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Skills
advanced semiconductor packaging
advanced packaging
advanced packaging integration
failure analysis
micro-bump & fine-pitch interconnects
process integration
python
requirements analysis
technical documentation
thermal management
Industry
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Location
singapore, singapore
bangkok, thailand
Jobtitle
senior engineer, aptd cem - advanced packaging die level technology engineering
front end central product integration (fe cpie) mts (fe)
front-end process integration engineer
fronted end central process integration senior engineer
mts - fecos cpie device
principal engineer/mts - member of technical staff, hig-hbm product system engineering (media health
principal nand reliability product engineer
principal/senior engineer, aptd cem - advanced packaging integration engineering
principal/staff/senior engineer, aptd cem - advanced packaging wafer level technology engineering
process automation engineer - optical & transceiver products
Filter
19 wafer fab Jobs found
1-10 of 19
F
Front-End Process Integration Engineer
9 days ago
F
Statistical AnalysisYield ImprovementYield AnalysisFront End ProcessProcess IntegrationFailure Analysis
Fiber AlignmentOptical CouplingSemiconductorsOpticsWafer Level OpticsFailure Analysis
HVACSemiconductor EngineeringDesign ReviewSemiconductor ConstructionMechanical EngineeringConstruction Engineering
P
Principal NAND Reliability Product Engineer
20 days ago
P
NAND Product EngineeringNAND Flash Memory TechnologyMemory Cell PhysicsProduct QualificationReliability Testing
S
Staff/Principal Engineer - CMP Advanced NAND
20 days ago
S
Yield ImprovementCMP Process IntegrationSelectivity OptimizationDishing and Erosion ControlProcess Flow DevelopmentSlurry Chemistry
KubernetesFront-End DevelopmentReact.js JSON API integrationWeb Services & System Integration
Technical DocumentationFront-End EngineeringRequirements AnalysisCentral Product IntegrationProduct Integration & System IntegrationChange Management
M
MTS – FECOS CPIE Device
20 days ago
M
Device Integration and ConfigurationDevice Communication ProtocolsEmbedded SystemsRequirements AnalysisCentral Process Integration
T
Thermal ManagementAdvanced Packaging IntegrationPackage ArchitectureAdvanced InterconnectsHeterogeneous IntegrationProcess Integration
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