Customer Service Representative

Sales Manager

Technical Director, Advanced Packaging Integration

Director of Technology (Product Development)

Director, Advanced Packaging Disruptive Technology

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

Stock Operator

Role Description: <ul><li>This position is in a fast-paced business environment for B2B customer support team, where in you will handle escalated customer care issues either through direct personal action or by escalating to the proper individual/department.</li><li>You will need to Coordinate with resources for the resolution of system related problems and provide specific feedback to other departments to aid all open issues.</li><li>This responsibility includes collaboration between both on site and virtual resources as necessary. You will also partner on the process improvement projects, developing training material, reports and lead implementation as necessary.</li></ul>&nbsp;Responsibilities:&nbsp;<ul><li>Order Management - Will handle import, exports and local customer’s, Sales order and planning process, i.e. order entry, daily schedule review, shipment processing, invoicing &amp; logistics coordination.</li><li>Commercial Management: maintaining price lists &amp; quotations of all accounts.</li><li>Sales Management: forecasting, pipeline analysis &amp; mapping sales performance.</li><li>Project management: Participate effectively in quality improvement projects and promote co-operative effort between all departments and internal customers.</li><li>Customer visits: leading harness makers to give necessary support where required including forecast fluctuation, shortage / expedition order support, returns, credit/debit &amp; Account Receivable&nbsp;</li><li>Management Reports: To support SCM &amp; demand controllers in collating information regarding orders, deliveries, fluctuation/shortages/increase in demand.</li><li>Stake holder management: To coordinate with global and local functions &amp; Support the manager &amp; Sales in activities to ensure an enhanced customer experience. This includes but is not limited to projects and tasks to enhance the order management &amp; fulfillment process, end to end alignment within cross functions to impart better customer service to stake holders</li><li>Situation handling: Evaluates situations that impact operations and decide level of support and response required.</li></ul> Requirements&nbsp; <ul><li>Any Graduate degree</li><li>3+ years of experience</li><li>Working experience in SAP &amp; MS office</li><li>Extensive transactional working experience in manufacturing industry under CS / Supply chain.</li><li>Experience of effective collaboration in multiple regional teams set up &amp; stake holder management</li><li>Previous experience from automotive / service industry preferred.</li></ul>

Responsibilities: Regional Sales Management Key Activities:&nbsp; <ul><li>Comprehensive understanding of customer’s market dynamic, regulatory environment, channel structure, segment trends, competitive environment and decision making network in Latin America.</li><li>Develop relationships with customers, prospects and participate in key customer meetings with Regional Sales team.</li><li>Identify and penetrate white-space markets where Our client has limited or no presence, creating a country-by-country access strategy for priority accounts, channels, and decision makers.</li><li>Generate new business and manage the full sales activity to maximize sales opportunities.</li><li>Engage with key accounts and maintain effective customer relationships.</li><li>Provide insights and updates on customers, prospects, market access barriers, competitor positioning, pricing and regional growth opportunities .</li></ul> Sales Planning and Market Development Key Activities: <ul><li>Promote our client value proposition and market presence in priority Latin America countries, with particular focus on underpenetrated and high-potential white-space markets.</li><li>Promote and sell our client solutions by establishing key contracts and developing relationships with target customers.</li><li>Build and maintain a regional stakeholder map covering manufacturers, converters, distributors, tobacco/nicotine industry contacts, packaging players, agents, and other relevant commercial stakeholders.</li><li>Generate new enquiries from existing customers, prospecting of new customers.</li><li>Identify and create new opportunities and pipelines to deliver growth in revenue and profitability.</li><li>Conduct customer preparation and market segmentation matrix</li><li>Perform market trend analysis and competitor activity in the region</li><li>Present relevant products and participate in regional sales meetings</li><li>Translate informal market signals into commercial strategies, including demand capture, customer education, channel selection</li></ul> Performance Management Key Activities: <ul><li>Monitor performance against the annual plan, pipeline targets, opportunity conversion and white space market entry and penetration through salesforce.</li><li>Monthly customers performance progress tracking against monthly forecast and budget&nbsp;</li><li>Work closely with customers to provide forecast and demand.</li><li>Create and execute actions to address underperformance and stimulate sales activity.</li><li>Identify underperformance root causes by country, account, channel, pricing, access, supply, or competitive factor, and execute corrective actions.</li></ul> Requirements: <ul><li>Existing commercial network in Latin America, ideally including tobacco manufacturers, packaging/converting companies, distributors, agents, or related industry stakeholders.</li><li>Experience in tobacco, nicotine, or adjacent regulated industries is strongly preferred. Candidates from tobacco leaf, cigarette manufacturing, filters, packaging, paper, machinery, distribution, or trade-marketing environments may be particularly relevant.</li><li>Bachelor’s degree (preferably in Engineering, Business, or Marketing).</li><li>10 years of industrial B2B technical sales experience.&nbsp;</li><li>Strong analytical, presentation, and communication skills.</li><li>Fluent in English and Spanish. Portuguese is a strong advantage.</li><li>Detail-oriented, self-motivated, and able to manage multiple priorities.</li><li>Willing to travel frequently.</li><li>Strong understanding of sales, supply chain, and customer service processes.</li><li>Creative and strategic thinker with a passion for business growth.</li><li>Comfortable operating in ambiguous markets where reliable data may be limited and where success depends on local intelligence, trusted relationships, persistence, and disciplined qualification.</li></ul>

