Process Engineering Manager (Electroplating)

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

Responsibilities:

• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products
• Manage, develop, plan and execute process engineering projects for entire range of products
• Interact with key customers to resolve significantly complex process engineering issues for entire range of products
• Develop and implement new technology, products and analytical instrumentation
• Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products
• Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products
• Contributes to market share gains through technology improvement

Requirements:

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition technologies.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.
• Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.
• Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.