Technical Director, Advanced Packaging Integration

Director of Technology (Product Development)

Director, Advanced Packaging Disruptive Technology

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Stock Operator

Assistant Vice President - Principal Engineer

AVP, Principal Software Engineer (Senior Technical lead)

VP, IS Risk - Assurance

Senior Executive - Collections

Field Application Engg (FAE)

Responsibilities: <ul><li>Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies</li><li>Define, document, and implement end-to-end process flows for panel-level packaging technologies</li><li>Lead material selection, characterization, and compatibility assessments for large form factor substrates</li><li>Partner with customers to define and align process specifications and acceptance criteria</li><li>Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers</li><li>Contribute to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps</li><li>Analyze process data to identify trends, drive optimization, and improve performance</li><li>Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability</li><li>Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions</li><li>Publish and present technical findings at leading industry conferences and in peer-reviewed journals</li><li>Mentor and guide early-career engineers; provide technical direction and best practices</li></ul> Requirements: <ul><li>Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field</li><li>In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows</li><li>Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level</li><li>Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs</li><li>Proficiency in statistical data analysis (e.g. DoE, JMP)</li><li>Knowledge of industry standards and best practices in semiconductor packaging</li><li>Solid understanding of process characterization, metrology, materials &amp; failure analysis</li><li>Working knowledge of reliability requirements and qualification methodologies</li><li>Proven capability to lead multi-functional teams to resolve complex technical problems</li><li>Exceptional written and verbal communication skills</li><li>Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts</li><li>Drive structured technical discussions with customers and suppliers</li><li>Articulate positions, influence decisions, and align technical direction</li><li>Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications</li><li>Ability to work effectively across geographies and time zones</li></ul>

Responsibilities: <ul><li>Lead and develop a multidisciplinary technology team across chamber design, process development, systems engineering, controls, and integration.</li><li>Define and execute the chamber technology roadmap, product architecture, risk retirement plans, and development milestones.</li><li>Drive end-to-end technical execution of chamber development programs to meet performance, schedule, cost, quality, and reliability goals.</li><li>Provide technical guidance on chamber hardware, process performance, plasma or chemical interactions, materials compatibility, defectivity, cleanliness, and manufacturability.</li><li>Partner with product management, manufacturing, supply chain, service, and customer-facing teams to deliver customer-focused product solutions.</li><li>Lead customer issue resolution, including containment, root-cause analysis, corrective actions, recovery plans, and long-term product improvements.</li><li>Represent the technology organization in customer engagements, executive reviews, technical reviews, and escalation discussions.</li></ul> Requirements: <ul><li>Bachelor’s degree or higher in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical discipline; advanced degree preferred.</li><li>Significant experience leading semiconductor equipment, process module, or chamber development programs.</li><li>Proven ability to lead technical teams and drive cross-functional execution in a global, matrixed organization.</li><li>Strong knowledge of product development lifecycle, including feasibility, design validation, process integration, NPI, reliability, and manufacturing readiness.</li><li>Excellent communication and stakeholder management skills, with the ability to influence executive, customer, and engineering audiences.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Strategy <ul><li>Define and execute long-range (N+2 and beyond) pathfinding roadmap for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.</li><li>Drive concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms (e.g., novel interconnect schemes, heterogeneous integration architectures, advanced substrate innovations).</li><li>Evaluate emerging technology options and guide make/buy/partner decisions to establish differentiated capability ahead of industry adoption cycles.</li><li>Anticipate and define technology inflections aligned to AI, HPC, memory integration, chiplet ecosystems, and future system architectures.</li></ul> Innovation Leadership &amp; Team Building <ul><li>Build, lead, and inspire a world-class pathfinding and innovation team, fostering a culture of bold thinking, experimentation, and calculated risk-taking.</li><li>Instill an innovation-first mindset, encouraging teams to challenge existing assumptions and explore unconventional solutions.</li><li>Establish structured frameworks for idea generation, incubation, rapid prototyping, and down-selection.</li><li>Mentor technical leaders and create a pipeline of innovation talent capable of sustaining long-term differentiation.</li></ul> Customer &amp; Market-Driven Innovation <ul><li>Translate customer roadmaps, system architecture trends, and market inflections into actionable technology development strategies.</li><li>Engage deeply with key customers to identify latent needs and unmet challenges not addressed by current packaging solutions.</li><li>Drive creation of new product concepts and technology platforms that deliver step-function improvements in performance, cost, power, and scalability.</li><li>Position offerings to create clear value differentiation and long-term competitive advantage.</li></ul> Ecosystem Development &amp; Strategic Partnerships <ul><li>Build and lead a collaborative innovation ecosystem across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.</li><li>Identify and activate disruptive partnerships that accelerate innovation cycles and enable early validation of emerging technologies.</li><li>Drive joint development programs and consortia engagement to shape industry direction and standards.</li></ul> Program Leadership &amp; Execution Governance <ul><li>Establish governance models for early-stage technology programs, balancing exploration with execution discipline.</li><li>Drive alignment across engineering, product, and business units to transition pathfinding concepts into development pipelines.</li><li>Develop executive-level narratives and decision frameworks to communicate technology trade-offs, investments, and strategic priorities.</li><li>Ensure learnings from early exploration are captured, scaled, and leveraged across the organization.</li></ul> Leadership Expectations <ul><li>Visionary Technology Leader: Anticipates industry disruption and defines future-state architectures ahead of the market.</li><li>Innovation Catalyst: Creates an environment where breakthrough ideas are generated, tested, and scaled.</li><li>Strategic Connector: Bridges customer roadmaps, internal capabilities, and ecosystem innovations into cohesive strategies.</li><li>Builder of Teams &amp; Culture: Attracts, develops, and retains top talent while fostering collaboration and accountability.</li><li>Decisive Change Agent: Operates effectively in ambiguity, making high-impact decisions with incomplete data.</li></ul> Requirements: <ul><li>15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.</li><li>Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.</li><li>Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc), with the ability to think beyond existing paradigms.</li><li>Proven experience building and leading cross-functional or exploratory R&amp;D teams.</li><li>Ability to translate complex technology concepts into business impact and strategic direction.</li></ul>

