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Skills

python
sql
aws
azure
java
advanced packaging
communication skills
data analysis
data analytics
data modeling

Industry

food production
logistics and supply chain

Location

bengaluru, india
singapore, singapore
chennai, india
houston, united states
raleigh, united states
dubai, united arab emirates
gurgaon, india
mexico city, mexico
atlanta, united states
cwmbran, united kingdom

Jobtitle

principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
accounts receivable (6 months contract)
ai analytics and visualization engineer
aml and compliance manager
api sr/lead developer
applications developer
associate data engineer
ceo executive assistant
commercial finance manager

Filter

56 modeling and simulation Jobs found

1-10 of 56
M

Bengaluru, India

M

Product DevelopmentEngineering ManagementProduct DesignProject ManagementEngineering Analysis
A

Bengaluru, India

A

DatabricksSnowflakeVisualizationKPI DesignPythonBI & VisualizationAWSAzureGCP
S

Dubai, United Arab Emirates

S

Data Analysis & Business IntelligenceStrategic Partnerships & NegotiationMarket & Competitive AnalysisFinancial & P&L UnderstandingCommercial Strategy & Business Planning
S

Singapore, Singapore

S

Technical Documentation3D Quantum IntegrationCryogenic PackagingAdvanced PackagingThermal ManagementMechanical Design
S

Dubai, United Arab Emirates

S

Collection & Recovery ManagementCompliance & DocumentationTarget & KPI AchievementCash Flow & DSO ManagementPayment Negotiation & Settlement
S

Singapore, Singapore

S

Threat Detection & ResponseThreat HuntingSIEM & Detection ToolsEndpoint & Network SecurityIncident Response
S

Bengaluru, India

S

Documentation SkillsProject & Change ManagementSignavio SkillsProcess Improvement MethodologiesSAP KnowledgeBusiness Process ManagementData & Analytics
S

Houston, United States

S

NegotiationContract DraftingSupplier QuotationsProcurementSourcingSupply Chain

Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer