Manager, Process Engineer (Deposition)

Senior PCB Component Engineer

Product Engineer - ITLA ODB

Product Engineer - Optical Module

Test Development Engineer

Senior Component Engineer - Interconnect & Connector Components

Electrical Product Engineering Technical Leader

Structural Test Engineer

Test Development Engineer/Leader

Failure Analysis Engineer

Responsibilities: <ul><li>Lead the development and scaling of next-generation advanced packaging technologies, leveraging expertise in thin film deposition processes including Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), and/or Atomic Layer Deposition (ALD) to enable customer roadmaps and address critical technology challenges.</li><li>Drive process and technology roadmap development for advanced packaging, 3D integration, and related semiconductor applications through collaboration with customers, research organizations, and cross-functional engineering teams.</li><li>Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on extremely complex systems for entire range of products for division</li><li>Interact with key customers to resolve extremely complex process engineering issues to address customers High Value Problems (HVP) for an entire range of products for the division.</li><li>Ensures effective product/technology demonstrations.</li><li>Leads collaboration efforts with executive managers and junior managers to ensure strategic execution.</li><li>Leads market share improvement efforts.</li></ul> Requirements: <ul><li>7-10+ years of semiconductor equipment R&amp;D experience.</li><li>2+ years of people management/team leadership experience.</li><li>Strong background in:&nbsp;</li><li>CVD, PVD, ALD, Etch</li><li>Thin-film technologies</li><li>Experience in equipment/process R&amp;D and product development.</li><li>Strong English communication skills.</li></ul>

Responsibilities: <ul><li>Partner with development engineers, commodity teams, and suppliers to create innovative PCB solutions.</li><li>Contribute to the development of PCB commodity strategy.</li><li>Participate in the supplier selection process. Assess and qualify PCB suppliers. Take part in technical and process audits of suppliers as needed.</li><li>Lead PCB failure analysis and drive containment, corrective actions, and risk assessment.</li><li>Work closely with manufacturing and engineering teams to resolve complex technical issues.</li><li>Collaborate with cross-functional teams across the organization. Effectively communicate complex technical concepts and solutions.</li></ul> Requirements: <ul><li>Possess Engineering/Chemistry/Material degree or equivalent, plus 10+ years PCB manufacturing experience.</li><li>Solid understanding and direct experience in PCB design specifications and requirements, qualification, manufacturing fabrication and test, coupled with familiarity of materials (laminates and resins) and reliability knowledge and experience.</li><li>Competency in failure analysis techniques such as FMEA, 8D/Corrective Action, Fishbone IFD, Cause and Effect Analysis, Design of Experiments (DOE), and risk assessment.</li><li>Experienced in managing supplier relationships and implementing corrective actions and rigorous quality control measures to ensure product standards and reliability are consistently met.</li></ul>

Responsibilities: <ul><li>Lead the yield improvement, drive product, process, quality improvements.</li><li>Lead the product debug and FA activities and drive related action to closure.</li><li>Support cost modelling and lead cost reduction activities with cross function team.</li><li>Perform and coordinate DFX activities with design, test and process engineering teams.</li><li>Create product trouble-shooting guides.</li><li>Approve readiness for volume manufacturing.</li></ul> Requirements: <ul><li>Bachelor’s or Master’s degree in Electrical Engineering, Optical Engineering, or a related discipline.</li><li>3+ years of experience in product or manufacturing engineering, focusing on optical components and modules.</li><li>Working experience on optical assembly, fiber handling, and laser diode integration.</li><li>knowledgeable on tunable laser theory, calibration method and test parameters.</li><li>Experienced on tunable module is a plus.</li><li>Ability to drive solutions through cross-functional teams.</li><li>Excellent verbal and written communications skills in English</li></ul>

Responsibilities: <ul><li>Lead the yield improvement, drive product, process, quality improvements.</li><li>Lead the product debug and RMA activities and drive related action to closure.</li><li>Support cost modelling and lead cost reduction activities with cross function team.</li><li>Perform and coordinate DFX activities with design, test and process engineering teams.</li><li>Analyze and correlate performance of key parameters spanning device to sub-system levels to optimize in-process and final test specifications.</li><li>Create product trouble-shooting guides.</li><li>Lead failure analysis, root cause identification and corrective action implementation of components, sub-systems and field failures.</li><li>Approve readiness for volume manufacturing</li></ul> Requirements: <ul><li>BS degree in electrical engineering, physics, or other relevant major.</li><li>5+ years’ experience supporting design and NPI of high bit rate optical transponders.</li><li>Very experienced on optical modules production and process on QSFP-DD, OSFP, CFP2 and QSFP-112, etc.</li><li>Very familiar with 100G/200G/400G/800G/1.6T optical module specifications and test requirements.</li><li>In-depth knowledge of analog and digital electronics, RF, and optical communication circuits and components.</li><li>Ability to drive solutions through cross-functional teams.</li><li>Excellent verbal and written communications skills in English</li></ul>

