Senior Quantum 3D Integration and Packaging Engineer

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

Responsibilities:

• Create 3D integration and packaging solutions for different platforms and quantum structures
• Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices
• Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines
• Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues
• Generate internal and external documentation for products, presentations and technical reports
• Design and conduct experiment, measure material and device properties and interpret data
• Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies
• Collaborate with customers, start-ups, or universities to identify key problems and develop enabling solutions

Requirements:

• PhD, Master's, or Bachelor's degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.
• 5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.
• Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip, and related packaging technologies.
• Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology.
• Experience with DOE, data analysis, process optimization, and root cause analysis.
• Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.
• Strong problem-solving, technical communication, and cross-functional collaboration skills.
• Ability to work effectively with customers, startups, universities, and multidisciplinary R&D teams.