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Skills

python
stakeholder management
data analysis
project management
sales
supply chain
communication skills
continuous improvement
procurement
sourcing

Industry

hospitality
chemicals

Location

singapore, singapore
bengaluru, india
atlanta, united states
chennai, india
houston, united states
penang, malaysia
perai, malaysia
bangkok, thailand
batangas, philippines
lamphun, thailand

Jobtitle

ceo executive assistant
senior manufacturing engineer
associate engineer - factory innovation
avp, channel marketing
business analyst - sap mm
business process analyst - purchasing
business process analyst - warehouse/logistics
client relationship expert (hni sales)
customer engineer - c3
data & business intelligence analyst

Filter

71 subject matter expert electronics Jobs found

1-10 of 71
S

Bengaluru, India

S

Management & LeadershipManufacturing Engineering SkillsContinuous ImprovementQuality & Process ImprovementTechnical & Production SkillsLean & Operational Excellence
K

Gurgaon, India

K

Key Account Management SkillsNorth Region/Territory ManagementSales & Commercial SkillsCustomer & Stakeholder ManagementReporting & Leadership
A

Bandar Baru Enstek, Malaysia

A

Quality & SafetyPeople ManagementManufacturing SkillsAutomationDigital ManufacturingFactory EngineeringContinuous Improvement
P

Aachen, Germany

P

Stakeholder ManagementProduct ManagementResidential HVACMarket & Commercial SkillsCustomer & Channel SkillsAnalytical & Business Skills
S

Beverly, United States

S

Global Organizational DevelopmentEmployee RelationsSuccession PlanningWorkforce PlanningHrbpUnionized EnvironmentGlobal Talent DevelopmentTalent Development
S

Singapore, Singapore

S

Wafer ProcessEquipment MaintenanceHigh Volume ProductionStatistical SoftwareStrong Technical CompetencyPlasma AshingWafer Process Engineering
S

Houston, United States

S

NegotiationContract DraftingSupplier QuotationsProcurementSourcingSupply Chain
T

London, United Kingdom

T

Business DevelopmentChannel SalesRefrigerationTechnical SalesTechnical QualificationsHvacApplication Engineering

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer

Test Coverage OptimizationDRAM Device Fundamentals and PhysicsHigh Bandwidth Memory (HBM) ArchitectureReliability CharacterizationReliability Risk AssessmentDefectivity Analysis