Filters

Skills

python
java
sql
stakeholder management
quality control
advanced packaging
advanced semiconductor packaging
analytical skills
c++
communication skills

Industry

pharmaceuticals

Location

singapore, singapore
kuala lumpur, malaysia
bengaluru, india
mexico city, mexico
mumbai,maharashtra,india
chennai, india
perai, malaysia
suzhou, china
atlanta, united states
bangkok, thailand

Jobtitle

test engineer
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
senior engineer, aptd cem - advanced packaging die level technology engineering
test
iiad / sad / lad artificial intelligence engineer
127217 senior quality & reliability engineer
application development and maintenance manager (payment), core banking (vp 2)
avp, iam program manager
business analyst authorization, btp & basis

Filter

88 test methods Jobs found

1-10 of 88
D

Dubai, United Arab Emirates

D

Change ManagementStakeholder ManagementComplex Project ManagementProject DeliveryBudgetingCompliance & Regulatory ManagementPMO & Governance
S

Bengaluru, India

S

REST APIDockerSoftware DevelopmentFull Stack DevelopmentJava Spring BootJavascriptProduction Developing
T

Kuala Lumpur, Malaysia

T

Linux ServerApache WebServerPeople ManagementService ManagementTest InfrastructureWindows ServerSQL Server
P

Singapore, Singapore

P

SQLData & IntegrationDevOps & Cloud SkillsUnit TestingTest AutomationFinance & Record-to-ReportERP & Financial SystemsProduct EngineeringJava
S

Kuala Lumpur, Malaysia

S

Cloud TechnologiesIntegration TestingProduction SupportCore Banking & Lending DomainSoftware DevelopmentDatabase TechnologiesIntegration & MiddlewareDevOps & CI/CD

Problem ManagementSecure SDLCProduction SupportTesting & Quality AssuranceDevOps & CI/CDApplication DevelopmentCloud TechnologiesDatabase TechnologiesCore Banking & Payments Skills
F

Kuala Lumpur, Malaysia

F

Account Payable And ReceivableData MappingRequirement AnalysisBudgetingAgile MethodologiesFinancial ReportingFund Transfer PricingForecasting
S

Perai, Malaysia

S

FMEADOEApqp MethodQuality ControlCable AssemblyNpi Management

Advanced Semiconductor PackagingPackaging Materials & Process DevelopmentSemiconductor Process EngineeringWafer Bonding & DebondingInterposer Technology

Advanced Packaging IntegrationAdvanced Semiconductor PackagingWafer Bonding & Hybrid BondingMicro-Bump & Fine-Pitch InterconnectsRedistribution Layer