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Skills

stakeholder management
data analysis
python
supply chain
project management
communication skills
compliance & safety
procurement
sales
sourcing

Industry

hospitality
chemicals

Location

singapore, singapore
bengaluru, india
chennai, india
houston, united states
kuala lumpur, malaysia
penang, malaysia
perai, malaysia
atlanta, united states
bangkok, thailand
batangas, philippines

Jobtitle

ceo executive assistant
127217 senior quality & reliability engineer
amea gbs operational excellence lead
application development and maintenance manager (payment), core banking (vp 2)
avp, channel marketing
business analyst - sap mm
business process analyst - purchasing
business process analyst - warehouse/logistics
ceo / managing director, bulk & corridors
customer engineer - c3

Filter

77 subject matter expert electronics Jobs found

1-10 of 77
P

Aachen, Germany

P

Stakeholder ManagementProduct ManagementResidential HVACMarket & Commercial SkillsCustomer & Channel SkillsAnalytical & Business Skills
S

Beverly, United States

S

Global Organizational DevelopmentEmployee RelationsSuccession PlanningWorkforce PlanningHrbpUnionized EnvironmentGlobal Talent DevelopmentTalent Development
P

Singapore, Singapore

P

High Volume ProductionSemiconductorProduction PlanningManufacturing Process KnowledgeRoot Cause Analysis
S

Singapore, Singapore

S

Wafer ProcessEquipment MaintenanceHigh Volume ProductionStatistical SoftwareStrong Technical CompetencyPlasma AshingWafer Process Engineering
S

Kuala Lumpur, Malaysia

S

Database SkillsProduction SupportBanking & Wealth ManagementTrade & Investment ProductsBusiness AnalysisIntegration & MiddlewareTemenos Technical Skills

Problem ManagementSecure SDLCProduction SupportTesting & Quality AssuranceDevOps & CI/CDApplication DevelopmentCloud TechnologiesDatabase TechnologiesCore Banking & Payments Skills
S

Houston, United States

S

NegotiationContract DraftingSupplier QuotationsProcurementSourcingSupply Chain
T

London, United Kingdom

T

Business DevelopmentChannel SalesRefrigerationTechnical SalesTechnical QualificationsHvacApplication Engineering

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer

Test Coverage OptimizationDRAM Device Fundamentals and PhysicsHigh Bandwidth Memory (HBM) ArchitectureReliability CharacterizationReliability Risk AssessmentDefectivity Analysis