Responsibilities: <ul><li>Work with engineering team for new system/product/hardware qualification and tuning optimization in production.</li><li>Develop scripts and tools to automate routine test tasks, data reporting, and hardware diagnostic procedures.</li><li>Oversee the design, characterization, and maintenance of probe cards and associated load board hardware to ensure signal integrity.</li><li>Analyze large-scale test data using Python and data frame-based tools to identify yield limiters and implement process improvements.</li><li>Partner with Design and Product Engineering teams to perform root-cause analysis on test failures and silicon performance issues.</li></ul>&nbsp;Requirements: <ul><li>B.S. or M.S. in Electrical Engineering, Computer Engineering, or related field</li><li>Hands-on experience with ATE platforms (e.g., Advantest, Teradyne).</li><li>Advanced proficiency in Python/Pandas for complex data manipulation</li><li>At least 3 years’ working experience on wafer probing systems, good understanding of wafer-level testing methodologies</li><li>Excellent communication skills to effectively coordinate with global cross-functional teams.</li></ul>&nbsp;Preferred Qualifications: <ul><li>Good understanding of the PID control and Piezoelectric effect</li><li>Be familiar with JMP software to perform data analysis&nbsp;</li></ul>

Responsibilities: <ul><li>Support qualification of connector and interconnect component site capabilities and product readiness.</li><li>Serve as a technical contributor in commodity teams; evaluate quality and reliability performance data and provide inputs for sourcing strategy.</li><li>Contribute to defect reduction and process re-engineering efforts related to interconnect components.</li><li>Identify, initiate, and help drive process improvements that reduce cycle time and cost while maintaining exceptional quality.</li><li>Support product transfer and change programs to sustain affected products and supplier sites.</li><li>Engage early in NPI and provide inputs for concurrent engineering efforts (DFM, FMEA, tooling design, plating, validation testing, etc.).</li><li>Provide technical support to the supply chain and engineering community, building toward subject-matter expertise in interconnect technologies.</li></ul> Requirements: <ul><li>Bachelors or Masters Degree in Mechanical Engineering, Electrical Engineering, or an equivalent field, with 5-7+ years of relevant industry experience.</li><li>Foundational hands-on exposure to interconnect and connector technologies at the application and component level, including the fundamentals of associated PCB attach technologies.</li><li>Familiarity with mechanical and electrical design principles — tolerance analysis, fabrication methods, materials selection, plating, and validation testing. Awareness of Signal Integrity (SI) fundamentals is a plus.</li><li>Experience with problem-solving and process improvement methodologies (8D, Lean Six Sigma) and FMEA facilitation techniques.</li><li>Experience managing multiple projects using established project management skills and tools.</li><li>Domain exposure to connector or interconnect component manufacturing processes preferred.</li><li>Requires on-site support at manufacturing facilities.</li><li>Strategically focused, impact-oriented, highly organized, and adaptable.</li><li>Fluent English and Vietnamese speaking and writing. Chinese speaking and writing is a plus.</li></ul>

Responsibilities: <ul><li>Perform electrical engineering tasks and contribute to sustaining engineering projects.</li><li>Support value engineering, including component selection, design changes, and process efficiency.</li><li>Participate in lifecycle management through defect reduction and new component qualification.</li><li>Drive cost avoidance and cost reduction initiatives.</li><li>Conduct design lab experiments, analyze results, and release product documentation.</li><li>Join DFM, DFT, and DFR reviews to improve quality and reduce test/assembly time.</li><li>Communicate technical concepts clearly and provide actionable recommendations.</li></ul> Requirements: <ul><li>Bachelor’s in Electrical Engineering or related discipline with 7 –10 years of experience, or Master’s with equivalent background.</li><li>Solid foundation in electrical engineering with experience in DFx, schematic, CAD, and CAE tools.</li><li>Ability to analyze information, support root cause analysis, and resolve yield/quality issues.</li><li>Skilled at solving straightforward technical problems and presenting logic and decisions.</li><li>Strong communication and collaboration skills; capable of contributing to cross-team impact.</li><li>Demonstrated ability to improve processes, exercise judgment within defined procedures, and grow into higher-level responsibilities.</li></ul>

