Staff/Principal Engineer - CMP Advanced NAND

Manager I - R&D Product Development Engineering

Talent Acquisition Specialist

Technical Director, Advanced Packaging Integration

Process Engineering Manager (Electroplating)

Senior Process Engineer (R&D)

AI / ML Engineer

Senior Analyst, Threat Detection and Response

Senior Manufacturing Engineer

Quality Assurance (QA) Associate

Responsibilities: <ul><li>As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of company memory parts.</li><li>Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts</li><li>Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications</li><li>Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions</li><li>Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes</li><li>Incorporate best known manufacturing methods into early development phase of upcoming nodes</li><li>Design and implement advanced process monitoring and control methodologies</li><li>Provide strategic roadmap for N+, N++ and future NAND Nodes</li><li>Serve as a technical expert within company contributing to technical projects for improvements to processes, procedures, and equipment</li><li>Define and leads complex, multi-functional projects of critical importance to company, helps to define strategic direction</li><li>Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers</li><li>This position requires communication and collaboration with partners both locally and globally. Strict adherence to company Intellectual Property Protection policy is necessary</li></ul> Requirements: <ul><li>PhD with ≥5 years, or Master’s degree with ≥7 years, or Bachelor’s degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field, with demonstrated expertise in semiconductor Experience in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication.</li><li>Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads</li><li>Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology</li><li>Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes</li><li>An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.</li><li>Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.</li><li>Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.</li><li>Strong collaboration and communication skills (verbal and written).</li><li>Self-driven, adaptable, and able to manage multiple projects.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</li><li>Proven ability to take calculated risks and execute novel solutions.</li><li>Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.</li></ul>

Role Description: <ul><li>Automotive Industry offers products for vehicle electrification systems like chassis systems, convenience applications, driver information, infotainment solutions, miniaturization solutions, motor and powertrain applications etc.&nbsp;</li><li>The client Automotive BU is focused on developing new and improved vehicle architecture approaches to efficiently address these challenges in Connectivity from power to propulsion and safety.&nbsp;</li><li>The Manager R&amp;D Product development contributes to the development of organizational strategy and supports in implementation of operational plans.</li><li>Being part of Product development team responsible to develop for new products and sustenance of existing product lines of Automotive business unit of client.</li><li>This position drives development of PCB connectors for automotive applications including Board to Board, Wire to Board and Flex to Board connectors.</li></ul> Responsibilities: <ul><li>Managing experienced professional and/or supervisors who exercise independence in their assignments and providing them with the required guidance and also be a strong technical contributor.</li><li>Providing strategic leadership to foster growth of the business.</li><li>Interacting and cooperating with multiple organizational levels to meet schedule and technical expectations.</li><li>Administrating schedules and ensuring performance requirements.</li><li>Providing knowledge of engineering tools such as Creo, etc. and product domain expertise in multiple projects.</li><li>Assist Inside Device Connectivity (InDeCo) engineering teams with New Product Developments across a range of projects and executing on cost optimization/reduction (VA/VE) opportunities for the business.</li><li>Preparing design verification test plans, Design &amp; Process FMEAs.</li><li>Successfully facilitate transfer and support of new product introduction (NPI) into high volume manufacturing.</li><li>Contributing to technical function initiatives across various initiatives.</li><li>Reverse Engineering and benchmarking of competitor products.</li><li>Support product environmental compliance and approvals for all new products and platforms as required by our customers.</li><li>Be a strong technical partner and provide support to Product management teams.</li><li>Attend/support customer meetings, technology days and site visits as required.</li></ul> Requirements: <ul><li>Master’s degree in mechanical engineering or equivalent is preferred with minimum 8 years of experience in related fields.</li><li>Mechanical or equivalent engineering Degree with minimum 10 years of related product development experience.&nbsp;</li><li>Experience with product design of PCB Connector such as Board to Board, Flex to Board, Wire to Board is essential.</li><li>Knowledge in product design of plastic, terminals (sheet metal), fine pitch connectors, rubber components.</li><li>Working knowledge of driving diversity and inclusion, customer/market focus, result orientation, managing multiple priorities, envisioning the future, coaching and developing people and collaborating across boundaries</li><li>Extensive experience executing plans in a disciplined way and in holding people accountable.</li><li>Organized, methodical and self-motivated individual.</li><li>A person with the ability to achieve goals and the highest standards of performance in a dynamic fast paced environment.</li><li>Attention to detail and on time delivery.</li><li>Excellent judgment, timely and high-quality decision-making skills.</li><li>Proven ability to execute engineering deliverables.</li><li>Strong customer service mindset and mentality of delivering quality products and services on time and within company cost and profitability objectives.</li><li>Fluent communication skills facilitate collaboration with own team, customers, internal business leaders and technology leaders to create value.</li><li>Individual must be self-motivated, have strong planning skills and be able to deal with and balance multiple competing priorities.</li></ul> Functional: Mandatory: <ul><li>Working knowledge of product development (Processes, Approaches, Tools and Techniques) &amp; Validation</li><li>Working knowledge of manufacturing processes like injection Mold, plating, assembly &amp; High-speed stamping</li><li>Working knowledge to apply Six Sigma / DFSS methodology to design, development, and delivery of technology products and process.</li><li>Working knowledge in use of CAD systems (CREO Part modeling &amp; Sheet Metal)</li><li>Interpretation of simulation results &amp; translating into product design</li><li>Working knowledge in Design for Manufacturability (DFM) &amp; FMEA&nbsp;</li><li>Proficient in Tolerance stack-up and GD&amp;T</li><li>Ability to generate design concepts and solve design problems&nbsp;</li><li>Working knowledge in prototyping methods</li><li>Working knowledge in Manufacturing process (Molding / Stamping / Plating)</li><li>Understanding of linear and non-linear analysis</li><li>Working knowledge of product life cycle.</li><li>Basic Knowledge in quality tools (8D, Why Why analysis, Fish bone….)</li><li>Awareness of recognition &amp; protection of IP (intellectual property) features</li><li>Basic knowledge of PPAP documentation.</li></ul> Preferred: <ul><li>Knowledge of customer application&nbsp;</li><li>Experience in development of automotive signal and power connectors.</li></ul> Department specific: <ul><li>Exposure to PCB Connector design</li><li>Ability to understand specifications for validation as per US CAR / LV 214 / Similar Specification</li><li>Knowledge about crimping technologies, Ultrasonic welding technologies, Laser welding technologies</li></ul>

