Manager I - R&D Product Development Engineering

Supply Chain Analyst

Technical Director, Advanced Packaging Integration

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

MFG & Process DVL Engineer 2

Production Manager

L3 Production Support (AS400, RPG), Core Banking

Role Description: <ul><li>Automotive Industry offers products for vehicle electrification systems like chassis systems, convenience applications, driver information, infotainment solutions, miniaturization solutions, motor and powertrain applications etc.&nbsp;</li><li>The client Automotive BU is focused on developing new and improved vehicle architecture approaches to efficiently address these challenges in Connectivity from power to propulsion and safety.&nbsp;</li><li>The Manager R&amp;D Product development contributes to the development of organizational strategy and supports in implementation of operational plans.</li><li>Being part of Product development team responsible to develop for new products and sustenance of existing product lines of Automotive business unit of client.</li><li>This position drives development of PCB connectors for automotive applications including Board to Board, Wire to Board and Flex to Board connectors.</li></ul> Responsibilities: <ul><li>Managing experienced professional and/or supervisors who exercise independence in their assignments and providing them with the required guidance and also be a strong technical contributor.</li><li>Providing strategic leadership to foster growth of the business.</li><li>Interacting and cooperating with multiple organizational levels to meet schedule and technical expectations.</li><li>Administrating schedules and ensuring performance requirements.</li><li>Providing knowledge of engineering tools such as Creo, etc. and product domain expertise in multiple projects.</li><li>Assist Inside Device Connectivity (InDeCo) engineering teams with New Product Developments across a range of projects and executing on cost optimization/reduction (VA/VE) opportunities for the business.</li><li>Preparing design verification test plans, Design &amp; Process FMEAs.</li><li>Successfully facilitate transfer and support of new product introduction (NPI) into high volume manufacturing.</li><li>Contributing to technical function initiatives across various initiatives.</li><li>Reverse Engineering and benchmarking of competitor products.</li><li>Support product environmental compliance and approvals for all new products and platforms as required by our customers.</li><li>Be a strong technical partner and provide support to Product management teams.</li><li>Attend/support customer meetings, technology days and site visits as required.</li></ul> Requirements: <ul><li>Master’s degree in mechanical engineering or equivalent is preferred with minimum 8 years of experience in related fields.</li><li>Mechanical or equivalent engineering Degree with minimum 10 years of related product development experience.&nbsp;</li><li>Experience with product design of PCB Connector such as Board to Board, Flex to Board, Wire to Board is essential.</li><li>Knowledge in product design of plastic, terminals (sheet metal), fine pitch connectors, rubber components.</li><li>Working knowledge of driving diversity and inclusion, customer/market focus, result orientation, managing multiple priorities, envisioning the future, coaching and developing people and collaborating across boundaries</li><li>Extensive experience executing plans in a disciplined way and in holding people accountable.</li><li>Organized, methodical and self-motivated individual.</li><li>A person with the ability to achieve goals and the highest standards of performance in a dynamic fast paced environment.</li><li>Attention to detail and on time delivery.</li><li>Excellent judgment, timely and high-quality decision-making skills.</li><li>Proven ability to execute engineering deliverables.</li><li>Strong customer service mindset and mentality of delivering quality products and services on time and within company cost and profitability objectives.</li><li>Fluent communication skills facilitate collaboration with own team, customers, internal business leaders and technology leaders to create value.</li><li>Individual must be self-motivated, have strong planning skills and be able to deal with and balance multiple competing priorities.</li></ul> Functional: Mandatory: <ul><li>Working knowledge of product development (Processes, Approaches, Tools and Techniques) &amp; Validation</li><li>Working knowledge of manufacturing processes like injection Mold, plating, assembly &amp; High-speed stamping</li><li>Working knowledge to apply Six Sigma / DFSS methodology to design, development, and delivery of technology products and process.</li><li>Working knowledge in use of CAD systems (CREO Part modeling &amp; Sheet Metal)</li><li>Interpretation of simulation results &amp; translating into product design</li><li>Working knowledge in Design for Manufacturability (DFM) &amp; FMEA&nbsp;</li><li>Proficient in Tolerance stack-up and GD&amp;T</li><li>Ability to generate design concepts and solve design problems&nbsp;</li><li>Working knowledge in prototyping methods</li><li>Working knowledge in Manufacturing process (Molding / Stamping / Plating)</li><li>Understanding of linear and non-linear analysis</li><li>Working knowledge of product life cycle.</li><li>Basic Knowledge in quality tools (8D, Why Why analysis, Fish bone….)</li><li>Awareness of recognition &amp; protection of IP (intellectual property) features</li><li>Basic knowledge of PPAP documentation.</li></ul> Preferred: <ul><li>Knowledge of customer application&nbsp;</li><li>Experience in development of automotive signal and power connectors.</li></ul> Department specific: <ul><li>Exposure to PCB Connector design</li><li>Ability to understand specifications for validation as per US CAR / LV 214 / Similar Specification</li><li>Knowledge about crimping technologies, Ultrasonic welding technologies, Laser welding technologies</li></ul>

