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Skills

advanced packaging
advanced semiconductor packaging
python
visual basic
advanced interconnects
advanced packaging integration
micro-bump & fine-pitch interconnects
advanced packaging architecture
advanced packaging strategy
advanced quality engineering

Industry

No results found


Location

singapore, singapore
dubai, united arab emirates
bangkok, thailand
paris, france

Jobtitle

principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
director, advanced packaging disruptive technology
gps (global product support) engineer
sales manager - emergency lighting and fire alarm & detection systems
senior executive - retail product development
senior manager - revenue management
senior member of technical staff (advanced packaging pathfinding)
sr. manager, quality & reliability engineering

Filter

14 package pathfinding Jobs found

1-10 of 14
T

Singapore, Singapore

T

Thermal ManagementAdvanced Packaging IntegrationPackage ArchitectureAdvanced InterconnectsHeterogeneous IntegrationProcess Integration
D

Singapore, Singapore

D

Advanced Packaging StrategyDisruptive Technology DevelopmentAdvanced InterconnectsProcess TechnologyTechnology Pathfinding
S

Singapore, Singapore

S

Advanced Packaging ArchitecturePackage PathfindingMaterials EngineeringDesign for ManufacturingProcess Development
S

Dubai, United Arab Emirates

S

New Product DevelopmentProcurementInternational ProcurementNegotiationInternational Business
S

Dubai, United Arab Emirates

S

Automation and Reporting ToolsCore Revenue Management SkillsCommercial SkillsData & AnalyticsLeadership & Stakeholder ManagementRevenue Management Systems

Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer

Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies

DOEAdvanced PackagingWafer FabVisual BasicPython

Visual BasicRMSWarpage ControlPythonAdvanced PackagingWafer Bonding