Senior PCB Component Engineer

Product Engineer - ITLA ODB

Product Engineer - Optical Module

Test Development Engineer

Electrical Product Engineering Technical Leader

Structural Test Engineer

Test Development Engineer/Leader

Failure Analysis Engineer

Consulting Engineer - Service Provider 

MGR II Qlty & Reliability Engineering

Responsibilities: <ul><li>Partner with development engineers, commodity teams, and suppliers to create innovative PCB solutions.</li><li>Contribute to the development of PCB commodity strategy.</li><li>Participate in the supplier selection process. Assess and qualify PCB suppliers. Take part in technical and process audits of suppliers as needed.</li><li>Lead PCB failure analysis and drive containment, corrective actions, and risk assessment.</li><li>Work closely with manufacturing and engineering teams to resolve complex technical issues.</li><li>Collaborate with cross-functional teams across the organization. Effectively communicate complex technical concepts and solutions.</li></ul> Requirements: <ul><li>Possess Engineering/Chemistry/Material degree or equivalent, plus 10+ years PCB manufacturing experience.</li><li>Solid understanding and direct experience in PCB design specifications and requirements, qualification, manufacturing fabrication and test, coupled with familiarity of materials (laminates and resins) and reliability knowledge and experience.</li><li>Competency in failure analysis techniques such as FMEA, 8D/Corrective Action, Fishbone IFD, Cause and Effect Analysis, Design of Experiments (DOE), and risk assessment.</li><li>Experienced in managing supplier relationships and implementing corrective actions and rigorous quality control measures to ensure product standards and reliability are consistently met.</li></ul>

Responsibilities: <ul><li>Lead the yield improvement, drive product, process, quality improvements.</li><li>Lead the product debug and FA activities and drive related action to closure.</li><li>Support cost modelling and lead cost reduction activities with cross function team.</li><li>Perform and coordinate DFX activities with design, test and process engineering teams.</li><li>Create product trouble-shooting guides.</li><li>Approve readiness for volume manufacturing.</li></ul> Requirements: <ul><li>Bachelor’s or Master’s degree in Electrical Engineering, Optical Engineering, or a related discipline.</li><li>3+ years of experience in product or manufacturing engineering, focusing on optical components and modules.</li><li>Working experience on optical assembly, fiber handling, and laser diode integration.</li><li>knowledgeable on tunable laser theory, calibration method and test parameters.</li><li>Experienced on tunable module is a plus.</li><li>Ability to drive solutions through cross-functional teams.</li><li>Excellent verbal and written communications skills in English</li></ul>

Responsibilities: <ul><li>Lead the yield improvement, drive product, process, quality improvements.</li><li>Lead the product debug and RMA activities and drive related action to closure.</li><li>Support cost modelling and lead cost reduction activities with cross function team.</li><li>Perform and coordinate DFX activities with design, test and process engineering teams.</li><li>Analyze and correlate performance of key parameters spanning device to sub-system levels to optimize in-process and final test specifications.</li><li>Create product trouble-shooting guides.</li><li>Lead failure analysis, root cause identification and corrective action implementation of components, sub-systems and field failures.</li><li>Approve readiness for volume manufacturing</li></ul> Requirements: <ul><li>BS degree in electrical engineering, physics, or other relevant major.</li><li>5+ years’ experience supporting design and NPI of high bit rate optical transponders.</li><li>Very experienced on optical modules production and process on QSFP-DD, OSFP, CFP2 and QSFP-112, etc.</li><li>Very familiar with 100G/200G/400G/800G/1.6T optical module specifications and test requirements.</li><li>In-depth knowledge of analog and digital electronics, RF, and optical communication circuits and components.</li><li>Ability to drive solutions through cross-functional teams.</li><li>Excellent verbal and written communications skills in English</li></ul>