Roe Description: <ul><li>Transportation Solutions BU makes products for Connecting and Sensing Data, Power and Signal for vehicles ranging from Two wheelers to Heavy Commercial trucks.</li><li>There is a clear business strategy till 2025 to support the business growth. The growth is driven mainly driven from localization of Core India Specific products and also New technology products.</li><li>To establish “Single source of Truth” by integrating and maintaining all Key performance metrics of SCM/CS LIVE through Tableau/Power BI</li><li>To define the Capacity/Demand ratio for each part at each source location and make a trigger mechanism for new capacity&nbsp;</li><li>To optimize the supply network by exploring opportunities to increase sea vs Air movement from Source country to India Warehouse and exploring clubbing opportunities at Source.&nbsp;</li><li>Need to closely work with SCM team and Global Logistics team for integrated results.</li><li>To continuously monitor the ageing stock (SCM) and ageing orders (CS)</li></ul> Responsibilities: Capacity/Demand ratio: <ul><li>Establish the C/D ratio of each part in each source plant and work with Planner for getting enhanced capacity as per demand.</li><li>Also work with Demand team and Sales &amp; Marketing to get validated 24 months forecast</li></ul> Supply Network Optimization: <ul><li>To optimize the supply network by exploring opportunities to increase sea vs Air movement from Source country to India Warehouse and also exploring clubbing opportunities at Source.&nbsp;</li><li>Need to closely work with SCM team and Global Logistics team for integrated results.</li></ul> Monitor ageing stock and orders: <ul><li>To continuously monitor the ageing stock (SCM) and ageing orders (CS) and work with CS/SCM/sales &amp; marketing to liquidate those stocks/orders.</li></ul> Analytics: <ul><li>Work with application and product marketing and managing alternate part master.</li></ul> Requirements:&nbsp; <ul><li>MBA in Supply Chain&nbsp;</li><li>Expertise in Excel</li><li>Understanding of Tableau/Power BI</li><li>Understanding in SAP IBP</li><li>2 to 5 years of experience Handling large scale transformational SCM projects like SAP IBP/APO.</li><li>Extensive exposure to Excel/Macros.</li><li>Experience in Plant production planning.</li><li>SAP IBP - Conduct the IBP execution starting from demand review, supply review and integrated reconciliation</li><li>Strategic agility - Long Term capacity planning.</li><li>Supply network planning - Supply Network optimization by choosing the right network (Factory - SKU’s – Depot) based on the minimum total delivered cost (Freight Cost, Conversion Cost, Raw material cost and Tax benefit).</li><li>Frequency from factory to warehouse).</li><li>Ability to understand customer requirements.</li><li>Stakeholder alignment - Developing relationships and partnerships with key customers, industry leaders and core suppliers.</li></ul>

Responsibilities: <ul><li>Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies</li><li>Define, document, and implement end-to-end process flows for panel-level packaging technologies</li><li>Lead material selection, characterization, and compatibility assessments for large form factor substrates</li><li>Partner with customers to define and align process specifications and acceptance criteria</li><li>Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers</li><li>Contribute to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps</li><li>Analyze process data to identify trends, drive optimization, and improve performance</li><li>Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability</li><li>Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions</li><li>Publish and present technical findings at leading industry conferences and in peer-reviewed journals</li><li>Mentor and guide early-career engineers; provide technical direction and best practices</li></ul> Requirements: <ul><li>Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field</li><li>In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows</li><li>Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level</li><li>Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs</li><li>Proficiency in statistical data analysis (e.g. DoE, JMP)</li><li>Knowledge of industry standards and best practices in semiconductor packaging</li><li>Solid understanding of process characterization, metrology, materials &amp; failure analysis</li><li>Working knowledge of reliability requirements and qualification methodologies</li><li>Proven capability to lead multi-functional teams to resolve complex technical problems</li><li>Exceptional written and verbal communication skills</li><li>Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts</li><li>Drive structured technical discussions with customers and suppliers</li><li>Articulate positions, influence decisions, and align technical direction</li><li>Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications</li><li>Ability to work effectively across geographies and time zones</li></ul>

