Manager I - R&D Product Development Engineering

SUPV I (Supervisor-I) – Maintenance, Grade 5-4

Machine Learning Engineer Lead

Senior Executive Accounts Payable

VDI & Endpoint Lead Engineer (AVP)

Technical Director, Advanced Packaging Integration

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

Stock Operator

Assistant Vice President - Principal Engineer

Role Description: <ul><li>Automotive Industry offers products for vehicle electrification systems like chassis systems, convenience applications, driver information, infotainment solutions, miniaturization solutions, motor and powertrain applications etc.&nbsp;</li><li>The client Automotive BU is focused on developing new and improved vehicle architecture approaches to efficiently address these challenges in Connectivity from power to propulsion and safety.&nbsp;</li><li>The Manager R&amp;D Product development contributes to the development of organizational strategy and supports in implementation of operational plans.</li><li>Being part of Product development team responsible to develop for new products and sustenance of existing product lines of Automotive business unit of client.</li><li>This position drives development of PCB connectors for automotive applications including Board to Board, Wire to Board and Flex to Board connectors.</li></ul> Responsibilities: <ul><li>Managing experienced professional and/or supervisors who exercise independence in their assignments and providing them with the required guidance and also be a strong technical contributor.</li><li>Providing strategic leadership to foster growth of the business.</li><li>Interacting and cooperating with multiple organizational levels to meet schedule and technical expectations.</li><li>Administrating schedules and ensuring performance requirements.</li><li>Providing knowledge of engineering tools such as Creo, etc. and product domain expertise in multiple projects.</li><li>Assist Inside Device Connectivity (InDeCo) engineering teams with New Product Developments across a range of projects and executing on cost optimization/reduction (VA/VE) opportunities for the business.</li><li>Preparing design verification test plans, Design &amp; Process FMEAs.</li><li>Successfully facilitate transfer and support of new product introduction (NPI) into high volume manufacturing.</li><li>Contributing to technical function initiatives across various initiatives.</li><li>Reverse Engineering and benchmarking of competitor products.</li><li>Support product environmental compliance and approvals for all new products and platforms as required by our customers.</li><li>Be a strong technical partner and provide support to Product management teams.</li><li>Attend/support customer meetings, technology days and site visits as required.</li></ul> Requirements: <ul><li>Master’s degree in mechanical engineering or equivalent is preferred with minimum 8 years of experience in related fields.</li><li>Mechanical or equivalent engineering Degree with minimum 10 years of related product development experience.&nbsp;</li><li>Experience with product design of PCB Connector such as Board to Board, Flex to Board, Wire to Board is essential.</li><li>Knowledge in product design of plastic, terminals (sheet metal), fine pitch connectors, rubber components.</li><li>Working knowledge of driving diversity and inclusion, customer/market focus, result orientation, managing multiple priorities, envisioning the future, coaching and developing people and collaborating across boundaries</li><li>Extensive experience executing plans in a disciplined way and in holding people accountable.</li><li>Organized, methodical and self-motivated individual.</li><li>A person with the ability to achieve goals and the highest standards of performance in a dynamic fast paced environment.</li><li>Attention to detail and on time delivery.</li><li>Excellent judgment, timely and high-quality decision-making skills.</li><li>Proven ability to execute engineering deliverables.</li><li>Strong customer service mindset and mentality of delivering quality products and services on time and within company cost and profitability objectives.</li><li>Fluent communication skills facilitate collaboration with own team, customers, internal business leaders and technology leaders to create value.</li><li>Individual must be self-motivated, have strong planning skills and be able to deal with and balance multiple competing priorities.</li></ul> Functional: Mandatory: <ul><li>Working knowledge of product development (Processes, Approaches, Tools and Techniques) &amp; Validation</li><li>Working knowledge of manufacturing processes like injection Mold, plating, assembly &amp; High-speed stamping</li><li>Working knowledge to apply Six Sigma / DFSS methodology to design, development, and delivery of technology products and process.</li><li>Working knowledge in use of CAD systems (CREO Part modeling &amp; Sheet Metal)</li><li>Interpretation of simulation results &amp; translating into product design</li><li>Working knowledge in Design for Manufacturability (DFM) &amp; FMEA&nbsp;</li><li>Proficient in Tolerance stack-up and GD&amp;T</li><li>Ability to generate design concepts and solve design problems&nbsp;</li><li>Working knowledge in prototyping methods</li><li>Working knowledge in Manufacturing process (Molding / Stamping / Plating)</li><li>Understanding of linear and non-linear analysis</li><li>Working knowledge of product life cycle.</li><li>Basic Knowledge in quality tools (8D, Why Why analysis, Fish bone….)</li><li>Awareness of recognition &amp; protection of IP (intellectual property) features</li><li>Basic knowledge of PPAP documentation.</li></ul> Preferred: <ul><li>Knowledge of customer application&nbsp;</li><li>Experience in development of automotive signal and power connectors.</li></ul> Department specific: <ul><li>Exposure to PCB Connector design</li><li>Ability to understand specifications for validation as per US CAR / LV 214 / Similar Specification</li><li>Knowledge about crimping technologies, Ultrasonic welding technologies, Laser welding technologies</li></ul>