Responsibilities: <ul><li>Work with engineering team for new system/product/hardware qualification and tuning optimization in production.</li><li>Develop scripts and tools to automate routine test tasks, data reporting, and hardware diagnostic procedures.</li><li>Oversee the design, characterization, and maintenance of probe cards and associated load board hardware to ensure signal integrity.</li><li>Analyze large-scale test data using Python and data frame-based tools to identify yield limiters and implement process improvements.</li><li>Partner with Design and Product Engineering teams to perform root-cause analysis on test failures and silicon performance issues.</li></ul>&nbsp;Requirements: <ul><li>B.S. or M.S. in Electrical Engineering, Computer Engineering, or related field</li><li>Hands-on experience with ATE platforms (e.g., Advantest, Teradyne).</li><li>Advanced proficiency in Python/Pandas for complex data manipulation</li><li>At least 3 years’ working experience on wafer probing systems, good understanding of wafer-level testing methodologies</li><li>Excellent communication skills to effectively coordinate with global cross-functional teams.</li></ul>&nbsp;Preferred Qualifications: <ul><li>Good understanding of the PID control and Piezoelectric effect</li><li>Be familiar with JMP software to perform data analysis&nbsp;</li></ul>

Responsibilities: <ul><li>Perform electrical engineering tasks and contribute to sustaining engineering projects.</li><li>Support value engineering, including component selection, design changes, and process efficiency.</li><li>Participate in lifecycle management through defect reduction and new component qualification.</li><li>Drive cost avoidance and cost reduction initiatives.</li><li>Conduct design lab experiments, analyze results, and release product documentation.</li><li>Join DFM, DFT, and DFR reviews to improve quality and reduce test/assembly time.</li><li>Communicate technical concepts clearly and provide actionable recommendations.</li></ul> Requirements: <ul><li>Bachelor’s in Electrical Engineering or related discipline with 7 –10 years of experience, or Master’s with equivalent background.</li><li>Solid foundation in electrical engineering with experience in DFx, schematic, CAD, and CAE tools.</li><li>Ability to analyze information, support root cause analysis, and resolve yield/quality issues.</li><li>Skilled at solving straightforward technical problems and presenting logic and decisions.</li><li>Strong communication and collaboration skills; capable of contributing to cross-team impact.</li><li>Demonstrated ability to improve processes, exercise judgment within defined procedures, and grow into higher-level responsibilities.</li></ul>

﻿Responsibilities: <ul><li>Strategic Governance: Act as the technical lead for manufacturing test processes, coordinating technical quality metrics, systemic defect resolution, and sustaining product integrity across multiple global sites.</li><li>Design Influence: Represent structural test in high-level design reviews, setting DfT standards and negotiating probe access and coverage requirements to reduce risk in NPI and production.</li><li>Operational Leadership: Direct the development and deployment of complex ICT and Flying Probe programs. Oversee the qualification and release of test fixtures and assets, ensuring zero-defect compliance.</li><li>Technical Authority: Perform senior-level code reviews and lead global change control processes (ECOs/deviations) for test program source code and manufacturing recipes.</li><li>System Optimization: Lead the integration of advanced On-Board Programming (OBP) strategies and boundary scan (JTAG) flows into the manufacturing line to improve efficiency and test depth.</li><li>Mentorship &amp; Influence: Define and promote debug methodologies for manufacturing site test engineers; act as the lead interface between company and external fixture/hardware vendors.</li><li>Process Scalability: Champion the adoption of automated workflows, version control standards, and statistical process control (SPC) to drive continuous improvement across the global manufacturing footprint.</li></ul> Requirements: <ul><li>Bachelors degree or equivalent experience in Electrical Engineering, Manufacturing Engineering, or a related technical field.</li><li>8+ years of professional experience in structural test development, debug, and release on industry-standard ICT platforms (e.g., Keysight i3070/Series 6 or TRI).</li><li>5+ years of experience with Flying Probe system development (e.g., SPEA FP4080 or equivalent).</li><li>Demonstrated experience leading end-to-end manufacturing test requirements, including program development, fixture procurement, and factory floor correlation.</li><li>Proven experience leading technical projects or providing technical guidance to multi-functional teams or external manufacturing partners.</li></ul>

Responsibilities: <ul><li>Collaborate with Product Design &amp; Engineering teams to apply Product Design &amp; Test Methodology.</li><li>Engage early in design to improve DFM/DFT requirements and provide timely feedback.</li><li>Develop manufacturing test strategies based on hardware, system, and diagnostics specifications.</li><li>Act as the technical POC for Contract Manufacturers, providing debug support and resolving product queries.</li><li>Deliver scalable, efficient test automation code aligned with guidelines.</li><li>Provide cross-BU and cross-product family support.</li></ul> Requirements: <ul><li>Bachelor’s/Graduate degree in Electronics or Computer Science Engineering.</li><li>5 + years of experience in hardware product design, validation, and test automation, with strong C/C++/Python programming skills.</li></ul>