Responsibilities: <ul><li>Select the desired employees and develop, implement, and monitor the programs and processes used in recruitment and selection.&nbsp;</li><li>They source, recruit, screen, interview and recommend external and/or internal candidates to staff open requisitions.&nbsp;</li><li>Utilize the services of employment agencies and/or place employment ads in appropriate sources, including the intranet, Internet, and print media.&nbsp;</li><li>Responsible for developing and implementing recruiting plans and administering talent management efforts and employee referral programs, managing the resume tracking system and ensuring consistent corporate image throughout recruiting campaigns.&nbsp;</li><li>Lead end-to-end recruitment, ensuring alignment with organizational strategy and culture.</li><li>Manage end-to-end hiring process: Source, resume screen, phone screen, schedule interviews, Offer documentation and onboarding</li></ul> Requirements: <ul><li>Minimum 6+ years of experience required for this role.</li><li>Should possess expert knowledge and innovative skills to source and attract active &amp; passive talent from different sourcing channels (job boards, social media, referrals and local outreach to identify potential candidates</li><li>Communication and Stakeholder management is key to be successful in this role as you work with global stakeholders and matrix organization</li><li>Good understanding of the engineering manufacturing industries in the local market, able to map talents, develop business intelligence for sourcing strategies and techniques</li></ul> Qualification <ul><li>Experience in handling end-to-end Talent Attraction Process [Source to Onboard]</li><li>Be able to develop Recruiting Strategies basis the skill demand and complexities</li><li>Expert knowledge and Hands-on in preparing market research, Market/Talent mapping using various tools such as Talent Neuron, Draup, LinkedIn Talent Insight</li><li>Data driven: able to analyse, slice &amp; dice data, develop insights from data and be able to make decisions to drive hiring strategies</li></ul>

