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Skills

python
sql
java
javascript
software development
advanced packaging
advanced semiconductor packaging
aws
data analysis
data modeling

Industry

financial services
food production
logistics and supply chain

Location

bengaluru, india
chennai, india
singapore, singapore
kuala lumpur, malaysia
atlanta, united states
mexico city, mexico
raleigh, united states
alabang, philippines
ambala sadar, india
batangas, philippines

Jobtitle

principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
software engineer
accounts receivable (6 months contract)
api sr/lead developer
application developer - erp
application developer - fullstack developer
applications developer
associate data engineer

Filter

61 sql database Jobs found

1-10 of 61
S

Dubai, United Arab Emirates

S

Data Analysis & Business IntelligenceStrategic Partnerships & NegotiationMarket & Competitive AnalysisFinancial & P&L UnderstandingCommercial Strategy & Business Planning
C

Charles de Gaulle Airport, France

C

Incident Ownership and TroubleshootingFlight and Capacity ManagementULD ManagementCargo Tracking and TracingSQL and Database QueryingData Validation
A

Hyderabad,Telangana,India

A

MicroservicesMySQLJavaCloud NativeSpring BootAWSKafka
A

Alabang, Philippines

A

AgileJavascriptTypecriptREST APIsAngularApi Development
S

Bengaluru, India

S

REST APIDockerSoftware DevelopmentFull Stack DevelopmentJava Spring BootJavascriptProduction Developing
E

Kuala Lumpur, Malaysia

E

Stakeholder ManagementAI GovernanceEnterprise AnalyticsMachine Learning OperationsPythonSQLDocker and KubernetesPredictive Analytics
T

Kuala Lumpur, Malaysia

T

Linux ServerApache WebServerPeople ManagementService ManagementTest InfrastructureWindows ServerSQL Server
P

Singapore, Singapore

P

SQLData & IntegrationDevOps & Cloud SkillsUnit TestingTest AutomationFinance & Record-to-ReportERP & Financial SystemsProduct EngineeringJava

Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer