Engineering, or a related quantitative field. Master’s or Ph.D. is a strong plus.&nbsp;</li><li>5+ years overall experience in software development, data science, or machine learning.&nbsp;</li><li>1+ year of hands-on experience developing AI applications with LLMs and systems such as retrieval-based methods, fine-tuning, or agent-based architectures.&nbsp;</li><li>1+ year of experience with frameworks like LangChain, LlamaIndex, OpenAI, or similar tools.&nbsp;</li></ul>

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Director, Advanced Packaging Disruptive Technology

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

VP, Engineering Manager

IIAD / SAD / LAD Artificial Intelligence Engineer

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Director, Advanced Packaging Disruptive Technology

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

VP, Engineering Manager

IIAD / SAD / LAD Artificial Intelligence Engineer

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