Responsibilities: <ul><li>Perform preventive, predictive and breakdown maintenance on R2R electroplating lines.</li><li>Maintain and troubleshoot WWTP systems and utility equipment, including pumps, filters, RO/UF, chillers, air scrubbers and evaporators.</li><li>Troubleshoot mechanical, electrical, pneumatic, hydraulic and PLC-related issues.</li><li>Support equipment installation, commissioning, modification and continuous improvement to improve reliability and productivity.</li><li>Ensure safety, environmental compliance, LOTO, maintenance documentation and RCA/corrective actions.</li></ul> Requirements: <ul><li>3–7 years of hands-on maintenance experience in manufacturing/industrial environments.</li><li>Diploma/ITI/Technical Certification in Mechanical Engineering.</li><li>Experience with electroplating operations and Reel-to-Reel (R2R) plating lines.</li><li>Experience in WWTP and utility equipment such as air scrubbers, evaporators, chillers and AHUs.</li><li>Hands-on troubleshooting knowledge across mechanical, electrical, pneumatic, hydraulic and PLC-controlled systems.</li></ul>

﻿Responsibilities: &nbsp;<ul><li>Lead, mentor, and grow a team of 4-5 ML engineers.</li><li>Provide architectural direction and code-level guidance.</li><li>Establish engineering best practices for ML system design, testing, and deployment.</li><li>Conduct design reviews, performance reviews, and technical roadmap planning.</li><li>Architect distributed ML systems serving multiple global products.</li><li>Standardize infrastructure patterns for LLM serving and retrieval systems.</li><li>Define and implement enterprise-ready agentic frameworks.</li><li>Architect multi-step reasoning systems.</li><li>Lead decisions on deterministic workflows vs. autonomous agents.</li><li>Implement guardrails, safety layers, and traceability mechanisms.</li><li>Develop evaluation frameworks to measure reasoning quality, hallucination rates, and reliability.</li><li>Establish CI/CD standards for ML lifecycle management.</li><li>Ensure compliance with enterprise data governance and responsible AI standards.</li></ul>&nbsp;Requirements &nbsp;<ul><li>8-10 years of Machine Learning/Software Engineer experience</li><li>2-3 years of people management experience.</li><li>Master’s degree or bachelors degree, computer science degree is highly desirable.</li><li>Strong software engineering background with experience in building system design, architecting AI feature/products that caters large number of users and deals with large volume of unstructured data.</li></ul>

Responsibilities: <ul><li>Process vendor payments and payment runs through Oracle.</li><li>Support AP payment processing, reconciliations, reporting and issue resolution.</li><li>Manage vendor relationships and payment-related queries.</li><li>Support AP transformation, process improvement and transition projects.</li><li>Own assigned AP activities with accuracy, timeliness and control discipline across invoice processing, payment readiness, AP reporting, reconciliations and period-close support.</li><li>Act as the first point of functional review for assigned AP matters, assessing issues independently, resolving within approved protocols and escalating exceptions with clear facts, impact and recommended action.</li><li>Monitor operational performance against agreed SLAs, KPIs, payment timelines, ageing trends and exception volumes, and support corrective actions to improve service quality.</li><li>Demonstrate ownership, accountability and business judgement in handling AP matters that require coordination across multiple stakeholders and systems</li></ul> Requirements: <ul><li>Minimum 5 years’ Accounts Payable experience.</li><li>Strong end-to-end AP knowledge.</li><li>Oracle exposure and hands-on payment processing on Oracle.</li><li>AP transformation / process excellence exposure as an end user.</li><li>Transition project experience or exposure in involvement with new AP related projects.</li><li>Vendor relationship management exposure.</li></ul>