Responsibilities: <ul><li>Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies</li><li>Define, document, and implement end-to-end process flows for panel-level packaging technologies</li><li>Lead material selection, characterization, and compatibility assessments for large form factor substrates</li><li>Partner with customers to define and align process specifications and acceptance criteria</li><li>Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers</li><li>Contribute to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps</li><li>Analyze process data to identify trends, drive optimization, and improve performance</li><li>Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability</li><li>Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions</li><li>Publish and present technical findings at leading industry conferences and in peer-reviewed journals</li><li>Mentor and guide early-career engineers; provide technical direction and best practices</li></ul> Requirements: <ul><li>Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field</li><li>In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows</li><li>Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level</li><li>Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs</li><li>Proficiency in statistical data analysis (e.g. DoE, JMP)</li><li>Knowledge of industry standards and best practices in semiconductor packaging</li><li>Solid understanding of process characterization, metrology, materials &amp; failure analysis</li><li>Working knowledge of reliability requirements and qualification methodologies</li><li>Proven capability to lead multi-functional teams to resolve complex technical problems</li><li>Exceptional written and verbal communication skills</li><li>Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts</li><li>Drive structured technical discussions with customers and suppliers</li><li>Articulate positions, influence decisions, and align technical direction</li><li>Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications</li><li>Ability to work effectively across geographies and time zones</li></ul>