﻿Responsibilities: <ul><li>Strategic Governance: Act as the technical lead for manufacturing test processes, coordinating technical quality metrics, systemic defect resolution, and sustaining product integrity across multiple global sites.</li><li>Design Influence: Represent structural test in high-level design reviews, setting DfT standards and negotiating probe access and coverage requirements to reduce risk in NPI and production.</li><li>Operational Leadership: Direct the development and deployment of complex ICT and Flying Probe programs. Oversee the qualification and release of test fixtures and assets, ensuring zero-defect compliance.</li><li>Technical Authority: Perform senior-level code reviews and lead global change control processes (ECOs/deviations) for test program source code and manufacturing recipes.</li><li>System Optimization: Lead the integration of advanced On-Board Programming (OBP) strategies and boundary scan (JTAG) flows into the manufacturing line to improve efficiency and test depth.</li><li>Mentorship &amp; Influence: Define and promote debug methodologies for manufacturing site test engineers; act as the lead interface between company and external fixture/hardware vendors.</li><li>Process Scalability: Champion the adoption of automated workflows, version control standards, and statistical process control (SPC) to drive continuous improvement across the global manufacturing footprint.</li></ul> Requirements: <ul><li>Bachelors degree or equivalent experience in Electrical Engineering, Manufacturing Engineering, or a related technical field.</li><li>8+ years of professional experience in structural test development, debug, and release on industry-standard ICT platforms (e.g., Keysight i3070/Series 6 or TRI).</li><li>5+ years of experience with Flying Probe system development (e.g., SPEA FP4080 or equivalent).</li><li>Demonstrated experience leading end-to-end manufacturing test requirements, including program development, fixture procurement, and factory floor correlation.</li><li>Proven experience leading technical projects or providing technical guidance to multi-functional teams or external manufacturing partners.</li></ul>

Responsibilities: <ul><li>Collaborate with Product Design &amp; Engineering teams to apply Product Design &amp; Test Methodology.</li><li>Engage early in design to improve DFM/DFT requirements and provide timely feedback.</li><li>Develop manufacturing test strategies based on hardware, system, and diagnostics specifications.</li><li>Act as the technical POC for Contract Manufacturers, providing debug support and resolving product queries.</li><li>Deliver scalable, efficient test automation code aligned with guidelines.</li><li>Provide cross-BU and cross-product family support.</li></ul> Requirements: <ul><li>Bachelor’s/Graduate degree in Electronics or Computer Science Engineering.</li><li>5 + years of experience in hardware product design, validation, and test automation, with strong C/C++/Python programming skills.</li></ul>

Responsibilities: <ul><li>Failure Analysis Engineer will drive the improvements in the accuracy of the fault duplication and isolation</li><li>Provide directions and techniques on customer issues.</li><li>Engage Design engineering and communicate findings and resolutions for HW and SW field issues.</li><li>Coordinate the Failure Analysis cases review meeting with company teams and suppliers.</li><li>Defect detection including containment analysis.</li><li>Work closely with a multi-functional team of Product Leads, Technical Leads and Customer Support to accelerate replicate customer reported issue.</li><li>Articulate key technical issues to stakeholders, sense issues early, identify impact and partner to drive resolution.</li><li>Ensure EMS partners deliver timely and accurate results in duplicating, isolating root cause of customer issues.</li><li>Drive innovation, new technology/processes.</li><li>Organize, plan, track and close-out design, components, manufacturing issues associated with the products.</li><li>Evolving the Product debug document over the Product Life Cycle.</li><li>Responsible for communication on key issues along with quality group to design engineering, accounts and Escalations teams.</li><li>Proactive Engagement with customer facing teams on reducing RMA, rightsizing FA, and getting more debug and troubleshooting information from Field.</li><li>Collaborate with PQE/CEs and drive Corrective/ Preventive action. Design Issue, MFG Issue, Process, supplier issue.</li><li>Participate in initiatives to enhance existing test strategies, methodologies and test/diagnostic coverage for field returns to aim for improvements in the accuracy of the fault duplication and isolation</li></ul> Requirements: <ul><li>Bachelor’s in electrical or computer engineering with 7+ years of related experience.</li><li>Experience with High-Speed Network Interfaces along with previous hands-on board design expertise and familiarity with board design tools such as Cadence Allegro or similar tools.</li><li>Hardware design, schematics generation, and design validation for service provide routing products.</li><li>Experience with sophisticated high speed board design and board bring-up.</li><li>Knowledge of products.</li></ul>

Skills

Industry

Location

Jobtitle

104 test methods Jobs found

Manager, Process Engineer (Deposition)

Senior PCB Component Engineer

Product Engineer - ITLA ODB

Product Engineer - Optical Module

Test Development Engineer

Senior Component Engineer - Interconnect & Connector Components

Electrical Product Engineering Technical Leader

Structural Test Engineer

Test Development Engineer/Leader

Failure Analysis Engineer

WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.

EMPLOYER

TALENT

COMPANY

Contact Us

JOBS BY SKILLS

JOBS BY FUNCTION

JOBS BY INDUSTRY

JOBS BY LOCATIONS

MODEL JOBS

JOBS BY CITY

Skills

Industry

Location

Jobtitle

104 test methods Jobs found

Manager, Process Engineer (Deposition)

Senior PCB Component Engineer

Product Engineer - ITLA ODB

Product Engineer - Optical Module

Test Development Engineer

Senior Component Engineer - Interconnect & Connector Components

Electrical Product Engineering Technical Leader

Structural Test Engineer

Test Development Engineer/Leader

Failure Analysis Engineer

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

EMPLOYER

TALENT

COMPANY

Contact Us

JOBS BY SKILLS

JOBS BY FUNCTION

JOBS BY INDUSTRY

JOBS BY LOCATIONS

MODEL JOBS

JOBS BY CITY

WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.