Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

Responsibilities:

Disruptive Pathfinding & Technology Development

• Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.
• Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.
• Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates).
• Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.
• Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.

Technical Innovation & Execution

• Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.
• Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.
• Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.
• Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.
• Document and communicate findings to influence technology roadmap decisions and downstream development programs.

Customer & Market Alignment

• Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems.
• Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.
• Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits.

Ecosystem Collaboration

• Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.
• Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.
• Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.

Program Contribution & Technical Leadership

• Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.
• Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities.
• Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.
• Mentor junior engineers and contribute to building technical depth and innovation culture within the team.

Leadership Expectations

• Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration.
• Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact.
• Influencer: Drives alignment and decisions across teams without formal authority.
• Problem Solver: Thrives in ambiguity, breaking down complex challenges into actionable solutions.
• Collaborator: Effectively works across organizational and ecosystem boundaries.

Requirements:

• 10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.
• Demonstrated experience in technology development, pathfinding, or exploratory R&D.
• Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).
• Proven ability to solve complex technical problems and translate concepts into experimental validation.
• Strong communication skills to articulate technical insights and business relevance.