Responsibilities: <ul><li>Lead and develop a multidisciplinary technology team across chamber design, process development, systems engineering, controls, and integration.</li><li>Define and execute the chamber technology roadmap, product architecture, risk retirement plans, and development milestones.</li><li>Drive end-to-end technical execution of chamber development programs to meet performance, schedule, cost, quality, and reliability goals.</li><li>Provide technical guidance on chamber hardware, process performance, plasma or chemical interactions, materials compatibility, defectivity, cleanliness, and manufacturability.</li><li>Partner with product management, manufacturing, supply chain, service, and customer-facing teams to deliver customer-focused product solutions.</li><li>Lead customer issue resolution, including containment, root-cause analysis, corrective actions, recovery plans, and long-term product improvements.</li><li>Represent the technology organization in customer engagements, executive reviews, technical reviews, and escalation discussions.</li></ul> Requirements: <ul><li>Bachelor’s degree or higher in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical discipline; advanced degree preferred.</li><li>Significant experience leading semiconductor equipment, process module, or chamber development programs.</li><li>Proven ability to lead technical teams and drive cross-functional execution in a global, matrixed organization.</li><li>Strong knowledge of product development lifecycle, including feasibility, design validation, process integration, NPI, reliability, and manufacturing readiness.</li><li>Excellent communication and stakeholder management skills, with the ability to influence executive, customer, and engineering audiences.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Strategy <ul><li>Define and execute long-range (N+2 and beyond) pathfinding roadmap for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.</li><li>Drive concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms (e.g., novel interconnect schemes, heterogeneous integration architectures, advanced substrate innovations).</li><li>Evaluate emerging technology options and guide make/buy/partner decisions to establish differentiated capability ahead of industry adoption cycles.</li><li>Anticipate and define technology inflections aligned to AI, HPC, memory integration, chiplet ecosystems, and future system architectures.</li></ul> Innovation Leadership &amp; Team Building <ul><li>Build, lead, and inspire a world-class pathfinding and innovation team, fostering a culture of bold thinking, experimentation, and calculated risk-taking.</li><li>Instill an innovation-first mindset, encouraging teams to challenge existing assumptions and explore unconventional solutions.</li><li>Establish structured frameworks for idea generation, incubation, rapid prototyping, and down-selection.</li><li>Mentor technical leaders and create a pipeline of innovation talent capable of sustaining long-term differentiation.</li></ul> Customer &amp; Market-Driven Innovation <ul><li>Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.</li><li>Engage deeply with key customers to identify latent needs and unmet challenges not addressed by current packaging solutions.</li><li>Drive creation of new product concepts and technology platforms that deliver step-function improvements in performance, cost, power, and scalability.</li><li>Position offerings to create clear value differentiation and long-term competitive advantage.</li></ul> Ecosystem Development &amp; Strategic Partnerships <ul><li>Build and lead a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.</li><li>Identify and activate disruptive partnerships that accelerate innovation cycles and enable early validation of emerging technologies.</li><li>Drive joint development programs and consortia engagement to shape industry direction and standards.</li></ul> Program Leadership &amp; Execution Governance <ul><li>Establish governance models for early-stage technology programs, balancing exploration with execution discipline.</li><li>Drive alignment across engineering, product, and business units to transition pathfinding concepts into development pipelines.</li><li>Develop executive-level narratives and decision frameworks to communicate technology trade-offs, investments, and strategic priorities.</li><li>Ensure learnings from early exploration are captured, scaled, and leveraged across the organization.</li></ul> Leadership Expectations <ul><li>Visionary Technology Leader: Anticipates industry disruption and defines future-state architectures ahead of the market.</li><li>Innovation Catalyst: Creates an environment where breakthrough ideas are generated, tested, and scaled.</li><li>Strategic Connector: Bridges customer roadmaps, internal capabilities, and ecosystem innovations into cohesive strategies.</li><li>Builder of Teams &amp; Culture: Attracts, develops, and retains top talent while fostering collaboration and accountability.</li><li>Decisive Change Agent: Operates effectively in ambiguity, making high-impact decisions with incomplete data.</li></ul> Requirements: <ul><li>15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.</li><li>Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.</li><li>Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc), with the ability to think beyond existing paradigms.</li><li>Proven experience building and leading cross-functional or exploratory R&amp;D teams.</li><li>Ability to translate complex technology concepts into business impact and strategic direction.</li></ul>

Responsibilities: <ul><li>Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products</li><li>Manage, develop, plan and execute process engineering projects for entire range of products</li><li>Interact with key customers to resolve significantly complex process engineering issues for entire range of products</li><li>Develop and implement new technology, products and analytical instrumentation</li><li>Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products</li><li>Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products</li><li>Contributes to market share gains through technology improvement</li></ul> Requirements: <ul><li>Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.</li><li>8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition technologies.</li><li>Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.</li><li>Proven experience leading process development, technology innovation, and product qualification in an R&amp;D environment.</li><li>Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.</li><li>Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.</li><li>Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.</li><li>Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.</li><li>Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Development <ul><li>Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.</li><li>Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.</li><li>Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates).</li><li>Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.</li><li>Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.</li></ul> Technical Innovation &amp; Execution <ul><li>Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.</li><li>Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.</li><li>Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.</li><li>Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.</li><li>Document and communicate findings to influence technology roadmap decisions and downstream development programs.</li></ul> Customer &amp; Market Alignment <ul><li>Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems.</li><li>Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.</li><li>Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits.</li></ul> Ecosystem Collaboration <ul><li>Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.</li><li>Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.</li><li>Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.</li></ul> Program Contribution &amp; Technical Leadership <ul><li>Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.</li><li>Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities.</li><li>Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.</li><li>Mentor junior engineers and contribute to building technical depth and innovation culture within the team.</li></ul> Leadership Expectations <ul><li>Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration.</li><li>Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact.</li><li>Influencer: Drives alignment and decisions across teams without formal authority.</li><li>Problem Solver: Thrives in ambiguity, breaking down complex challenges into actionable solutions.</li><li>Collaborator: Effectively works across organizational and ecosystem boundaries.</li></ul> Requirements: <ul><li>10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.</li><li>Demonstrated experience in technology development, pathfinding, or exploratory R&amp;D.</li><li>Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).</li><li>Proven ability to solve complex technical problems and translate concepts into experimental validation.</li><li>Strong communication skills to articulate technical insights and business relevance.</li></ul>

Responsibilities: <ul><li>Create 3D integration and packaging solutions for different platforms and quantum structures</li><li>Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices</li><li>Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines</li><li>Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues</li><li>Generate internal and external documentation for products, presentations and technical reports</li><li>Design and conduct experiment, measure material and device properties and interpret data</li><li>Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies</li><li>Collaborate with customers, start-ups, or universities to identify key problems and develop enabling solutions</li></ul> Requirements: <ul><li>PhD, Masters, or Bachelors degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.</li><li>5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.</li><li>Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip, and related packaging technologies.</li><li>Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology.</li><li>Experience with DOE, data analysis, process optimization, and root cause analysis.</li><li>Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.</li><li>Strong problem-solving, technical communication, and cross-functional collaboration skills.</li><li>Ability to work effectively with customers, startups, universities, and multidisciplinary R&amp;D teams.</li></ul>

Responsibilities: <ul><li>Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines</li><li>Perform hardware characterization on a variety of difficult systems, within safety guidelines</li><li>Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues</li><li>Generate internal and external documentation for products, presentations and technical reports</li><li>Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision</li><li>Measure film properties and interpret data</li><li>Identify, select and work with vendors and suppliers with limited supervision</li><li>Implement new technology, products and analytical instrumentation</li></ul> Requirements: <ul><li>PhD or Masters Degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field</li><li>Research focus in semiconductor would be an added advantage</li><li>Relevant experiences in semiconductor process development field</li><li>Good communication and interpersonal skills</li><li>Problem-solver attitude with determination and quality-mindset</li></ul>

Responsibilities: <ul><li>Ensure compliance and correct implementation of all procedures and to identify solutions to fill the gaps</li><li>Ensure correct instore operations: logistics, administration, AFS</li><li>Ensure the best BOH organization to support sales staff</li><li>Ensure stock inventory /stock take objective results</li><li>Support the stores management role in effectively operating the boutique also in term of ROTA including match to traffic needs.</li><li>Ensure service to clients is properly supported at all times with the right equipment and teamwork flows (including food and beverage, etc)</li><li>Ensure availability of store supplies ( packaging, food and beverage) at all times.</li><li>Ensure online and offline integration</li></ul> Requirements: <ul><li>Proactivity and problem solving attitude</li><li>ability to coordinate back office activities to support sales</li><li>Ability to collaborate with Store Manager and HQ to support business</li><li>High knowledge of retail/ operations procedure to ensure smooth run of the store</li></ul>

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279 functional safety manager Jobs found

Customer Service Representative

Sales Manager

Technical Director, Advanced Packaging Integration

Director of Technology (Product Development)

Director, Advanced Packaging Disruptive Technology

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

Stock Operator

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279 functional safety manager Jobs found

Customer Service Representative

Sales Manager

Technical Director, Advanced Packaging Integration

Director of Technology (Product Development)

Director, Advanced Packaging Disruptive Technology

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

Stock Operator

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.