Front-End Process Integration Engineer

Lead Workplace Services (VP2)

Senior PCB Component Engineer

Senior Component Engineer - Interconnect & Connector Components

MGR II Qlty & Reliability Engineering

Assistant Vice President (AVP) – Production Support

Principal/Staff Engineer – Firmware Development

Principal NAND Reliability Product Engineer

Staff/Principal Engineer - CMP Advanced NAND

Fronted End Central Process Integration Senior Engineer

Responsibilities: Yield Improvement and Failure Analysis: <ul><li>Own overall Front-End process yield performance and drive continuous yield improvement initiatives.</li><li>Perform comprehensive wafer scrap analysis and identify root causes of yield loss through data-driven investigations.</li><li>Partner closely with process module engineers, manufacturing, quality, and equipment teams to resolve process-related yield excursions.</li><li>Develop and implement effective corrective and preventive actions to eliminate recurrence of process and quality issues.</li><li>Lead cross-functional investigations and continuous improvement projects to improve process capability and manufacturing robustness.</li><li>Capture lessons learned into organizational knowledge databases to ensure long-term sustainability.</li></ul> Process Optimization and Development: <ul><li>Design, execute, and analyze Design of Experiments to optimize process conditions and establish robust manufacturing windows.</li><li>Evaluate process performance using statistical techniques and advanced quality tools.</li><li>Identify opportunities for baseline yield, cycle-time, and cost improvements across Front-End processes.</li><li>Support new technology introductions, process qualifications, and industrialization activities.</li></ul> Process Change Management: <ul><li>Plan, coordinate, and execute process changes through Limited Change Requests, ECNs, and qualification activities.</li><li>Assess manufacturing risks associated with process modifications and ensure successful implementation without adverse impact on yield, quality, reliability, or customer requirements.</li><li>Monitor post-implementation performance and drive timely closure of action items.</li><li>Process Transfer and Production Ramp</li><li>Support engineering runs, process flow creation, and manufacturing readiness activities for new products and technologies.</li><li>Coordinate required tooling, accessories, documentation, and process setup activities.</li><li>Review engineering lot results and ensure smooth transition into volume production.</li><li>Monitor initial production performance and drive corrective actions where required.</li></ul> Cross-Functional Collaboration: <ul><li>Work closely with Technology Development teams in Singapore and other development sites on new industrialization projects.</li><li>Provide technical leadership and integration support across process, equipment, manufacturing, quality, and product engineering functions.</li><li>Communicate technical findings, risk assessments, and recommendations effectively to management and stakeholders.</li></ul> Customer Satisfaction: <ul><li>Provide timely initial responses to customer queries.</li><li>Drive rapid containment of yield and performance issues.</li><li>Ensure customer communications are accurate, complete, and clear.</li><li>Close issues and projects within committed timelines through proactive management and without escalation.</li><li>Deliver customer commitments on time</li></ul> Requirements: <ul><li>Bachelor’s Degree in Electrical Engineering, Electronics Engineering, Materials Engineering, Microelectronics, Semiconductor Engineering, or an equivalent discipline.</li><li>Experience in semiconductor wafer fabrication or high-volume electronics manufacturing. Front-End semiconductor process integration experience is highly preferred.</li><li>Hands-on involvement in new technology introduction, process qualification, industrialization, manufacturing ramp-up, yield enhancement, or process control methodologies.</li></ul>

Responsibilities: Technical Leadership &amp; Ownership: <ul><li>Act as the technical lead for M365, Exchange, and workplace infrastructure services.</li><li>Provide guidance, mentoring, and knowledge sharing to L2/L3 engineers.</li><li>Own platform health, capacity planning, and continual service improvement initiatives.</li><li>Drive architectural decisions and best practices across collaboration, VDI, and endpoint environments.</li></ul> Platform Administration &amp; Support: <ul><li>Manage and support M365 collaboration tools, including Exchange (On-Premise, Hybrid, and Online).</li><li>Oversee and support VMware Horizon (VDI) infrastructure, ensuring availability, performance, and user experience.</li><li>Manage endpoint management solutions (e.g., device compliance, patching, security baselines).</li><li>Provide L3 support for complex incidents and service requests, ensuring timely resolution and root cause analysis.</li></ul> Unified Communications &amp; Workplace Services: <ul><li>Support and troubleshoot Unified Communications platforms (e.g., Teams voice/video, collaboration features).</li><li>Collaborate with network and voice teams to resolve communication-related issues.</li><li>Ensure seamless user experience across collaboration and communication tools.</li></ul> Security &amp; Compliance: <ul><li>Administer and support MDM Blackberry mobile suite, Trend Micro, Enterprise Vault, and MTD/MFA solutions.</li><li>Ensure compliance with enterprise security policies, including endpoint and access controls.</li><li>Oversee secure access using IT Admin LAN and Production VDI environments for privileged operations.</li><li>Enforce governance and privileged access management processes.</li></ul> Automation &amp; Optimization: <ul><li>Use PowerShell scripting and automation tools to improve operational efficiency.</li><li>Identify opportunities for process automation and proactive monitoring.</li><li>Drive continuous improvement initiatives for system reliability and performance.</li></ul> Incident &amp; Service Management: <ul><li>Lead major incident management (MIM) calls for workplace services.</li><li>Perform advanced troubleshooting and triage of platform-related issues.</li><li>Work closely with the Workplace IT Service Desk for escalations and after-hours support.</li></ul> Stakeholder Engagement: <ul><li>Collaborate with cross-functional teams including infrastructure, security, and applications.</li><li>Act as a point of escalation for business-critical incidents.</li><li>Provide reporting, insights, and recommendations to management.</li></ul> Requirements: <ul><li>Have 8–12 years of experience in M365, Exchange, and enterprise workplace infrastructure.</li><li>Strong expertise in:</li><li>Exchange (On-Prem / Hybrid / Online)</li><li>M365 collaboration ecosystem (Mandatory)</li><li>VMware Horizon (VDI) (Mandatory)&nbsp;</li><li>Endpoint management platforms</li><li>Unified Communications support</li><li>Hands-on experience with security and mobility tools (MDM, MFA, Trend Micro, etc.).</li><li>Strong scripting and automation skills (PowerShell preferred).</li><li>Proven experience in leading teams or acting as technical lead.</li><li>Excellent problem-solving, communication, and stakeholder management skills.</li></ul>

Responsibilities: <ul><li>Partner with development engineers, commodity teams, and suppliers to create innovative PCB solutions.</li><li>Contribute to the development of PCB commodity strategy.</li><li>Participate in the supplier selection process. Assess and qualify PCB suppliers. Take part in technical and process audits of suppliers as needed.</li><li>Lead PCB failure analysis and drive containment, corrective actions, and risk assessment.</li><li>Work closely with manufacturing and engineering teams to resolve complex technical issues.</li><li>Collaborate with cross-functional teams across the organization. Effectively communicate complex technical concepts and solutions.</li></ul> Requirements: <ul><li>Possess Engineering/Chemistry/Material degree or equivalent, plus 10+ years PCB manufacturing experience.</li><li>Solid understanding and direct experience in PCB design specifications and requirements, qualification, manufacturing fabrication and test, coupled with familiarity of materials (laminates and resins) and reliability knowledge and experience.</li><li>Competency in failure analysis techniques such as FMEA, 8D/Corrective Action, Fishbone IFD, Cause and Effect Analysis, Design of Experiments (DOE), and risk assessment.</li><li>Experienced in managing supplier relationships and implementing corrective actions and rigorous quality control measures to ensure product standards and reliability are consistently met.</li></ul>