Responsibilities: <ul><li>Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies</li><li>Define, document, and implement end-to-end process flows for panel-level packaging technologies</li><li>Lead material selection, characterization, and compatibility assessments for large form factor substrates</li><li>Partner with customers to define and align process specifications and acceptance criteria</li><li>Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers</li><li>Contribute to our client equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps</li><li>Analyze process data to identify trends, drive optimization, and improve performance</li><li>Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability</li><li>Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions</li><li>Publish and present technical findings at leading industry conferences and in peer-reviewed journals</li><li>Mentor and guide early-career engineers; provide technical direction and best practices</li></ul> Requirements: <ul><li>Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field</li><li>In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows</li><li>Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level</li><li>Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs</li><li>Proficiency in statistical data analysis (e.g. DoE, JMP)</li><li>Knowledge of industry standards and best practices in semiconductor packaging</li><li>Solid understanding of process characterization, metrology, materials &amp; failure analysis</li><li>Working knowledge of reliability requirements and qualification methodologies</li><li>Proven capability to lead multi-functional teams to resolve complex technical problems</li><li>Exceptional written and verbal communication skills</li><li>Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts</li><li>Drive structured technical discussions with customers and suppliers</li><li>Articulate positions, influence decisions, and align technical direction</li><li>Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications</li><li>Ability to work effectively across geographies and time zones</li></ul>

Responsibilities: <ul><li>Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products</li><li>Manage, develop, plan and execute process engineering projects for entire range of products</li><li>Interact with key customers to resolve significantly complex process engineering issues for entire range of products</li><li>Develop and implement new technology, products and analytical instrumentation</li><li>Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products</li><li>Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products</li><li>Contributes to market share gains through technology improvement</li></ul> Requirements: <ul><li>Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.</li><li>8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating/electrochemical deposition technologies.</li><li>Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.</li><li>Proven experience leading process development, technology innovation, and product qualification in an R&amp;D environment.</li><li>Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.</li><li>Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.</li><li>Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.</li><li>Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.</li><li>Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.</li></ul>

Responsibilities: <ul><li>Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines</li><li>Perform hardware characterization on a variety of difficult systems, within safety guidelines</li><li>Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues</li><li>Generate internal and external documentation for products, presentations and technical reports</li><li>Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision</li><li>Measure film properties and interpret data</li><li>Identify, select and work with vendors and suppliers with limited supervision</li><li>Implement new technology, products and analytical instrumentation</li></ul> Requirements: <ul><li>PhD or Masters Degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field</li><li>Research focus in semiconductor would be an added advantage</li><li>Relevant experiences in semiconductor process development field</li><li>Good communication and interpersonal skills</li><li>Problem-solver attitude with determination and quality-mindset</li></ul>

Responsibilities: <ul><li>Design and development of robust, efficient and real-time algorithms for Analysis and Classification of Medical Images using state-of-art techniques from Image Processing, Pattern Recognition, Computer Vision and Machine Learning.&nbsp;</li><li>Development of innovative solutions for various problems related to Segmentation, Detection, classification and quantification of high resolution (~50K x 50K) coloured images for applications in Digital Pathology.&nbsp;</li><li>Design of efficient models in Machine Learning / Deep Learning for accurate analysis and classification of High resolution Images.&nbsp;</li><li>To learn and update oneself on the emerging trends of technology and apply them in the projects for better results leading to publications and patents.&nbsp;</li><li>Explore new areas of Expert Systems, Cognitive Computing, Artificial Intelligence, Computational Photography etc.&nbsp;</li><li>Define and estimate technical solutions, document technical approach options and recommendations.</li></ul> Requirements: <ul><li>PhD / M. Tech. / M.E. / M.C.A. (preferably from CSE / IT / ECE / EE background)&nbsp;</li><li>B. Tech. / B.E. with exceptional academic/professional background&nbsp;</li><li>Image Processing, Pattern Recognition, Computer Vision&nbsp;</li><li>Machine Learning, Deep Learning&nbsp;</li><li>Experience with Medical Image Processing is an added advantage&nbsp;</li><li>Hands-on experience in developing and implementing Image Processing and Machine Learning algorithms&nbsp;</li><li>Strong programming knowledge in Pytorch, Tensorflow&nbsp;</li><li>Hands-on experience in using Deep Learning frameworks and libraries&nbsp;</li><li>Concepts of parallel architecture on GPU is an added advantage</li><li>Should have 4+ years of experience in Image Processing, Segmentation, Pattern recognition, Computer Vision, Machine Learning, Image Processing, Object Detection, Pytorch, Tensorflow</li></ul>

Responsibilities: <ul><li>Continuously monitor security consoles and dashboards (SIEM, EDR, etc.) for suspicious activity; triage alerts to identify valid security incidents versus false positives and prioritize response based on asset criticality and business risk.</li><li>Investigate suspicious activities and security events, determine the scope and severity of incidents, and gather relevant evidence. Perform root cause analysis to identify attack vectors and affected systems.</li><li>Execute incident response actions end-to-end – including timely containment of threats, eradication of malicious artifacts, and system recovery – following the organization’s incident response plan. Coordinate with IT infrastructure, application owners, and other stakeholders to ensure effective remediation of incidents.</li><li>Proactively hunt for indicators of compromise and hidden threats in logs, network traffic, and endpoint telemetry, even without specific alerts. Use hypothesis-driven techniques and knowledge of attacker TTPs to uncover stealthy or emerging threats that evaded initial detection.</li><li>Continuously tune SIEM/EDR detection rules, thresholds, and SOAR playbooks—automating repetitive response actions to reduce false positives and accelerate containment</li><li>Leverage internal and external threat intelligence sources to enrich analysis and response. Stay updated on new vulnerabilities and adversary tactics; incorporate this knowledge to adjust monitoring rules and incident response strategies. Map observed malicious activities to frameworks like MITRE ATT&amp;CK for reporting and analysis.</li><li>Work closely with global SOC team members and escalate complex incidents to senior analysts or incident response leads when necessary. Collaborate with colleagues in other regions to ensure seamless coverage and knowledge sharing across the security team.</li><li>Document investigation steps, findings, and actions taken for each incident in a clear and concise manner. Prepare incident reports and contribute to post-incident review meetings, highlighting what occurred, how it was resolved, and recommendations to prevent future occurrences.</li><li>Assist in developing and updating incident response playbooks, standard operating procedures, and knowledge base documentation. Provide feedback and suggestions to improve security monitoring tools, analytics content (detection rules), and workflow automation (SOAR playbooks) for greater efficiency and effectiveness.</li><li>Share insights from incidents and trending threats with the broader team to enhance overall awareness. Mentor and guide junior analysts (Tier 1 SOC analysts) by sharing analysis techniques and best practices, elevating the team’s collective skill level.</li></ul> Requirements: <ul><li>Bachelor’s degree in Cybersecurity, Computer Science, Information Systems, or equivalent threat management &amp; incident response experience</li><li>Currently hold cybersecurity certifications such as GCIH, GCFA, GCIA, CEH, others</li><li>With 3 years or more, progressive experience in at least two of the following disciplines:</li><li>Threat Detection &amp; Analysis (leveraging SIEM tools, IDS/IPS, endpoint detection, log analysis, etc.)</li><li>Incident Response &amp; Management (developing response plans, executing playbooks, forensic investigations, root cause analysis)</li><li>Threat Hunting (identifying undetected threats through proactive analysis and hypothesis-driven investigation)</li><li>Cyber Threat Intelligence (gathering and analyzing threat intelligence to inform detection capabilities and preventive measures)</li><li>Network Security (TCP/IP protocols, firewalls, intrusion prevention systems, and network traffic analysis)</li><li>Securing and monitoring operating system and cloud environments (AWS, Azure, GCP), including analyzing cloud service logs and configurations for suspicious activities, and understanding cloud-native security controls and best practices</li><li>Demonstrated ability to:</li><li>Function as a Level 2 or 3 SOC Analyst (analyzing and responding to cybersecurity incidents)</li><li>Preferred Experience:</li><li>Experience with SOAR tools and some proficiency in scripting languages (e.g., Python, PowerShell) to automate repetitive tasks and streamline incident response workflows</li><li>Advanced understanding of emerging threats, zero-day vulnerabilities, and common attack vectors (phishing, malware, ransomware, lateral movement) with the ability to ensure rapid detection and response</li><li>Hands-on experience using SIEM and EDR platforms for centralized log analysis, real-time threat monitoring, and in-depth incident investigations</li><li>In-depth knowledge of the incident response lifecycle</li><li>Proven ability to conduct proactive threat hunting operations, leveraging the MITRE ATT&amp;CK framework to map adversary tactics, techniques, and procedures (TTPs), uncover stealthy threats, and close gaps in detection coverage</li><li>Familiarity with cyber threat intelligence feeds and standards (e.g., STIX, TAXII), incorporating IOCs (Indicators of Compromise) and threat intel data into monitoring and investigations to enrich context and anticipate emerging threats</li><li>Understanding of key security frameworks and regulations (e.g., NIST CSF, ISO 27001, GDPR) and the ability to align threat detection and incident response processes with organizational policies and compliance requirements</li><li>Effective at coordinating with cross-functional teams (IT, DevOps, Business, etc.) during high-impact incidents and translating complex technical findings into clear, actionable insights for executive and non-technical stakeholders</li></ul>