Responsibilities: <ul><li>Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products</li><li>Manage, develop, plan and execute process engineering projects for entire range of products</li><li>Interact with key customers to resolve significantly complex process engineering issues for entire range of products</li><li>Develop and implement new technology, products and analytical instrumentation</li><li>Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products</li><li>Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products</li><li>Contributes to market share gains through technology improvement</li></ul> Requirements: <ul><li>Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.</li><li>8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition technologies.</li><li>Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.</li><li>Proven experience leading process development, technology innovation, and product qualification in an R&amp;D environment.</li><li>Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.</li><li>Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.</li><li>Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.</li><li>Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.</li><li>Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Development <ul><li>Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.</li><li>Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.</li><li>Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates).</li><li>Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.</li><li>Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.</li></ul> Technical Innovation &amp; Execution <ul><li>Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.</li><li>Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.</li><li>Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.</li><li>Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.</li><li>Document and communicate findings to influence technology roadmap decisions and downstream development programs.</li></ul> Customer &amp; Market Alignment <ul><li>Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems.</li><li>Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.</li><li>Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits.</li></ul> Ecosystem Collaboration <ul><li>Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.</li><li>Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.</li><li>Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.</li></ul> Program Contribution &amp; Technical Leadership <ul><li>Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.</li><li>Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities.</li><li>Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.</li><li>Mentor junior engineers and contribute to building technical depth and innovation culture within the team.</li></ul> Leadership Expectations <ul><li>Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration.</li><li>Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact.</li><li>Influencer: Drives alignment and decisions across teams without formal authority.</li><li>Problem Solver: Thrives in ambiguity, breaking down complex challenges into actionable solutions.</li><li>Collaborator: Effectively works across organizational and ecosystem boundaries.</li></ul> Requirements: <ul><li>10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.</li><li>Demonstrated experience in technology development, pathfinding, or exploratory R&amp;D.</li><li>Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).</li><li>Proven ability to solve complex technical problems and translate concepts into experimental validation.</li><li>Strong communication skills to articulate technical insights and business relevance.</li></ul>

Responsibilities: <ul><li>Create 3D integration and packaging solutions for different platforms and quantum structures</li><li>Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices</li><li>Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines</li><li>Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues</li><li>Generate internal and external documentation for products, presentations and technical reports</li><li>Design and conduct experiment, measure material and device properties and interpret data</li><li>Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies</li><li>Collaborate with customers, start-ups, or universities to identify key problems and develop enabling solutions</li></ul> Requirements: <ul><li>PhD, Masters, or Bachelors degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.</li><li>5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.</li><li>Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip, and related packaging technologies.</li><li>Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology.</li><li>Experience with DOE, data analysis, process optimization, and root cause analysis.</li><li>Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.</li><li>Strong problem-solving, technical communication, and cross-functional collaboration skills.</li><li>Ability to work effectively with customers, startups, universities, and multidisciplinary R&amp;D teams.</li></ul>

Responsibilities: <ul><li>Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines</li><li>Perform hardware characterization on a variety of difficult systems, within safety guidelines</li><li>Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues</li><li>Generate internal and external documentation for products, presentations and technical reports</li><li>Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision</li><li>Measure film properties and interpret data</li><li>Identify, select and work with vendors and suppliers with limited supervision</li><li>Implement new technology, products and analytical instrumentation</li></ul> Requirements: <ul><li>PhD or Masters Degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field</li><li>Research focus in semiconductor would be an added advantage</li><li>Relevant experiences in semiconductor process development field</li><li>Good communication and interpersonal skills</li><li>Problem-solver attitude with determination and quality-mindset</li></ul>

