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Jobtitle
director, data science
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
account executive
api sr/lead developer
application developer - erp
associate data engineer
associate director ra & qa
associate engineer - factory innovation
Filter
72 r programming Jobs found
1-10 of 72
S
Senior Manufacturing Engineer
an hour ago
S
Management & LeadershipManufacturing Engineering SkillsContinuous ImprovementQuality & Process ImprovementTechnical & Production SkillsLean & Operational Excellence
A
Associate Engineer – Factory Innovation
12 days ago
A
Quality & SafetyPeople ManagementManufacturing SkillsAutomationDigital ManufacturingFactory EngineeringContinuous Improvement
S
Social Content Producer
14 days ago
S
Social Content ProductionAudience InsightsSocial Media Content CreationCore Content SkillsSocial Media SkillsEditing & Creative ToolsAnalytics & PerformanceProduction & Coordination
S
Senior Corporate Strategy Analyst
15 days ago
S
Business TransformationProblem SolvingMarket and Competitive AnalysisCorporate Strategy and Business PlanningAdvanced ExcelData Visualization
S
Software Engineer – Ag & Trade
21 days ago
S
REST APIDockerSoftware DevelopmentFull Stack DevelopmentJava Spring BootJavascriptProduction Developing
C
Customer Quality Engineer
a month ago
C
Six Sigma8DQualityFailure AnalysisReliability EngineeringCustomer Interface
T
Territory Sales Executive
a month ago
T
Business DevelopmentChannel SalesRefrigerationTechnical SalesTechnical QualificationsHvacApplication Engineering
P
Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology
Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer
Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
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