Role Description: <ul><li>Manufacturing engineer is responsible for preparing the process sheets, tool design, establish overall strategic goals &amp; objectives of Manufacturing Engineering in alignment with organizational goals.&nbsp;</li><li>This role will be an individual contributor, which reports to MGR I MFG &amp; Process development engineer.&nbsp;</li></ul> Responsibilities:&nbsp; <ul><li>Analyze new technology and manufacturing processes. Plan and assess the feasibility of new and running projects.</li><li>Ensure good interfaces between Production, Production Planning, Engineering, QC and other functions.</li><li>Plan, design, and monitor manufacturing improvement processes using work study techniques.</li><li>Ensure Day to day accountability &amp; support Production team to achieve targets by process improvements, training, FAI etc.&nbsp;&nbsp;</li><li>Develop new process and create all process documents like PFC, PFMEA, Control plan and SOP by understanding the depth of product requirements.&nbsp;</li><li>Vendor management, Programming, Installation, and commissioning of new Equipment’s and co-ordinate with CFT for complete process validation.&nbsp;</li><li>NPI/NPD projects execution, development and creation of all required FAI documentations and approvals.&nbsp;</li><li>Implement Process monitoring and Control (SPC &amp; SQC), quality traceability Systems using IOT technology.&nbsp;</li><li>Create, Maintain &amp; Control all the programming software’s and production control documents for Auditing.&nbsp;</li><li>Vendor management and subcon handling and support for external projects.&nbsp;</li><li>Support production team to achieve day wise plan.&nbsp;</li><li>Prepare CT &amp; Investment for new product and work to reduce cost by optimization/automating process.&nbsp;</li><li>Responsible for ordering spares and vendor management, down time reduction Capacity &amp; Layout planning/execution for new product line.&nbsp;</li><li>Support manufacturing for Continuous Improvement, quality issues on the shopfloor, new launches, engineering changes.&nbsp;</li><li>Develop and implement systems that optimize all phases of production process. Conduct Root-Cause Analysis.&nbsp;&nbsp;</li><li>Review designs for manufacturing feasibility, suggest changes to the design to ensure product cost effectiveness.&nbsp;</li></ul> Requirements:&nbsp; <ul><li>BE/ B. Tech (Industrial/Electronics, Mechanical).</li><li>Minimum 7 to 9 years of industrial experience with 4 years of project management experience.</li><li>Experience in quality &amp; productivity improvement projects.</li><li>Experience in New product development from scratch i.e. customer order to Production handover.</li></ul>

Responsibilities: <ul><li>With Supervision, review documents/records and provide batch release authorization to 3PL service provider for products manufactured outside of the US.</li><li>Support Drug Product Complaint management; forwarding to respective drug product manufacturing site and coordinate with corporate QA for investigations.</li><li>Support Drug Product Recall/Field alert management.</li><li>Assist with review of Quality Agreements.</li><li>With supervision, review deviations/investigations related to our client frontend products.</li><li>Assist with SOP management for our client US corporate office.</li><li>Support with quality matters for disposition of product returns.</li><li>Assist during FDA inspections and local regulatory inspections at our client US corporate office.</li></ul> Requirements: <ul><li>Excellent verbal and written communication skills are necessary.</li><li>With supervision and direction, effectively prioritizes competing tasks in a fast-paced and dynamic environment.</li><li>Motivated, results driven with attention to detail, accuracy and clarity.</li></ul> Qualifications: <ul><li>BS degree in Pharmacy, Chemistry, Biology or Microbiology is preferred. 1-2 years of Quality Assurance or related pharmaceutical industry experience is preferred.</li><li>Recent graduates will be considered for this role.</li></ul>

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54 wet chemistry techniques Jobs found

Staff/Principal Engineer - CMP Advanced NAND

Manager I - R&D Product Development Engineering

Talent Acquisition Specialist

Technical Director, Advanced Packaging Integration

Process Engineering Manager (Electroplating)

Senior Process Engineer (R&D)

AI / ML Engineer

Senior Analyst, Threat Detection and Response

Senior Manufacturing Engineer

Quality Assurance (QA) Associate

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54 wet chemistry techniques Jobs found

Staff/Principal Engineer - CMP Advanced NAND

Manager I - R&D Product Development Engineering

Talent Acquisition Specialist

Technical Director, Advanced Packaging Integration

Process Engineering Manager (Electroplating)

Senior Process Engineer (R&D)

AI / ML Engineer

Senior Analyst, Threat Detection and Response

Senior Manufacturing Engineer

Quality Assurance (QA) Associate

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