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advanced packaging
advanced semiconductor packaging
data analysis
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Industry
logistics and supply chain
Location
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chennai, india
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Jobtitle
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
software engineer
accounts receivable (6 months contract)
application developer - erp
application development and maintenance manager (payment), core banking (vp 2)
applications developer
associate data engineer
avp, digital analytics
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58 sql server database Jobs found
1-10 of 58
S
Software Engineer – Ag & Trade
8 days ago
S
REST APIDockerSoftware DevelopmentFull Stack DevelopmentJava Spring BootJavascriptProduction Developing
Stakeholder ManagementAI GovernanceEnterprise AnalyticsMachine Learning OperationsPythonSQLDocker and KubernetesPredictive Analytics
T
Test Infrastructure Platform Lead (MTest)
15 days ago
T
Linux ServerApache WebServerPeople ManagementService ManagementTest InfrastructureWindows ServerSQL Server
P
Product Engineer/Senior - FDC/R2R
18 days ago
P
SQLData & IntegrationDevOps & Cloud SkillsUnit TestingTest AutomationFinance & Record-to-ReportERP & Financial SystemsProduct EngineeringJava
Database SkillsProduction SupportBanking & Wealth ManagementTrade & Investment ProductsBusiness AnalysisIntegration & MiddlewareTemenos Technical Skills
S
Cloud TechnologiesIntegration TestingProduction SupportCore Banking & Lending DomainSoftware DevelopmentDatabase TechnologiesIntegration & MiddlewareDevOps & CI/CD
Problem ManagementSecure SDLCProduction SupportTesting & Quality AssuranceDevOps & CI/CDApplication DevelopmentCloud TechnologiesDatabase TechnologiesCore Banking & Payments Skills
P
Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology
Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer
Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
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