Responsibilities: <ul><li>Support qualification of connector and interconnect component site capabilities and product readiness.</li><li>Serve as a technical contributor in commodity teams; evaluate quality and reliability performance data and provide inputs for sourcing strategy.</li><li>Contribute to defect reduction and process re-engineering efforts related to interconnect components.</li><li>Identify, initiate, and help drive process improvements that reduce cycle time and cost while maintaining exceptional quality.</li><li>Support product transfer and change programs to sustain affected products and supplier sites.</li><li>Engage early in NPI and provide inputs for concurrent engineering efforts (DFM, FMEA, tooling design, plating, validation testing, etc.).</li><li>Provide technical support to the supply chain and engineering community, building toward subject-matter expertise in interconnect technologies.</li></ul> Requirements: <ul><li>Bachelors or Masters Degree in Mechanical Engineering, Electrical Engineering, or an equivalent field, with 5-7+ years of relevant industry experience.</li><li>Foundational hands-on exposure to interconnect and connector technologies at the application and component level, including the fundamentals of associated PCB attach technologies.</li><li>Familiarity with mechanical and electrical design principles — tolerance analysis, fabrication methods, materials selection, plating, and validation testing. Awareness of Signal Integrity (SI) fundamentals is a plus.</li><li>Experience with problem-solving and process improvement methodologies (8D, Lean Six Sigma) and FMEA facilitation techniques.</li><li>Experience managing multiple projects using established project management skills and tools.</li><li>Domain exposure to connector or interconnect component manufacturing processes preferred.</li><li>Requires on-site support at manufacturing facilities.</li><li>Strategically focused, impact-oriented, highly organized, and adaptable.</li><li>Fluent English and Vietnamese speaking and writing. Chinese speaking and writing is a plus.</li></ul>

Responsibilities: <ul><li>Primary responsibility for developing and driving standardized Design for Reliability Engineering (DfRE) and Robustness Validation (RV) Methodologies for all Power Products.</li><li>Drive a DFSS culture, one of innovation, constant learning, and continuous improvement that aspires to deliver "First Time Right"; provide product development and DFSS training, coaching, and mentoring to product design teams to create a world class product development organization.</li><li>Drive excellence in Design for Reliability ensuring comprehensive utilization of modeling and simulation, structured DOE approaches, robust product validation including HALT/HAST and Test to Failure (TTF) methodologies.&nbsp;Oversee integrating reliability considerations during technology &amp; product evaluation, NPI product development from receipt of Customer Spec (Mission Profile) through Product Release into mass production; will have T&amp;V Plan + Reliability Test Plan Finalization Authority for Power Products.</li><li>Partner with PDE’s to quickly produce and evaluate first samples to expedite speed to market and drive fast and iterative product design improvements; drive Early Concept Testing identifying potential weaknesses and failure mechanisms in the product design and validating all improvements through testing and capability analysis.</li><li>Work very closely with MPDE about Process Developments and Equipment Developments, developing comprehensive test plans to ensure capability to six sigma standards and driving world-class Simultaneous Engineering (Concurrent Engineering).</li><li>Support Mfg Quality with failure analysis (F/A) and Root Cause and Corrective Action (RCCA) of line scrap and customer returns as well as competitive benchmarking activities.</li><li>Lead the identification of special testing needs and requirements and partner with Global R&amp;T COE to develop Custom Test Equipment, Tests &amp; Test Specifications.&nbsp;Oversee all application testing for Power Products.</li><li>Drive high performance organization by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability.&nbsp;</li><li>Manage employee well-being by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives.</li><li>Drive organization effectiveness by structuring your organization in a way that best enables the BU strategy, maximizes resource efficiency and productivity, and provides role clarity and clear lines of accountability.</li><li>Manage the talent in your organization to support the business now and to proactively prepare for the future by identifying organization skillset/role gaps, implementing plans to fill any skillset/role gaps, and assessing current talent fit to ensure the right talent is matched to the right roles to best meet the needs of the business.</li></ul> Requirements: <ul><li>Bachelor/ Master’s degree in technical discipline (Electrical Engineering, Electronics, Mechatronics)</li><li>10+ years of Experience in all aspects of reliability engineering for electronic or mechatronics products from reliability estimation to reliability calculation and risk identification.</li><li>Must also have many years of experience working with test equipment, test systems, test labs, development and deployment of HALT/HAST testing, Test &amp; Validation Plans, development of custom test systems and performing “application tests.”&nbsp;Must have a good balance between theory and practice.</li><li>Experience interacting with global cross-functional engineering teams in multi-site global organization.</li><li>Excellent English, both verbal and written, and the ability to interact professionally with customers, leadership, stakeholders, cross functional teams and subject matter experts.</li><li>Exceptional analytical, critical thinking, and problem-solving skills and ability to make decisions when presented with a series of challenges, conflicts and constraints.&nbsp;Ability to drive to big picture goals and milestones while valuing and maintaining strong attention to the details.</li><li>Knowledge on FIT estimation methodology, statistical analysis for reliability calculation such as Weibull-analysis or 2-statistics, application of Bayes theorem, random failure principle, FMEDA, FTA</li><li>Reliability Engineering training from company, ASQ, TUV, Reliasoft or equivalent</li><li>Experience with custom product development, working closely with customers to define mission profile of the end application and optimizing reliability strategy based on customer needs.</li><li>Experience in running statistical analysis for reliability calculation for mechatronic products.</li><li>A high curiosity in understanding how systems/products work along with a reverse engineering mindset.</li><li>Willingness to travel as required, ~20%&nbsp;</li></ul>

Responsibilities: <ul><li>Technical Excellence: Lead complex incident resolution and root cause analysis (RCA) by performing deep-dive troubleshooting directly within application code.</li><li>System Stability: Proactively monitor production environments, identify potential bottlenecks, and implement automated solutions to enhance system reliability.</li><li>Technical Execution: Leverage hands-on expertise in one or more of the following: Bash, SQL, REST APIs, or Python to script automation and analyze system logs/queries.</li><li>Stakeholder Management: Serve as a primary point of contact for technical and business stakeholders during critical incidents, providing clear, concise, and timely updates.</li><li>Leadership &amp; Mindset: Champion a proactive culture of service improvement, documentation, and knowledge sharing across the global support team.</li><li>Collaborative Expansion: Work closely with the engineering, infrastructure, and DevOps teams to bridge the gap between development and operations.</li></ul> Requirements: <ul><li>Minimum 5 years of professional experience in IT, with at least 2 years specifically in application support, system administration, or a highly related technical field.</li><li>Demonstrated ability to perform production troubleshooting at the code/scripting level.</li><li>Education: Bachelor’s degree in computer science, Information Technology, or equivalent practical experience.</li><li>Technical Proficiency: Strong hands-on proficiency with Bash, SQL, REST APIs, or Python.</li></ul>

Responsibilities: SUPPORT CUSTOMERS AND DEBUG FIRMWARE <ul><li>Customer engineering support: Act as the primary technical escalation point for Security Firmware on SSD products — triage, prioritize, and drive customer reported security issues to closure within committed response times</li><li>Security feature enablement: Guide customers through the configuration, integration, and validation of SSD security features; including, but not limited to: TCG Opal/Pyrite/Ruby and Enterprise SSC, ATA and NVMe security commands, self-encrypting drive operation, secure boot and signed firmware update, sanitize and cryptographic erase, key management, and device attestation</li><li>Debug and root cause analysis: Reproduce customer, qualification, and field failures in the lab; analyze firmware logs, traces, and bus captures; debug Security Firmware source; and deliver documented root cause and corrective action</li><li>Firmware fixes and validation: Develop, unit test, and functionally validate targeted Security Firmware changes and customer specific configurations and builds, ensuring each change meets the security, functional, performance, and quality/reliability requirements of the technical spec matrix before release</li><li>Vulnerability and incident response: Assess the impact of reported vulnerabilities and security findings on products already in the field, and support mitigation planning, remediation delivery, and customer disclosure</li><li>Customer qualification and compliance support: Support customer security audits, security questionnaires, and certification activities (e.g. TCG specification compliance, FIPS 140-3, Common Criteria), and produce the application notes, integration guides, and technical documentation customers depend on</li></ul> STAKEHOLDER MANAGEMENT <ul><li>Represent our client in direct technical engagement with customer engineering teams, translating Security Firmware behavior, constraints, and risk into terms that are clear to both engineering and non-engineering audiences</li><li>Dedicatedly provide to management, multi-functional team members, and the firmware team consistent, detailed, and properly summarized information regarding customer issues, escalation status, and the progress of firmware fixes</li><li>Maintain accurate issue records, root cause reports, and knowledge base content so that recurring customer questions are answered faster over time</li></ul> PEOPLE DEVELOPMENT <ul><li>Multi-functional Teamwork: Develop and maintain collaborative, open and, constructive relationships with peers, management, and partner teams across firmware development, product engineering, quality, and field applications</li><li>Team Development: Provide technical capability that continuously improves team involvement, morale, and productivity</li><li>Personal Development: Work to continuously improve your technical capability and communication skills</li></ul> AI UTILIZATION <ul><li>Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and requirements.</li><li>Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.</li></ul> Requirements: <ul><li>Bachelors/masters degree in computer or electrical engineering with 5+ years of relevant experience.</li><li>Experience in a customer facing engineering role such as customer engineering support, field applications, sustaining engineering, or escalation management is strongly preferred</li><li>Embedded Security domain knowledge and experience, including cryptography fundamentals (AES, RSA/ECC, SHA), key management, secure boot, and secure firmware update</li><li>Familiarity with storage security standards and features such as TCG Opal and Enterprise SSC, ATA Security, NVMe security and sanitize commands, and self-encrypting drives is an advantage</li><li>Expertise in the use of programming languages (eg. C, C++, RUST), programming tools &amp; environments</li><li>Experience programming in Python for test automation, log parsing, and debug tooling is an advantage</li><li>Understanding of storage interfaces including ideally PCIe/NVMe, SATA, or SAS</li><li>Experience with NAND flash and other non-volatile storage is an advantage</li><li>Experience in storage industry, storage systems, or a related technology is an advantage</li><li>Proficiency in debugging and resolving code problems for firmware applications, including the use of debuggers, firmware trace and log analysis, and protocol analyzers</li><li>Experience with defect tracking, change control, and firmware release processes in a production or sustaining environment</li><li>Excellent written and verbal communication skills, with the ability to manage multiple concurrent escalations under time pressure and stay effective in customer visible situations</li><li>Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.</li></ul>

Responsibilities: <ul><li>Define and implement NAND Flash reliability test flows to assess product reliability performance and prevent extrinsic/intrinsic reliability escapes.</li><li>Perform high volume statistical data analysis to evaluate NAND DPM/ intrinsic reliability risks and trends.</li><li>Drive electrical failure analysis, including advance characterization, to identify root causes and solution spaces.</li><li>Develop short term countermeasures such as targeted stresses and screens, applying knowledge of digital/analog circuits, device physics, and process engineering.</li><li>Qualify the product with innovative control measures to provide best in Class DPM and Cell reliability.</li><li>Collaborate closely with Fab, NAND Technology, NAND Design, Product Development, System Development, and Quality/Reliability teams to develop solutions and enable shipment of high quality end products.</li></ul> Requirements: <ul><li>Bachelor’s degree&nbsp;with &gt; 10 years or Master’s degree&nbsp;with &gt; 7 years or PhD with &gt; 5 years&nbsp;of relevant experience in Electrical Engineering or related field.</li><li>Experience in Semiconductor Reliability, NAND Technology, and Electrical Failure Analysis.</li><li>In depth background in NAND Design, Device Physics, Circuits,&nbsp;Process, Test, Validation.&nbsp;</li><li>Experience with application of AI tools, LLMs ,&nbsp;data analysis tools (e.g., Python, JMP, Tableau)</li><li>Strong statistical analysis, communication, and problem solving skills.</li><li>Experience in leading cross functional projects and mentoring&nbsp;junior engineers.</li><li>Strong analytical and problem solving skills.</li><li>Team player and self driver.</li></ul>

