Director, Advanced Packaging Disruptive Technology

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

Responsibilities:

Disruptive Pathfinding & Technology Strategy

• Define and execute long-range (N+2 and beyond) pathfinding roadmap for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.
• Drive concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms (e.g., novel interconnect schemes, heterogeneous integration architectures, advanced substrate innovations).
• Evaluate emerging technology options and guide make/buy/partner decisions to establish differentiated capability ahead of industry adoption cycles.
• Anticipate and define technology inflections aligned to AI, HPC, memory integration, chiplet ecosystems, and future system architectures.

Innovation Leadership & Team Building

• Build, lead, and inspire a world-class pathfinding and innovation team, fostering a culture of bold thinking, experimentation, and calculated risk-taking.
• Instill an innovation-first mindset, encouraging teams to challenge existing assumptions and explore unconventional solutions.
• Establish structured frameworks for idea generation, incubation, rapid prototyping, and down-selection.
• Mentor technical leaders and create a pipeline of innovation talent capable of sustaining long-term differentiation.

Customer & Market-Driven Innovation

• Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.
• Engage deeply with key customers to identify latent needs and unmet challenges not addressed by current packaging solutions.
• Drive creation of new product concepts and technology platforms that deliver step-function improvements in performance, cost, power, and scalability.
• Position offerings to create clear value differentiation and long-term competitive advantage.

Ecosystem Development & Strategic Partnerships

• Build and lead a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.
• Identify and activate disruptive partnerships that accelerate innovation cycles and enable early validation of emerging technologies.
• Drive joint development programs and consortia engagement to shape industry direction and standards.

Program Leadership & Execution Governance

• Establish governance models for early-stage technology programs, balancing exploration with execution discipline.
• Drive alignment across engineering, product, and business units to transition pathfinding concepts into development pipelines.
• Develop executive-level narratives and decision frameworks to communicate technology trade-offs, investments, and strategic priorities.
• Ensure learnings from early exploration are captured, scaled, and leveraged across the organization.

Leadership Expectations

• Visionary Technology Leader: Anticipates industry disruption and defines future-state architectures ahead of the market.
• Innovation Catalyst: Creates an environment where breakthrough ideas are generated, tested, and scaled.
• Strategic Connector: Bridges customer roadmaps, internal capabilities, and ecosystem innovations into cohesive strategies.
• Builder of Teams & Culture: Attracts, develops, and retains top talent while fostering collaboration and accountability.
• Decisive Change Agent: Operates effectively in ambiguity, making high-impact decisions with incomplete data.

Requirements:

• 15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
• Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
• Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc), with the ability to think beyond existing paradigms.
• Proven experience building and leading cross-functional or exploratory R&D teams.
• Ability to translate complex technology concepts into business impact and strategic direction.