Technical Director, Advanced Packaging Integration

Process Engineer(Functional Litho & Acoustic Litho)

Engineer/ Senior Engineer (Equipment & Process)- Lithography/Photolithography

Equipment Engineer - Lithography

Responsibilities: <ul><li>Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies</li><li>Define, document, and implement end-to-end process flows for panel-level packaging technologies</li><li>Lead material selection, characterization, and compatibility assessments for large form factor substrates</li><li>Partner with customers to define and align process specifications and acceptance criteria</li><li>Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers</li><li>Contribute to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps</li><li>Analyze process data to identify trends, drive optimization, and improve performance</li><li>Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability</li><li>Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions</li><li>Publish and present technical findings at leading industry conferences and in peer-reviewed journals</li><li>Mentor and guide early-career engineers; provide technical direction and best practices</li></ul> Requirements: <ul><li>Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field</li><li>In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows</li><li>Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level</li><li>Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs</li><li>Proficiency in statistical data analysis (e.g. DoE, JMP)</li><li>Knowledge of industry standards and best practices in semiconductor packaging</li><li>Solid understanding of process characterization, metrology, materials &amp; failure analysis</li><li>Working knowledge of reliability requirements and qualification methodologies</li><li>Proven capability to lead multi-functional teams to resolve complex technical problems</li><li>Exceptional written and verbal communication skills</li><li>Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts</li><li>Drive structured technical discussions with customers and suppliers</li><li>Articulate positions, influence decisions, and align technical direction</li><li>Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications</li><li>Ability to work effectively across geographies and time zones</li></ul>

Responsibilities: <ul><li>Drive/contribute in cost reduction, weed out unwarranted expenses/wastages, find alternative sources and improve processes with innovative solutions to raise efficiency.</li><li>Drive/contribute in quality investigations and continuous improvement programs to resolve chronic process and quality issues, and institute permanent resolutions to assure product quality and enhance process robustness.</li><li>Enforce on line controls and execution to conform to work instructions and procedures.&nbsp;</li><li>Apply hands-on and with deep involvement at work.</li><li>Monitor and analyse SPC charts and drive process control improvements.</li><li>Effective and timely disposition of on hold lots.</li><li>Regular reviews of OCAP, FMEA and Control Plans.</li><li>Ensure timely update of procedures and effective implementations.</li><li>Guide and train technicians in processes and problem solving and analysis to build up their technical competencies and achieve self-sustenance.</li><li>Take accountability of work and possesses strong sense of responsibility and team work.</li><li>Ensure non-conformance is dealt with in a proper and effective manner.</li><li>Establish, review and perform regular update of FMEA, OCAP, Process control, Risk Assessment and SIPOC on all critical processes to ensure a robust process.</li><li>Compliance with CSR, EHS, QM, ESD, 5S standard and cleanroom protocol.</li></ul> Requirements: <ul><li>Minimum Bachelor’s degree in Physics / Chemistry / Material Science/ Mechanical / Electronic or Electrical Engineering or equivalent.</li><li>Knowledge on semiconductor process technology.</li><li>Possess strong technical competencies in his field of study.</li><li>Good knowledge of statistical and quality tools.</li><li>Able to work under pressure and with strong commitment at work.</li><li>Experience with software applications such as MS Power Point, Excel and Word.</li><li>Experience with Lithography tools (Optional)</li></ul>

Lithography Equipment – we can look at combination of talent coming with:Candidates with experience from any module will be considered for a junior role.Experienced individuals with past litho and current in other module but willing to explore the litho role; shall be considered for a senior equipment litho role.Also, can look at another possibility of candidates coming with litho process experience and are willing to take up the equipment litho role. Responsibilities:Drive equipment fault investigations and continuous improvement programs to resolve chronic equipment issues, and institute permanent resolutions to assure product quality and enhance process robustness.Enforce on equipment maintenance controls and execution to conform to work instructions and procedures. Apply hands-on and with deep involvement at work.Provide effective equipment training to the technicians to build up their technical and skill competencies.Ensure non-conformance is dealt with in a proper and effective manner.Manage and control spare parts availability and costs.Manage vendor services and supports and ensuring compliance with factory protocol.Establish, review and perform regular update of PM procedures, Risk Assessments and Troubleshooting guidelines.Execute the equipment move-in, installation, set up and buy-off , meeting set timelines.Compliance with CSR, EHS, QM, ESD, 5S standard and cleanroom protocol.Requirements:Minimum Bachelor’s Degree in Electronic or Electrical Engineering or equivalent.Experience in high volume production of electronic components in an MNC or semi-conductor industry.Possess strong technical competencies in his field of study.Good knowledge of statistical and quality tools.Able to work under pressure and with strong commitment to work.Experience on computer systems and proficient with software applications such as MS Power Point, Excel and Word.

Responsibilities:Drive equipment fault investigations and continuous improvement programs to resolve chronic equipment issues, and institute permanent resolutions to assure product quality and enhance process robustness.Enforce on equipment maintenance controls and execution to conform to work instructions and procedures. Apply hands-on and with deep involvement at work.Provide effective equipment training to the technicians to build up their technical and skill competencies.Ensure non-conformance is dealt with in a proper and effective manner.Manage and control spare parts availability and costs.Manage vendor services and supports and ensuring compliance with factory protocol.Establish, review  and perform regular update of PM procedures, Risk Assessments and Troubleshooting guidelines.Execute the equipment move-in, installation, set up and buy-off , meeting set timelines.Compliance with CSR, EHS, QM, ESD, 5S standard  and cleanroom protocol.Requirements:Minimum  Bachelor’s Degree in Electronic or Electrical Engineering or equivalent.Experience in high volume production of electronic components in an MNC or semi-conductor industry.Possess strong technical competencies in his field of study.Good knowledge of statistical and quality tools.Able to work under pressure and with strong commitment to work.Experience on computer systems and proficient with software applications such as MS Power Point, Excel and Word.

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4 lithography Jobs found

Technical Director, Advanced Packaging Integration

Process Engineer(Functional Litho & Acoustic Litho)

Engineer/ Senior Engineer (Equipment & Process)- Lithography/Photolithography

Equipment Engineer - Lithography

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4 lithography Jobs found

Technical Director, Advanced Packaging Integration

Process Engineer(Functional Litho & Acoustic Litho)

Engineer/ Senior Engineer (Equipment & Process)- Lithography/Photolithography

Equipment Engineer - Lithography

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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