Responsibilities: <ul><li>Failure Analysis Engineer will drive the improvements in the accuracy of the fault duplication and isolation</li><li>Provide directions and techniques on customer issues.</li><li>Engage Design engineering and communicate findings and resolutions for HW and SW field issues.</li><li>Coordinate the Failure Analysis cases review meeting with company teams and suppliers.</li><li>Defect detection including containment analysis.</li><li>Work closely with a multi-functional team of Product Leads, Technical Leads and Customer Support to accelerate replicate customer reported issue.</li><li>Articulate key technical issues to stakeholders, sense issues early, identify impact and partner to drive resolution.</li><li>Ensure EMS partners deliver timely and accurate results in duplicating, isolating root cause of customer issues.</li><li>Drive innovation, new technology/processes.</li><li>Organize, plan, track and close-out design, components, manufacturing issues associated with the products.</li><li>Evolving the Product debug document over the Product Life Cycle.</li><li>Responsible for communication on key issues along with quality group to design engineering, accounts and Escalations teams.</li><li>Proactive Engagement with customer facing teams on reducing RMA, rightsizing FA, and getting more debug and troubleshooting information from Field.</li><li>Collaborate with PQE/CEs and drive Corrective/ Preventive action. Design Issue, MFG Issue, Process, supplier issue.</li><li>Participate in initiatives to enhance existing test strategies, methodologies and test/diagnostic coverage for field returns to aim for improvements in the accuracy of the fault duplication and isolation</li></ul> Requirements: <ul><li>Bachelor’s in electrical or computer engineering with 7+ years of related experience.</li><li>Experience with High-Speed Network Interfaces along with previous hands-on board design expertise and familiarity with board design tools such as Cadence Allegro or similar tools.</li><li>Hardware design, schematics generation, and design validation for service provide routing products.</li><li>Experience with sophisticated high speed board design and board bring-up.</li><li>Knowledge of products.</li></ul>

Responsibilities: <ul><li>Lead and drive end-to-end technology design, implementation, and optimization for major mobile wireless accounts to accelerate critical customer business outcomes.&nbsp;</li><li>Partner closely with company account teams and cross-functional engineering groups to build high-performance mobile packet core architectures.&nbsp;</li><li>Author and review comprehensive project collateral, including High-Level Designs (HLD) and Low-Level Designs (LLD), to translate sophisticated customer requirements into detailed execution plans.&nbsp;</li><li>Build high-fidelity simulations in dedicated test labs to proactively validate new solutions and quickly resolve sophisticated network compatibility issues.&nbsp;</li><li>Implement cutting-edge delivery methodologies and share lessons learned to continuously elevate the technical capabilities and efficiency of the broader team.</li></ul> Requirements: <ul><li>Experience: 8+ years of relevant experience in technical lifecycle services, including the planning, design, implementation, and optimization of Mobile Wireless Solutions.</li><li>Core Technology: Proficient technical knowledge of 4G/5G mobile packet core architectures and nodes (such as S-GW, P-GW, MME, GGSN, ePDG, or 5G Core functions like SMF/UPF/AMF).</li><li>Standards &amp; Flows: Solid understanding of 3GPP standards, 4G/5G mobile architectures, and associated end-to-end protocol call flows.</li><li>Cloud &amp; Virtualization: Practical, hands-on experience working with cloud and virtualization technologies, specifically Dockers, Kubernetes, OpenStack, AWS, or VIM.</li><li>Documentation &amp; Design: Consistent record of creating technical engineering documentation, including High-Level Designs (HLDs), Low-Level Designs (LLDs), and Method of Procedure (MOP) plans.</li></ul>