Responsibilities: <ul><li>As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of company memory parts.</li><li>Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts</li><li>Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications</li><li>Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions</li><li>Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes</li><li>Incorporate best known manufacturing methods into early development phase of upcoming nodes</li><li>Design and implement advanced process monitoring and control methodologies</li><li>Provide strategic roadmap for N+, N++ and future NAND Nodes</li><li>Serve as a technical expert within company contributing to technical projects for improvements to processes, procedures, and equipment</li><li>Define and leads complex, multi-functional projects of critical importance to company, helps to define strategic direction</li><li>Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers</li><li>This position requires communication and collaboration with partners both locally and globally. Strict adherence to company Intellectual Property Protection policy is necessary</li></ul> Requirements: <ul><li>PhD with ≥5 years, or Master’s degree with ≥7 years, or Bachelor’s degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field, with demonstrated expertise in semiconductor Experience in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication.</li><li>Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads</li><li>Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology</li><li>Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes</li><li>An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.</li><li>Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.</li><li>Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.</li><li>Strong collaboration and communication skills (verbal and written).</li><li>Self-driven, adaptable, and able to manage multiple projects.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</li><li>Proven ability to take calculated risks and execute novel solutions.</li><li>Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.</li></ul>

Responsibilities: <ul><li>Collaborate with multi-functional network teams from PIE, Process &amp; Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop.</li><li>May require travel to global company sites to foster collaboration and drive execution.</li><li>Communicate module related issues to the Fab engineering and leadership teams.</li><li>Design, execute, and analyze experiments to improve fab process, yield, and quality.</li><li>Collect and interpret complex data to optimize Fab processes and increase yields.</li><li>Engage and/or lead cross-area engineering teams to tackle process issues.</li><li>Work closely with global partners to stay ahead of on module related topics and process alignment projects.</li><li>Collaborate with other PI module owners and sister fabs to drive business process alignment</li><li>Partner with IE, Process and Equipment Engineering and Production to better forecast and balance yield, output and process issues</li><li>Promote network synergy through improved benchmarking and standardization of known engineering best-known methods (BKMs), business process.</li></ul> Requirements: <ul><li>Bachelor’s or advanced degree in Engineering or Science is required</li><li>Strong analytical, logical, and critical thinking skills</li><li>Effective communicator, able to collaborate across all levels</li><li>Growth mindset with a passion for continuous learning</li><li>Internship or experience in the semiconductor industry is a plus</li><li>Demonstrated leadership and a track record of impact are highly desirable</li><li>Interest in and knowledge of the semiconductor industry and company is preferred.</li></ul>

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63 reliability technicianpackaging Jobs found

Front-End Process Integration Engineer

Lead Workplace Services (VP2)

Senior PCB Component Engineer

Senior Component Engineer - Interconnect & Connector Components

MGR II Qlty & Reliability Engineering

Assistant Vice President (AVP) – Production Support

Principal/Staff Engineer – Firmware Development

Principal NAND Reliability Product Engineer

Staff/Principal Engineer - CMP Advanced NAND

Fronted End Central Process Integration Senior Engineer

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63 reliability technicianpackaging Jobs found

Front-End Process Integration Engineer

Lead Workplace Services (VP2)

Senior PCB Component Engineer

Senior Component Engineer - Interconnect & Connector Components

MGR II Qlty & Reliability Engineering

Assistant Vice President (AVP) – Production Support

Principal/Staff Engineer – Firmware Development

Principal NAND Reliability Product Engineer

Staff/Principal Engineer - CMP Advanced NAND

Fronted End Central Process Integration Senior Engineer

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WhiteCrow is on a mission to connect companies with the best talent across the globe.