Responsibilities: <ul><li>High-Speed Stamping Die Design – Hands-on experience in designing and developing high-precision, high-speed progressive dies, including strip layout, component design, tolerance management, die trials, troubleshooting, and prove-out.</li><li>DFM &amp; Product Understanding – Excellent DFM skills with strong knowledge of automotive product drawings, GD&amp;T, and customer specifications, converting product requirements into feasible stamping concepts.</li><li>Die Costing &amp; Project Management – Proficient in die cost estimation covering materials, machining, standard components, and tooling investment, with end-to-end project handling from RFQ and design through validation and PPAP.</li><li>Communication &amp; Negotiation – Strong communication and negotiation skills for effective customer, supplier, and cross-functional coordination, including technical discussions, change management, timelines, and cost negotiations</li><li>Demonstrate a proactive approach and apply lateral thinking to solve problems and improve processes.</li></ul> Requirements: <ul><li>Bachelor’s degree in mechanical engineering</li><li>Post Diploma in Tool design</li><li>Diploma in Tool making</li><li>5 to 10 years of relevant experience.</li><li>Proficient with CAD software – 3D modelling, 2D drafting, and assembly.</li><li>Proficient with MS Office tools.</li><li>Good knowledge in manufacturing processes.</li><li>Good communication skills for stakeholder interaction; proactive and capable of lateral thinking.</li></ul>

Responsibilities: <ul><li>Lead and manage daily production operations to ensure safety, quality, delivery, and cost targets are achieved.</li><li>Drive continuous improvement initiatives, including Lean Manufacturing, Six Sigma, and Kaizen activities.</li><li>Develop and implement production plans, schedules, and resource allocation to meet customer demand.</li><li>Ensure compliance with company standards, regulatory requirements, and environmental health &amp; safety (EHS) policies.</li><li>Foster a culture of teamwork, accountability, and high performance across production teams.</li><li>Monitor production KPIs (efficiency, scrap, downtime, OEE) and implement corrective actions where necessary.</li><li>Collaborate with cross-functional teams (Engineering, Quality, Supply Chain, Maintenance) to resolve issues and support operational excellence.</li><li>Lead, coach, and develop production supervisors, line leaders, and technicians to build strong leadership capability.</li><li>Support new product introductions (NPI) and transfer projects with minimal disruption to ongoing operations.</li><li>Manage production budgets, manpower planning, and cost optimization initiatives.</li></ul> Requirements: <ul><li>Bachelor’s Degree in Engineering, Manufacturing, or related field.</li><li>Minimum 8–10 years of manufacturing experience, with at least 5 years in a leadership/managerial role.</li><li>Strong background in Lean Manufacturing, Continuous Improvement, and EHS compliance.</li><li>Experience in high-volume manufacturing (preferably cable, electronics, or related industries).</li><li>Excellent leadership, communication, and problem-solving skills.</li><li>Ability to work under pressure and manage multiple priorities.</li><li>Proficiency in English; Mandarin is an added advantage.</li></ul>

Responsibilities: <ul><li>Act as the focal point of contact for technical resolutions while managing the incident, problem and knowledge management processes for the applications in scope.</li><li>Provide comprehensive support to internal customers; achieve resolution to outstanding problems or issues.</li><li>Manage 3rd party product vendors and integration partners to ensure application code fix deliveries are timely and good quality.</li><li>Design appropriate metrics for reporting on key performance and quality indicators.</li><li>Test, maintain and recommend software improvements to ensure strong functionality and optimization.</li><li>Work with production support team members to conduct root cause analysis of issues, review new and existing code and/or perform unit testing.</li><li>Work with business stakeholders to manage and prioritize the overall book of work in terms of problem remediation.</li><li>Contribute to improvement initiatives relating to methods, tools, people, architecture, project management and governance.</li></ul> Requirements: <ul><li>Degree in Computer Science, Engineering or similar domain; Additional professional/technical qualifications will be advantageous.</li><li>At least 6 years’ experience in relevant Banking applications / Information Technology.</li><li>Proficient in IBM AS400 platform, RPG, COBOL, CL programming.</li><li>Good understanding and experience in of Software Development Life Cycle (SDLC) or AGILE.</li><li>Well-versed in service management or production support’s process flow and cycle.</li><li>Experience leading a small team and providing guidance to junior developers.</li><li>Knowledge of Silverlake’s banking software suite is an added advantage.</li></ul>

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75 optimization Jobs found

Manager I - R&D Product Development Engineering

Supply Chain Analyst

Technical Director, Advanced Packaging Integration

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

MFG & Process DVL Engineer 2

Production Manager

L3 Production Support (AS400, RPG), Core Banking

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75 optimization Jobs found

Manager I - R&D Product Development Engineering

Supply Chain Analyst

Technical Director, Advanced Packaging Integration

Process Engineering Manager (Electroplating)

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

MFG & Process DVL Engineer 2

Production Manager

L3 Production Support (AS400, RPG), Core Banking

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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WhiteCrow is on a mission to connect companies with the best talent across the globe.