Responsibilities: <ul><li>Administer and support enterprise VDI platforms including Omnissa Horizon, VMware ESXi, Citrix, and Nutanix environments.</li><li>Perform daily monitoring, maintenance, and operational support for VDI infrastructure and virtual desktop services.</li><li>Support endpoint management platforms including Microsoft Intune and Microsoft Endpoint Configuration Manager (MECM/SCCM).</li><li>Assist with device provisioning, software deployment, operating system patching, and endpoint compliance activities.</li><li>Support endpoint security technologies including Microsoft Defender for Endpoint and Trellix Endpoint Security.</li><li>Investigate, troubleshoot, and resolve VDI, endpoint, and endpoint security incidents.</li><li>Perform root cause analysis and support service restoration activities for production incidents.</li><li>Support platform upgrades, patching, maintenance windows, and technology refresh initiatives.</li><li>Monitor platform health, identify issues proactively, and escalate complex issues where required.</li><li>Maintain operational documentation, technical procedures, and support records.</li><li>Collaborate with infrastructure, network, security, and application support teams on issue resolution and platform improvements.</li><li>Participate in after-hours support and maintenance activities when required.</li></ul> Requirements: <ul><li>3-7 years of experience in End User Computing (EUC), VDI, or Endpoint Infrastructure support.</li><li>Hands-on experience supporting:&nbsp;</li><li>Omnissa Horizon / VMware Horizon</li><li>VMware ESXi and vCenter</li><li>Microsoft Intune</li><li>Microsoft Endpoint Configuration Manager (MECM/SCCM)</li><li>Microsoft Defender for Endpoint</li><li>Experience supporting enterprise-scale VDI environments.</li><li>Strong troubleshooting skills across virtual desktop and endpoint platforms.</li><li>Experience supporting production environments and incident management activities.</li><li>Good understanding of endpoint lifecycle management, software deployment, and patch management.</li><li>Strong analytical, problem-solving, and communication skills.</li></ul>

Responsibilities: <ul><li>Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies</li><li>Define, document, and implement end-to-end process flows for panel-level packaging technologies</li><li>Lead material selection, characterization, and compatibility assessments for large form factor substrates</li><li>Partner with customers to define and align process specifications and acceptance criteria</li><li>Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers</li><li>Contribute to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps</li><li>Analyze process data to identify trends, drive optimization, and improve performance</li><li>Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability</li><li>Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions</li><li>Publish and present technical findings at leading industry conferences and in peer-reviewed journals</li><li>Mentor and guide early-career engineers; provide technical direction and best practices</li></ul> Requirements: <ul><li>Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field</li><li>In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows</li><li>Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level</li><li>Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs</li><li>Proficiency in statistical data analysis (e.g. DoE, JMP)</li><li>Knowledge of industry standards and best practices in semiconductor packaging</li><li>Solid understanding of process characterization, metrology, materials &amp; failure analysis</li><li>Working knowledge of reliability requirements and qualification methodologies</li><li>Proven capability to lead multi-functional teams to resolve complex technical problems</li><li>Exceptional written and verbal communication skills</li><li>Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts</li><li>Drive structured technical discussions with customers and suppliers</li><li>Articulate positions, influence decisions, and align technical direction</li><li>Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications</li><li>Ability to work effectively across geographies and time zones</li></ul>

Responsibilities: <ul><li>Create 3D integration and packaging solutions for different platforms and quantum structures</li><li>Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices</li><li>Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines</li><li>Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues</li><li>Generate internal and external documentation for products, presentations and technical reports</li><li>Design and conduct experiment, measure material and device properties and interpret data</li><li>Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies</li><li>Collaborate with customers, start-ups, or universities to identify key problems and develop enabling solutions</li></ul> Requirements: <ul><li>PhD, Masters, or Bachelors degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.</li><li>5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.</li><li>Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip, and related packaging technologies.</li><li>Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology.</li><li>Experience with DOE, data analysis, process optimization, and root cause analysis.</li><li>Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.</li><li>Strong problem-solving, technical communication, and cross-functional collaboration skills.</li><li>Ability to work effectively with customers, startups, universities, and multidisciplinary R&amp;D teams.</li></ul>

