Director, Advanced Packaging Disruptive Technology

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Responsibilities: Disruptive Pathfinding &amp; Technology Strategy <ul><li>Define and execute long-range (N+2 and beyond) pathfinding roadmap for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.</li><li>Drive concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms (e.g., novel interconnect schemes, heterogeneous integration architectures, advanced substrate innovations).</li><li>Evaluate emerging technology options and guide make/buy/partner decisions to establish differentiated capability ahead of industry adoption cycles.</li><li>Anticipate and define technology inflections aligned to AI, HPC, memory integration, chiplet ecosystems, and future system architectures.</li></ul> Innovation Leadership &amp; Team Building <ul><li>Build, lead, and inspire a world-class pathfinding and innovation team, fostering a culture of bold thinking, experimentation, and calculated risk-taking.</li><li>Instill an innovation-first mindset, encouraging teams to challenge existing assumptions and explore unconventional solutions.</li><li>Establish structured frameworks for idea generation, incubation, rapid prototyping, and down-selection.</li><li>Mentor technical leaders and create a pipeline of innovation talent capable of sustaining long-term differentiation.</li></ul> Customer &amp; Market-Driven Innovation <ul><li>Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.</li><li>Engage deeply with key customers to identify latent needs and unmet challenges not addressed by current packaging solutions.</li><li>Drive creation of new product concepts and technology platforms that deliver step-function improvements in performance, cost, power, and scalability.</li><li>Position offerings to create clear value differentiation and long-term competitive advantage.</li></ul> Ecosystem Development &amp; Strategic Partnerships <ul><li>Build and lead a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.</li><li>Identify and activate disruptive partnerships that accelerate innovation cycles and enable early validation of emerging technologies.</li><li>Drive joint development programs and consortia engagement to shape industry direction and standards.</li></ul> Program Leadership &amp; Execution Governance <ul><li>Establish governance models for early-stage technology programs, balancing exploration with execution discipline.</li><li>Drive alignment across engineering, product, and business units to transition pathfinding concepts into development pipelines.</li><li>Develop executive-level narratives and decision frameworks to communicate technology trade-offs, investments, and strategic priorities.</li><li>Ensure learnings from early exploration are captured, scaled, and leveraged across the organization.</li></ul> Leadership Expectations <ul><li>Visionary Technology Leader: Anticipates industry disruption and defines future-state architectures ahead of the market.</li><li>Innovation Catalyst: Creates an environment where breakthrough ideas are generated, tested, and scaled.</li><li>Strategic Connector: Bridges customer roadmaps, internal capabilities, and ecosystem innovations into cohesive strategies.</li><li>Builder of Teams &amp; Culture: Attracts, develops, and retains top talent while fostering collaboration and accountability.</li><li>Decisive Change Agent: Operates effectively in ambiguity, making high-impact decisions with incomplete data.</li></ul> Requirements: <ul><li>15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.</li><li>Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.</li><li>Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc), with the ability to think beyond existing paradigms.</li><li>Proven experience building and leading cross-functional or exploratory R&amp;D teams.</li><li>Ability to translate complex technology concepts into business impact and strategic direction.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Development <ul><li>Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.</li><li>Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.</li><li>Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates).</li><li>Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.</li><li>Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.</li></ul> Technical Innovation &amp; Execution <ul><li>Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.</li><li>Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.</li><li>Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.</li><li>Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.</li><li>Document and communicate findings to influence technology roadmap decisions and downstream development programs.</li></ul> Customer &amp; Market Alignment <ul><li>Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems.</li><li>Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.</li><li>Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits.</li></ul> Ecosystem Collaboration <ul><li>Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.</li><li>Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.</li><li>Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.</li></ul> Program Contribution &amp; Technical Leadership <ul><li>Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.</li><li>Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities.</li><li>Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.</li><li>Mentor junior engineers and contribute to building technical depth and innovation culture within the team.</li></ul> Leadership Expectations <ul><li>Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration.</li><li>Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact.</li><li>Influencer: Drives alignment and decisions across teams without formal authority.</li><li>Problem Solver: Thrives in ambiguity, breaking down complex challenges into actionable solutions.</li><li>Collaborator: Effectively works across organizational and ecosystem boundaries.</li></ul> Requirements: <ul><li>10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.</li><li>Demonstrated experience in technology development, pathfinding, or exploratory R&amp;D.</li><li>Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).</li><li>Proven ability to solve complex technical problems and translate concepts into experimental validation.</li><li>Strong communication skills to articulate technical insights and business relevance.</li></ul>

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Director, Advanced Packaging Disruptive Technology

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

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Director, Advanced Packaging Disruptive Technology

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

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