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Skills

leadership skills
artificial intelligence
automation
data analysis
python
team management
account management
accountability
advanced aws cloud expertise
advanced packaging

Industry

financial services

Location

singapore, singapore
raleigh, united states
gurgaon, india
alabang, philippines
atlanta, united states
bandar baru enstek, malaysia
bangkok, thailand
batangas, philippines
bengaluru, india
budapest, hungary

Jobtitle

director, data science
principal/senior engineer, aptd cem - advanced packaging integration engineering
account manager iv - connected living solutions
analytical editorial operations manager
associate engineer - factory innovation
avp - group human capital solution architect
commercial finance manager
consulting principal aws cloud engineer
data & ml architect
director - project delivery

Filter

29 innovation Jobs found

1-10 of 29
E

Executive Director

10 hours ago

Dar es Salaam, Tanzania

E

Negotiation & InfluencingPresentation SkillsLeadership SkillsBusiness & Commercial SkillsGovernance & Stakeholder ManagementTransformation & TechnologyCommunication Skills
A

Singapore, Singapore

A

HR Functional ExpertiseLeadership & GovernanceHR Technology SkillsData, Analytics & AI SkillsWorkforce Intelligence
K

Gurgaon, India

K

Key Account Management SkillsNorth Region/Territory ManagementSales & Commercial SkillsCustomer & Stakeholder ManagementReporting & Leadership
A

Bandar Baru Enstek, Malaysia

A

Quality & SafetyPeople ManagementManufacturing SkillsAutomationDigital ManufacturingFactory EngineeringContinuous Improvement
D

Dubai, United Arab Emirates

D

Change ManagementStakeholder ManagementComplex Project ManagementProject DeliveryBudgetingCompliance & Regulatory ManagementPMO & Governance
A

Bangkok, Thailand

A

B2b SalesCustomer ServiceAccount ManagementWire HarnessIntegrity

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer

Test Coverage OptimizationDRAM Device Fundamentals and PhysicsHigh Bandwidth Memory (HBM) ArchitectureReliability CharacterizationReliability Risk AssessmentDefectivity Analysis

DOEAdvanced PackagingWafer FabVisual BasicPython
A

London, United Kingdom

A

Ai Workflow ImplementationMicrosoft SuiteCollaborationEditorial OperationsContent Operations