Responsibilities: <ul><li>Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines</li><li>Perform hardware characterization on a variety of difficult systems, within safety guidelines</li><li>Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues</li><li>Generate internal and external documentation for products, presentations and technical reports</li><li>Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision</li><li>Measure film properties and interpret data</li><li>Identify, select and work with vendors and suppliers with limited supervision</li><li>Implement new technology, products and analytical instrumentation</li></ul> Requirements: <ul><li>PhD or Masters Degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field</li><li>Research focus in semiconductor would be an added advantage</li><li>Relevant experiences in semiconductor process development field</li><li>Good communication and interpersonal skills</li><li>Problem-solver attitude with determination and quality-mindset</li></ul>

Responsibilities: <ul><li>Ensure compliance and correct implementation of all procedures and to identify solutions to fill the gaps</li><li>Ensure correct instore operations: logistics, administration, AFS</li><li>Ensure the best BOH organization to support sales staff</li><li>Ensure stock inventory /stock take objective results</li><li>Support the stores management role in effectively operating the boutique also in term of ROTA including match to traffic needs.</li><li>Ensure service to clients is properly supported at all times with the right equipment and teamwork flows (including food and beverage, etc)</li><li>Ensure availability of store supplies ( packaging, food and beverage) at all times.</li><li>Ensure online and offline integration</li></ul> Requirements: <ul><li>Proactivity and problem solving attitude</li><li>ability to coordinate back office activities to support sales</li><li>Ability to collaborate with Store Manager and HQ to support business</li><li>High knowledge of retail/ operations procedure to ensure smooth run of the store</li></ul>

Responsibilities: <ul><li>Lead the design and architect solutions that meet SYF business requirements to deliver business value by enabling rapid innovation through modern software development practices and product delivery through rapid innovation and continuous integration. In-depth knowledge of credit application and web application platforms.</li><li>Perform Technology Alternate Assessment, create Proof-of-Concept (as necessary) Provides guidance and direction to product teams to ensure compliance with the standards and best practices Work collaboratively with Product Management and Platform Engineering teams during development, launch and continuing refinement of products iteratively</li><li>Lead Agile sprints as the technical expert, including sprint planning, daily standups, backlog grooming sessions, and sprint reviews Influence and collaborate with software developers, UX designers, product managers, application architects, and customer application experts to create high performing and reliable application components.</li><li>Work with third party vendors to develop software and/or integrate their software into the companys products</li><li>Drive a CI/CD strategy using our Jenkins, Bitbucket, and uDeploy stack.</li><li>Maintain deep hands-on technical knowledge of evaluating trends in modern software development practices.</li></ul> Requirements: <ul><li>Bachelor’s degree and a minimum 7 years of experience with software engineering OR, in lieu of degree 9 years of experience with software engineering.</li><li>5+ years of applied Java experience</li><li>5+ years of hands-on experience in Credit Card Acquisition platform with ample knowledge in credit card application processing and decisioning systems.</li><li>Experience in Front End UI (JavaScript/Typescript) development and Backend Java programming.</li><li>Critical Thinking, creativity and problem-solving skills.</li><li>Strong analytical and problem-solving skills.</li><li>Excellence in technical communication with technical and non-technical peers.</li><li>Basic understanding of Artificial Intelligence.</li></ul>

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192 safety compliance Jobs found

Manager I - R&D Product Development Engineering

SUPV I (Supervisor-I) – Maintenance, Grade 5-4

Machine Learning Engineer Lead

Senior Executive Accounts Payable

VDI & Endpoint Lead Engineer (AVP)

Technical Director, Advanced Packaging Integration

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

Stock Operator

Assistant Vice President - Principal Engineer

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192 safety compliance Jobs found

Manager I - R&D Product Development Engineering

SUPV I (Supervisor-I) – Maintenance, Grade 5-4

Machine Learning Engineer Lead

Senior Executive Accounts Payable

VDI & Endpoint Lead Engineer (AVP)

Technical Director, Advanced Packaging Integration

Senior Quantum 3D Integration and Packaging Engineer

Senior Process Engineer (R&D)

Stock Operator

Assistant Vice President - Principal Engineer

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

EMPLOYER

TALENT

COMPANY

Contact Us

JOBS BY SKILLS

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WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.