Technical Director, Advanced Packaging Integration

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

Responsibilities:

• Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies
• Define, document, and implement end-to-end process flows for panel-level packaging technologies
• Lead material selection, characterization, and compatibility assessments for large form factor substrates
• Partner with customers to define and align process specifications and acceptance criteria
• Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers
• Contribute to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps
• Analyze process data to identify trends, drive optimization, and improve performance
• Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability
• Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions
• Publish and present technical findings at leading industry conferences and in peer-reviewed journals
• Mentor and guide early-career engineers; provide technical direction and best practices

Requirements:

• Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows
• Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level
• Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs
• Proficiency in statistical data analysis (e.g. DoE, JMP)
• Knowledge of industry standards and best practices in semiconductor packaging
• Solid understanding of process characterization, metrology, materials & failure analysis
• Working knowledge of reliability requirements and qualification methodologies
• Proven capability to lead multi-functional teams to resolve complex technical problems
• Exceptional written and verbal communication skills
• Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts
• Drive structured technical discussions with customers and suppliers
• Articulate positions, influence decisions, and align technical direction
• Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications
• Ability to work effectively across geographies and time zones