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Skills

project management
quality control
sql
cable assembly
continuous improvement
python
sales
six sigma
agile
customer service

Industry

hospitality

Location

singapore, singapore
perai, malaysia
bengaluru, india
penang, malaysia
batangas, philippines
pune, india
arlington, united states
atlanta, united states
bangkok, thailand
bangsar, malaysia

Jobtitle

senior engineer, aptd cem - advanced packaging die level technology engineering
125112 vision system engineer
accounts payable
ai transformation engineer
avp, channel marketing
business process analyst - purchasing
business process analyst - warehouse/logistics
customer account manager
dry etch principal engineer/ mts lead, process development, advance nand
ehs analyst iii

Filter

41 tool calling Jobs found

1-10 of 41
A

Bengaluru, India

A

Process MappingData GovernanceTool CallingData PipelinesSecurity & GovernanceAI & GenAIPythonAutomationSQLAI Platforms & APIs
M

Pune, India

M

Manufacturing Process DevelopmentProcess Design & OptimizationNew Product IntroductionContinuous ImprovementTime Study & Process Capacity Analysis
E

EHS Analyst III

12 days ago

Perai, Malaysia

E

Environmental, Health & Safety (EHS) ManagementEHS Compliance & Regulatory AuditsRisk Assessment & Hazard IdentificationEmergency Response & PreparednessWaste Management
T

TA Specialist

25 days ago

Chon Buri, Thailand

T

NegotiationTalent MappingStakeholder ManagementTalent AcquisitionRecruitmentEnd To End RecruitingSourcing
S

Bengaluru, India

S

Management & LeadershipManufacturing Engineering SkillsContinuous ImprovementQuality & Process ImprovementTechnical & Production SkillsLean & Operational Excellence
P

Singapore, Singapore

P

SQLData & IntegrationDevOps & Cloud SkillsUnit TestingTest AutomationFinance & Record-to-ReportERP & Financial SystemsProduct EngineeringJava
S

Perai, Malaysia

S

FMEADOEApqp MethodQuality ControlCable AssemblyNpi Management
Q

Pune, India

Q

Six SigmaTechnical SkillsPPAPMeasurement System AnalysisPareto analysisQuality Management SoftwareTime Management

Advanced Semiconductor PackagingMicro-Bump & Fine-Pitch InterconnectsWafer Dicing & Die SingulationHybrid BondingUnderfill & Encapsulation Technologies
A

Bengaluru, India

A

ZetaMarketingDigital ExperienceDeployingProject ManagementAgile