Responsibilities: Disruptive Pathfinding &amp; Technology Development <ul><li>Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.</li><li>Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.</li><li>Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates).</li><li>Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.</li><li>Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.</li></ul> Technical Innovation &amp; Execution <ul><li>Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.</li><li>Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.</li><li>Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.</li><li>Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.</li><li>Document and communicate findings to influence technology roadmap decisions and downstream development programs.</li></ul> Customer &amp; Market Alignment <ul><li>Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems.</li><li>Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.</li><li>Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits.</li></ul> Ecosystem Collaboration <ul><li>Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.</li><li>Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.</li><li>Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.</li></ul> Program Contribution &amp; Technical Leadership <ul><li>Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.</li><li>Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities.</li><li>Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.</li><li>Mentor junior engineers and contribute to building technical depth and innovation culture within the team.</li></ul> Leadership Expectations <ul><li>Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration.</li><li>Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact.</li><li>Influencer: Drives alignment and decisions across teams without formal authority.</li><li>Problem Solver: Thrives in ambiguity, breaking down complex challenges into actionable solutions.</li><li>Collaborator: Effectively works across organizational and ecosystem boundaries.</li></ul> Requirements: <ul><li>10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.</li><li>Demonstrated experience in technology development, pathfinding, or exploratory R&amp;D.</li><li>Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).</li><li>Proven ability to solve complex technical problems and translate concepts into experimental validation.</li><li>Strong communication skills to articulate technical insights and business relevance.</li></ul>

Responsibilities: <ul><li>Ensure compliance and correct implementation of all procedures and to identify solutions to fill the gaps</li><li>Ensure correct instore operations: logistics, administration, AFS</li><li>Ensure the best BOH organization to support sales staff</li><li>Ensure stock inventory /stock take objective results</li><li>Support the stores management role in effectively operating the boutique also in term of ROTA including match to traffic needs.</li><li>Ensure service to clients is properly supported at all times with the right equipment and teamwork flows (including food and beverage, etc)</li><li>Ensure availability of store supplies ( packaging, food and beverage) at all times.</li><li>Ensure online and offline integration</li></ul> Requirements: <ul><li>Proactivity and problem solving attitude</li><li>ability to coordinate back office activities to support sales</li><li>Ability to collaborate with Store Manager and HQ to support business</li><li>High knowledge of retail/ operations procedure to ensure smooth run of the store</li></ul>

Responsibilities: <ul><li>Lead the design and architect solutions that meet SYF business requirements to deliver business value by enabling rapid innovation through modern software development practices and product delivery through rapid innovation and continuous integration. In-depth knowledge of credit application and web application platforms.</li><li>Perform Technology Alternate Assessment, create Proof-of-Concept (as necessary) Provides guidance and direction to product teams to ensure compliance with the standards and best practices Work collaboratively with Product Management and Platform Engineering teams during development, launch and continuing refinement of products iteratively</li><li>Lead Agile sprints as the technical expert, including sprint planning, daily standups, backlog grooming sessions, and sprint reviews Influence and collaborate with software developers, UX designers, product managers, application architects, and customer application experts to create high performing and reliable application components.</li><li>Work with third party vendors to develop software and/or integrate their software into the companys products</li><li>Drive a CI/CD strategy using our Jenkins, Bitbucket, and uDeploy stack.</li><li>Maintain deep hands-on technical knowledge of evaluating trends in modern software development practices.</li></ul> Requirements: <ul><li>Bachelor’s degree and a minimum 7 years of experience with software engineering OR, in lieu of degree 9 years of experience with software engineering.</li><li>5+ years of applied Java experience</li><li>5+ years of hands-on experience in Credit Card Acquisition platform with ample knowledge in credit card application processing and decisioning systems.</li><li>Experience in Front End UI (JavaScript/Typescript) development and Backend Java programming.</li><li>Critical Thinking, creativity and problem-solving skills.</li><li>Strong analytical and problem-solving skills.</li><li>Excellence in technical communication with technical and non-technical peers.</li><li>Basic understanding of Artificial Intelligence.</li></ul>