Responsibilities: <ul><li>Primary responsibility for developing and driving standardized Design for Reliability Engineering (DfRE) and Robustness Validation (RV) Methodologies for all Power Products.</li><li>Drive a DFSS culture, one of innovation, constant learning, and continuous improvement that aspires to deliver "First Time Right"; provide product development and DFSS training, coaching, and mentoring to product design teams to create a world class product development organization.</li><li>Drive excellence in Design for Reliability ensuring comprehensive utilization of modeling and simulation, structured DOE approaches, robust product validation including HALT/HAST and Test to Failure (TTF) methodologies.&nbsp;Oversee integrating reliability considerations during technology &amp; product evaluation, NPI product development from receipt of Customer Spec (Mission Profile) through Product Release into mass production; will have T&amp;V Plan + Reliability Test Plan Finalization Authority for Power Products.</li><li>Partner with PDE’s to quickly produce and evaluate first samples to expedite speed to market and drive fast and iterative product design improvements; drive Early Concept Testing identifying potential weaknesses and failure mechanisms in the product design and validating all improvements through testing and capability analysis.</li><li>Work very closely with MPDE about Process Developments and Equipment Developments, developing comprehensive test plans to ensure capability to six sigma standards and driving world-class Simultaneous Engineering (Concurrent Engineering).</li><li>Support Mfg Quality with failure analysis (F/A) and Root Cause and Corrective Action (RCCA) of line scrap and customer returns as well as competitive benchmarking activities.</li><li>Lead the identification of special testing needs and requirements and partner with Global R&amp;T COE to develop Custom Test Equipment, Tests &amp; Test Specifications.&nbsp;Oversee all application testing for Power Products.</li><li>Drive high performance organization by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability.&nbsp;</li><li>Manage employee well-being by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives.</li><li>Drive organization effectiveness by structuring your organization in a way that best enables the BU strategy, maximizes resource efficiency and productivity, and provides role clarity and clear lines of accountability.</li><li>Manage the talent in your organization to support the business now and to proactively prepare for the future by identifying organization skillset/role gaps, implementing plans to fill any skillset/role gaps, and assessing current talent fit to ensure the right talent is matched to the right roles to best meet the needs of the business.</li></ul> Requirements: <ul><li>Bachelor/ Master’s degree in technical discipline (Electrical Engineering, Electronics, Mechatronics)</li><li>10+ years of Experience in all aspects of reliability engineering for electronic or mechatronics products from reliability estimation to reliability calculation and risk identification.</li><li>Must also have many years of experience working with test equipment, test systems, test labs, development and deployment of HALT/HAST testing, Test &amp; Validation Plans, development of custom test systems and performing “application tests.”&nbsp;Must have a good balance between theory and practice.</li><li>Experience interacting with global cross-functional engineering teams in multi-site global organization.</li><li>Excellent English, both verbal and written, and the ability to interact professionally with customers, leadership, stakeholders, cross functional teams and subject matter experts.</li><li>Exceptional analytical, critical thinking, and problem-solving skills and ability to make decisions when presented with a series of challenges, conflicts and constraints.&nbsp;Ability to drive to big picture goals and milestones while valuing and maintaining strong attention to the details.</li><li>Knowledge on FIT estimation methodology, statistical analysis for reliability calculation such as Weibull-analysis or 2-statistics, application of Bayes theorem, random failure principle, FMEDA, FTA</li><li>Reliability Engineering training from company, ASQ, TUV, Reliasoft or equivalent</li><li>Experience with custom product development, working closely with customers to define mission profile of the end application and optimizing reliability strategy based on customer needs.</li><li>Experience in running statistical analysis for reliability calculation for mechatronic products.</li><li>A high curiosity in understanding how systems/products work along with a reverse engineering mindset.</li><li>Willingness to travel as required, ~20%&nbsp;</li></ul>

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83 test scenarios Jobs found

Senior PCB Component Engineer

Product Engineer - ITLA ODB

Product Engineer - Optical Module

Test Development Engineer

Electrical Product Engineering Technical Leader

Structural Test Engineer

Test Development Engineer/Leader

Failure Analysis Engineer

Consulting Engineer - Service Provider

MGR II Qlty & Reliability Engineering

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83 test scenarios Jobs found

Senior PCB Component Engineer

Product Engineer - ITLA ODB

Product Engineer - Optical Module

Test Development Engineer

Electrical Product Engineering Technical Leader

Structural Test Engineer

Test Development Engineer/Leader

Failure Analysis Engineer

Consulting Engineer - Service Provider

MGR II Qlty & Reliability Engineering

WhiteCrow WhiteCrow is on a mission to connect companies with the best talent across the globe.

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WhiteCrow
WhiteCrow is on a mission to connect companies with the best talent across the globe.