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Skills
technical skills
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troubleshooting
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time management
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business development
customer service
Industry
supermarkets
Location
singapore, singapore
perai, malaysia
batangas, philippines
pune, india
branchburg, united states
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suzhou, china
chestnut ridge, united states
istanbul, turkey
manila, philippines
Jobtitle
account executive
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
territory sales executive
119443 senior product engineer
account manager
ar & collections senior analyst
assistant manager, sc projects
client advisor / sr client advisor (hni)- pavilion store, kl
Filter
92 sr machinist technician mechanical repairman Jobs found
1-10 of 92
G
Global Project Manager
7 days ago
G
Project Planning & ExecutionRisk ManagementCommunication SkillsStrategic ThinkingLeadership & Team Management
S
Senior HR Business Partner
13 days ago
S
Global Organizational DevelopmentEmployee RelationsSuccession PlanningWorkforce PlanningHrbpUnionized EnvironmentGlobal Talent DevelopmentTalent Development
M
Maintenance Technician
20 days ago
M
Preventative MaintenanceManufacturingEquipment Downtime AnalysisQuality ControlMaintenanceIndustrial Safety
S
Senior Manager-Advanced Quality Engineering
20 days ago
S
FMEADOEApqp MethodQuality ControlCable AssemblyNpi Management
T
Territory Sales Executive
20 days ago
T
Business DevelopmentChannel SalesRefrigerationTechnical SalesTechnical QualificationsHvacApplication Engineering
Q
Quality Analyst (5-4) – Assembly Quality
22 days ago
Q
Six SigmaTechnical SkillsPPAPMeasurement System AnalysisPareto analysisQuality Management SoftwareTime Management
P
Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology
Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer
Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
R
R
Clash DetectionAutodesk RevitBim CoordinationMechanicalHvac Design
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