Responsibilities: <ul><li>Lead the development effort for cloud-native applications across the Caching Solutions and Rewards System teams, ensuring timely execution against committed business outcomes.</li><li>Drive business commitments by aligning scope, sequencing, and technical approach with Product Management, and ensuring delivery plans are realistic, transparent, and measurable.</li><li>Design and implement continuous integration and continuous delivery (CI/CD) processes to deliver applications to production, fostering a culture of continuous process improvement.</li><li>Provide hands-on technical leadership through architecture/design reviews, code reviews, and guidance to engineers to ensure compliance with standards and best practices.</li><li>Perform Technology Alternate Assessments and create Proofs-of-Concept (as necessary) to validate options and inform technical decisions.</li><li>Work collaboratively with Product Management and Platform Engineering teams during development, launch, and continuing refinement of products iteratively.</li><li>Collaborate with internal technical resources and third-party vendors to resolve issues, understand</li><li>underlying causes, and implement sustainable solutions.</li><li>Work with team members to design, architect, and implement solutions across geographic locations, ensuring effective coordination and consistent engineering execution.</li><li>Coordinate and communicate status across stakeholders, and report delivery progress, risks, and dependency needs to leadership on a regular cadence.</li><li>Maintain deep hands-on technical knowledge by evaluating trends in modern software development practices; continuously learn and stay at the leading edge of industry trends.</li></ul> Requirements: <ul><li>Bachelor’s Degree with 8+ years of system engineering experience, or in lieu of a degree 10+ years of skilled system engineering experience.</li><li>8+ years of Strong hands-on development experience in Java and Spring Boot for building enterprise-grade services.</li><li>5+ years of Proven expertise in designing and implementing cloud-native applications using a microservices-based architecture.</li><li>Solid knowledge of event streaming and processing patterns using Kafka.</li><li>Experience deploying and operating applications on cloud platforms such as AWS and PCF (Pivotal Cloud Foundry).</li><li>Strong understanding of data storage and caching concepts and implementations using GemFire, Redis &amp; Elastic cache.</li><li>5+ years of Working knowledge of database design and persistence using MySQL, Aurora SQL &amp; no SQL.</li><li>Experience with observability, logging, and production monitoring, including tools such as Splunk and New Relic</li></ul>

Responsibilities: <ul><li>Oversee and execute end to end control assurance activities for all sub functions within Information Security</li><li>Formalize, Pilot and execute first line of defence (1LOD) assessments for Information Security to proactively identify risks to the business</li><li>Lead the client assessments program by liaising with internal client partners to ensure is meeting client expectations for Information Security Assessments and Audits</li><li>Collaborate with Sourcing and Legal teams to review third-party supplier contracts, ensuring contractual terms align with the defined scope of services and comply with applicable regulatory requirements and governance frameworks</li><li>Support execution of FedLine and other assessments by working with internal SMEs, Second and Third Line of defense teams</li><li>Support renewal of Cyber Insurance for the organization by working with insurance brokers and key internal stakeholders</li><li>Develop Financial Security Assurance specific security standards and procedures</li><li>Perform other duties and/or special projects as assigned.</li></ul> Requirements: <ul><li>Bachelor’s degree in Computer Engineering or related field, with a minimum of 10+ years of experience in Information Security OR in lieu of the Bachelors degree, a minimum of 12+ years of experience in Information Security.</li><li>8+ years of progressive experience in information security, technology risk, security controls assurance, or audit, including 5+ years leading teams.</li><li>Good understanding of IS Risk Management Concepts</li><li>Strong working knowledge of IT related US Banking regulations &amp; industry best practices (NIST, PCI DSS, HIPAA, CRI etc.)</li><li>Demonstrated experience designing and executing control testing/assurance programs across multiple security domains</li><li>Exposure to working with external attack surface monitoring tools to partner with internal stakeholders to remediate external risk exposure to the organization</li><li>Proven ability to influence and partner across Information Security, Technology, Risk, Compliance, and Audit functions</li><li>Excellent executive communication skills—able to synthesize complex findings into clear, actionable insights.</li><li>Excellent interpersonal skills with ability to influence team members, management &amp; external groups</li><li>Self-motivated &amp; able to work independently or in a team environment &amp; work with virtual teams</li></ul>

Role Description: <ul><li>We are looking for an experienced Credit Manager to oversee credit management, accounts receivable and collections activities within a hospitality environment.&nbsp;</li><li>The role will be responsible for managing credit exposure, ensuring timely collections, improving cash flow and maintaining strong relationships with corporate and trade customers.</li><li>The ideal candidate will have strong experience in hotel/hospitality credit management, with a solid understanding of city ledger operations, credit assessment, receivables, ageing, collections and credit risk.</li></ul> Responsibilities: <ul><li>Manage the end-to-end credit control and Accounts Receivable function.</li><li>Oversee city ledger, corporate, travel trade and other receivable accounts.</li><li>Establish, review and monitor credit limits, payment terms and credit facilities.</li><li>Conduct credit assessments and evaluate the financial standing and payment history of customers.</li><li>Monitor AR ageing, overdue balances, DSO and credit exposure and take appropriate collection actions.</li><li>Develop and implement effective collection and recovery strategies to minimise bad debt and improve cash flow.</li><li>Follow up on outstanding payments and resolve billing discrepancies and customer disputes in collaboration with Sales, Finance and Operations.</li><li>Prepare regular AR, ageing, collection, DSO and credit-risk reports for management.</li><li>Monitor doubtful debts, provisions and potential credit risks.</li><li>Ensure accurate billing, account reconciliation, payment allocation and maintenance of the city ledger.</li><li>Work closely with Sales, Revenue, Front Office and Finance teams on credit-related matters.</li><li>Ensure compliance with company credit policies, internal controls and audit requirements.</li><li>Support process improvements and implementation of effective credit-control procedures and SOPs.</li><li>Lead, coach and develop the Accounts Receivable/Credit team where applicable.</li></ul> Requirements: <ul><li>6–8+ years of relevant experience in Credit Control, Credit Management or Accounts Receivable.</li><li>Strong experience within the hospitality / hotel industry is highly preferred.</li><li>Proven experience managing corporate and high-value customer accounts.</li><li>Strong knowledge of credit risk assessment, collections, AR ageing, DSO and bad debt management.</li><li>Experience with city ledger and hotel receivables.</li><li>Good understanding of credit policies, payment terms and credit-limit management.</li><li>Strong stakeholder-management and negotiation skills.</li><li>Ability to work closely with Sales, Finance and Operations teams.</li><li>Experience managing or mentoring a team would be an advantage.</li><li>Strong analytical and reporting skills.</li><li>Experience with Opera/SUN or similar hotel finance systems is advantageous.</li></ul>

Responsibilities: <ul><li>Preparation and recommendation of product application documentation such as bills of materials and installation instruction.</li><li>Provide technical application advice to customers and internal sales team.</li><li>Application engineering / customization of existing products to meet customers’ requirements.</li><li>Customer support during introduction and installation of new and existing products on site / at customers’ facilities</li><li>Product demonstration, training, and presentation; this will require jointing skills to be able to install Cable accessories products for High Voltage applications up to 245kV.</li><li>Liaise with Technical Services and Engineering as part of the new product development process providing ideas and customer/application requirements.</li><li>Provide technical input into the tendering process.</li><li>Train the customers on new and existing products.</li><li>Travel domestic/international as required to provide product training and demonstration + customer visits</li><li>Advise and communicate competitive market information and benchmarking from a field perspective (products, services, issues, opportunities</li></ul> Requirements: <ul><li>Qualified cable jointer up to 245kV cable accessories applications</li><li>Engineering background in electrical is preferred</li><li>10+ years of cable accessories installation / application experience.</li><li>Would have served a craft apprenticeship within the electrical engineering field and would be qualified to Degree or HND level in Electrical Engineering, or trade qualified cable jointer</li><li>Ideally would have experience of working within the Power Utility or Cable/accessory industry.&nbsp;</li><li>Highly practical in nature with good hand skills with an aptitude for problem solving.</li><li>Computer literacy and hold a valid driving license.</li></ul>

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262 sales transformation lead Jobs found

Technical Director, Advanced Packaging Integration

Director of Technology (Product Development)

Director, Advanced Packaging Disruptive Technology

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Stock Operator

Assistant Vice President - Principal Engineer

AVP, Principal Software Engineer (Senior Technical lead)

VP, IS Risk - Assurance

Senior Executive - Collections

Field Application Engg (FAE)

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262 sales transformation lead Jobs found

Technical Director, Advanced Packaging Integration

Director of Technology (Product Development)

Director, Advanced Packaging Disruptive Technology

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Stock Operator

Assistant Vice President - Principal Engineer

AVP, Principal Software Engineer (Senior Technical lead)

VP, IS Risk - Assurance

Senior Executive - Collections

Field Application Engg (FAE)

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.